JPH0317376B2 - - Google Patents

Info

Publication number
JPH0317376B2
JPH0317376B2 JP26408186A JP26408186A JPH0317376B2 JP H0317376 B2 JPH0317376 B2 JP H0317376B2 JP 26408186 A JP26408186 A JP 26408186A JP 26408186 A JP26408186 A JP 26408186A JP H0317376 B2 JPH0317376 B2 JP H0317376B2
Authority
JP
Japan
Prior art keywords
discharge
ball
wire
ball diameter
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP26408186A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63119540A (ja
Inventor
Hiroshi Miura
Yutaka Okuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP26408186A priority Critical patent/JPS63119540A/ja
Publication of JPS63119540A publication Critical patent/JPS63119540A/ja
Publication of JPH0317376B2 publication Critical patent/JPH0317376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector

Landscapes

  • Wire Bonding (AREA)
JP26408186A 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置 Granted JPS63119540A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26408186A JPS63119540A (ja) 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26408186A JPS63119540A (ja) 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置

Publications (2)

Publication Number Publication Date
JPS63119540A JPS63119540A (ja) 1988-05-24
JPH0317376B2 true JPH0317376B2 (enrdf_load_stackoverflow) 1991-03-07

Family

ID=17398251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26408186A Granted JPS63119540A (ja) 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置

Country Status (1)

Country Link
JP (1) JPS63119540A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122411A1 (ja) * 2014-02-17 2015-08-20 株式会社新川 放電検査装置、ワイヤボンディング装置、および放電検査方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122411A1 (ja) * 2014-02-17 2015-08-20 株式会社新川 放電検査装置、ワイヤボンディング装置、および放電検査方法
JPWO2015122411A1 (ja) * 2014-02-17 2017-03-30 株式会社新川 放電検査装置、ワイヤボンディング装置、および放電検査方法

Also Published As

Publication number Publication date
JPS63119540A (ja) 1988-05-24

Similar Documents

Publication Publication Date Title
US3973184A (en) Thermocouple circuit detector for simultaneous analog trend recording and analog to digital conversion
JPS60156567A (ja) 高速動作形火花連絡検出器
US9421626B2 (en) Apparatus and method for electrical discharge machining modulation control
JP2568828B2 (ja) 火花点火装置の作用監視方法およびその装置
JPH04346448A (ja) ワイヤボンダ用ボール形成装置
US5058797A (en) Detection method for wire bonding failures
US5212361A (en) Method and apparatus for forming balls at the ends of wires
JPH0317376B2 (enrdf_load_stackoverflow)
US4687897A (en) Flame-off limited circuit for wire bonding ball forming apparatus
JPH0317377B2 (enrdf_load_stackoverflow)
JP2552042B2 (ja) Ｓｃｒの導電測定方法及び測定装置
US6660956B1 (en) Method of and apparatus for monitoring a ball forming process
US5486765A (en) Insulating condition detecting apparatus for a wire-cut electrical discharge machine
JPH08236587A (ja) ワイヤボンディング装置におけるボンディング不着検出方法及びボンディング不着検出装置
JP3253049B2 (ja) ワイヤボンディング装置におけるボール径検出方法及びボール径検出装置
JPH0386427A (ja) ワイヤ放電加工機のワイヤ断線防止装置
JPS6149433A (ja) ワイヤボンデイングにおけるボ−ル形成不良検出方法
JP3908380B2 (ja) ワイヤボンディング装置及び該装置を用いた半導体装置の製造方法
JPS6195777A (ja) 開先検出方法および装置
JP3338848B2 (ja) バンプ形成におけるボンディング不良検出方法およびボンディング装置の制御方法
JPH0695812B2 (ja) 充電装置
JPH08264586A (ja) 半導体デバイスの状態判定方法及び状態判定装置
JP3379904B2 (ja) ワイヤボンディング用のトーチ電源
JP2611891B2 (ja) ワイヤボンディング装置及びその方法
JPS5917977B2 (ja) ワイヤボンダ−におけるボ−ル形成方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees