JPH03173213A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH03173213A JPH03173213A JP31360289A JP31360289A JPH03173213A JP H03173213 A JPH03173213 A JP H03173213A JP 31360289 A JP31360289 A JP 31360289A JP 31360289 A JP31360289 A JP 31360289A JP H03173213 A JPH03173213 A JP H03173213A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- terminal
- substance
- conductive member
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000004695 Polyether sulfone Substances 0.000 abstract description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 abstract description 2
- 125000003118 aryl group Chemical group 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229920006393 polyether sulfone Polymers 0.000 abstract description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 abstract description 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 6
- 238000007789 sealing Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、テレビジョン受像機やビデオテープレコーダ
等に使用されるVIP表面波フィルタやRF表面波発振
子等の表面波装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to surface wave devices such as VIP surface wave filters and RF surface wave oscillators used in television receivers, video tape recorders, and the like.
従来の技術
以下に従来の表面波装置について説明する。第3図は従
来の表面波装置の斜視図で一部を切欠きしたものを示す
ものである。第3図において、ニオブ酸リチウムやタン
タル酸リチウム等の圧電基板の表面にフォトリングラフ
ィにより形成した入力電極対1、出力電極対2及びアー
ス電弛3並びに印刷工法によりエポキシ樹脂等を塗布し
て形成したアブソーバ4からなる圧電体6を金属製のス
テム6にエポキシ樹脂等の接着剤で接着固定し、ステム
6のリード端子7と前記入力電極対1、出力電極対2及
びアース電極4をリード線8で接続し、キャップ9とス
テム6とを溶接する。この圧電体5の入力電極対1に電
気信号を印加し、弾性表面波を発生させ、これを伝播さ
せ出力’iTf;、 W対2より電気信号として取出し
、バンドパス特性をもたせるものである。BACKGROUND OF THE INVENTION A conventional surface acoustic wave device will be described below. FIG. 3 is a perspective view of a conventional surface acoustic wave device, with a portion cut away. In Fig. 3, an input electrode pair 1, an output electrode pair 2, and a ground electrode 3 are formed by photolithography on the surface of a piezoelectric substrate made of lithium niobate, lithium tantalate, etc., and an epoxy resin or the like is applied by a printing method. The piezoelectric body 6 consisting of the formed absorber 4 is adhesively fixed to a metal stem 6 with an adhesive such as epoxy resin, and the lead terminal 7 of the stem 6, the input electrode pair 1, the output electrode pair 2, and the ground electrode 4 are connected as leads. Connect with wire 8 and weld cap 9 and stem 6. An electric signal is applied to the input electrode pair 1 of the piezoelectric body 5 to generate a surface acoustic wave, which is propagated and extracted as an electric signal from the output 'iTf;, W pair 2, giving it bandpass characteristics.
発明が解決しようとする課題
しかしながら上記の従来の構成では、金属製のステム6
と金属製のキャップ9を用いたハウジング構成としてお
り、封正に際して、抵抗加熱による溶接をして外気と遮
断し、微細な電極対を保護している。しかし、溶接の加
熱にムラがあり、更に溶接面にほこりやちシなどのゴミ
をはさむと一層加熱にムラが発生する等、外気との遮断
が完全でないものがあった。なお、キャップ9の内部に
加工時の打ち抜き金属屑やメツキ屑等が残っており、使
用中に電極対上に落下して電極歯間を短絡することも生
じた。更に、ステム6は穴あき金属板にリード端子7を
ガラス材で固定した構造で、高価となるという問題点を
有していた。Problems to be Solved by the Invention However, in the above conventional configuration, the metal stem 6
The housing is constructed using a metal cap 9, and when sealed, it is welded by resistance heating to isolate it from the outside air and protect the minute electrode pair. However, the heating during welding was uneven, and if there was dirt such as dust or dirt caught on the welding surface, the heating became even more uneven, and in some cases the isolation from the outside air was not complete. Note that punched metal scraps, plating scraps, etc. remained inside the cap 9 during processing, and during use, they fell onto the electrode pair and caused a short circuit between the electrode teeth. Furthermore, the stem 6 has a structure in which the lead terminals 7 are fixed to a perforated metal plate using a glass material, which has the problem of being expensive.
本発明は上記従来の問題点を解決するもので、低価格で
高信頼性の表面波装置を提供することを目的とするもの
である。The present invention solves the above-mentioned conventional problems, and aims to provide a low-cost and highly reliable surface acoustic wave device.
課題を解決するための手段
この目的を達成するために本発明の表面波装置は、第1
樹脂を内装材に第2樹脂を外装材にし、第1樹脂の表面
の一部を導電性部材で被覆した構成を有している。Means for Solving the Problems In order to achieve this object, the surface wave device of the present invention has the following features:
It has a structure in which a resin is used as an interior material, a second resin is used as an exterior material, and a part of the surface of the first resin is covered with a conductive member.
作用
この構成によって、内装材に絶縁性を有する樹脂を用い
るので、短絡などの品質問題が皆無となり、外装材にも
樹脂を用いるので、低価格で高信頼性表面波装置とする
ことができる。Function: With this configuration, since an insulating resin is used for the interior material, there are no quality problems such as short circuits, and since resin is also used for the exterior material, a highly reliable surface acoustic wave device can be obtained at a low cost.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例における表面波装置の平面断
面図を示すものであり、第2図はその平面図で、一部を
切欠きしたものを示すものである。FIG. 1 shows a plan sectional view of a surface acoustic wave device according to an embodiment of the present invention, and FIG. 2 shows a partially cutaway plan view thereof.
第1図と第2図において第3図と同一箇所には同一番号
を付しである。第1図において、くし形電極歯からなる
入力電極対1、くし形電極歯からなる出力電極対2、ア
ース電極3および吸収材4を設けた圧電体6をコールド
端子11上に接着し、ホット端子10やコールド端子1
1を圧電体6の入出力電極対1.2およびアース電極3
をリード線8でそれぞれ接続する。上記のようにして構
成した圧電体6全体をpps樹脂(ポリフェニレンサル
ファイド樹脂)、液晶ポリマーの一種である全芳香族系
ポリエステル、もしくはポリエーテルサルフォン等の熱
可塑性樹脂又はエポキシ樹脂の熱硬化樹脂の第1樹脂1
2で被覆する。第1樹脂12の成形硬化条件を調整する
ことにより、成形時の樹脂収縮を利用して入出力電極対
1,2及びアース電極3と第1樹脂12の間に数ミクロ
ン以上のすきまを形成させ、弾性表面波の励振・伝播・
受信を阻害しないようにする。ホット端子1oと第1樹
脂12が接する部分を除いて、第1樹脂12を導電性部
材13によって被覆しコールド端子11と導通させシー
ルド効果を持たせる。導電性部材13には、アルミニウ
ム箔等の金属箔、銀ペースト、銅ペースト等をタンポ印
刷工法で形成した導通膜又は金属メツキ膜を用いる。な
おコールド端子11と導電性部材13の接合を強固にす
るため接合部分に導電性ペーストを塗布硬化することも
ある。端子と第1樹脂12との接触部分における気密性
の劣化を防止するため、エポキシ樹脂等の熱硬化樹脂の
第2樹脂14で封止する。In FIGS. 1 and 2, the same parts as in FIG. 3 are given the same numbers. In FIG. 1, a piezoelectric body 6 provided with an input electrode pair 1 consisting of comb-shaped electrode teeth, an output electrode pair 2 consisting of comb-shaped electrode teeth, a ground electrode 3, and an absorbing material 4 is glued onto a cold terminal 11, and Terminal 10 or cold terminal 1
1 to the input/output electrode pair 1.2 of the piezoelectric body 6 and the ground electrode 3
are connected with lead wires 8. The entire piezoelectric body 6 constructed as described above is made of pps resin (polyphenylene sulfide resin), wholly aromatic polyester which is a type of liquid crystal polymer, thermoplastic resin such as polyether sulfone, or thermosetting resin such as epoxy resin. First resin 1
Cover with 2. By adjusting the molding and curing conditions of the first resin 12, a gap of several microns or more can be formed between the input/output electrode pair 1, 2 and the ground electrode 3 and the first resin 12 by utilizing resin contraction during molding. , excitation/propagation of surface acoustic waves
Avoid interfering with reception. Except for the portion where the hot terminal 1o and the first resin 12 are in contact, the first resin 12 is covered with a conductive member 13 to be electrically connected to the cold terminal 11 and to provide a shielding effect. For the conductive member 13, a conductive film or a metal plating film formed by using a pad printing method using metal foil such as aluminum foil, silver paste, copper paste, etc. is used. Note that in order to strengthen the bond between the cold terminal 11 and the conductive member 13, a conductive paste may be applied and hardened to the bonded portion. In order to prevent deterioration of airtightness at the contact portion between the terminal and the first resin 12, the second resin 14 is sealed with a thermosetting resin such as epoxy resin.
以上のように、第1樹脂12の内装材に絶縁性を有する
樹脂を用いるので金属屑を発生することなく圧電体6を
一様に封止できる。半導体に使用する信頼性の高い熱硬
化性樹脂を第2樹脂14として外装材に用いるので気密
性の良い封止が可能となる。導電性部材によって金属性
キャップと同様のシールド効果も出せる。被覆樹脂は金
属性キャップに比して低価格となる効果も生ずる。As described above, since an insulating resin is used for the interior material of the first resin 12, the piezoelectric body 6 can be uniformly sealed without generating metal debris. Since a highly reliable thermosetting resin used for semiconductors is used as the second resin 14 for the exterior material, it is possible to achieve a highly airtight seal. The conductive member can also provide a shielding effect similar to that of a metal cap. The resin coating also has the effect of being cheaper than a metal cap.
なお、くし形電極対と反射器を組合せて共振特性を有す
る表面波共振器の構成も本発明の表面波装置と同じ構成
にできる。Note that a surface acoustic wave resonator having resonance characteristics by combining a comb-shaped electrode pair and a reflector can also have the same structure as the surface acoustic wave device of the present invention.
発明の効果
以上のように本発明は、圧電体全体を第1樹脂で被覆し
、その一部を除いて導電性部材で導通させたうえ、第2
樹脂で被覆する構成とすることにより、低価格で高信頼
性の優れた表面波装置を実現できるものである。Effects of the Invention As described above, the present invention covers the entire piezoelectric body with the first resin, makes the entire piezoelectric body conductive with a conductive member except for a part, and then covers the piezoelectric body with the second resin.
By using a resin-coated structure, it is possible to realize a low-cost, highly reliable surface acoustic wave device.
【図面の簡単な説明】
第1図は本発明の一実施例における表面波装置の平面断
面図、第2図は一部切欠した平面図、第3図は従来の表
面波装置の一部切欠した斜視図である。
6・・・・・・圧電体、10・・・・・・ホット端子、
11・旧・・コールド端子、12・・・・・・第1樹脂
、13・・・・・・導電件部材、
1
4・・・・・・第2樹脂。
第1図[Brief Description of the Drawings] Fig. 1 is a plan sectional view of a surface wave device according to an embodiment of the present invention, Fig. 2 is a partially cutaway plan view, and Fig. 3 is a partially cutaway view of a conventional surface wave device. FIG. 6...Piezoelectric body, 10...Hot terminal,
11. Old... Cold terminal, 12... First resin, 13... Conductive member, 1 4... Second resin. Figure 1
Claims (1)
極歯からなる電極対を少なくとも1個以上設け、上記の
圧電体全体を第1樹脂で被覆し、次いで第2樹脂で被覆
し、上記圧電体のホット端子周辺部を除いた第1樹脂の
表面を導電性部材で被覆し、導電性部材をコールド端子
周辺部と導通させた表面波装置。At least one electrode pair consisting of comb-shaped electrode teeth for exciting and receiving surface acoustic waves is provided on the piezoelectric body, the piezoelectric body is entirely covered with a first resin, and then covered with a second resin, A surface wave device in which the surface of the first resin except for the area around the hot terminal of the piezoelectric body is covered with a conductive member, and the conductive member is electrically connected to the area around the cold terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31360289A JPH03173213A (en) | 1989-12-01 | 1989-12-01 | Surface acoustic wave device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31360289A JPH03173213A (en) | 1989-12-01 | 1989-12-01 | Surface acoustic wave device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03173213A true JPH03173213A (en) | 1991-07-26 |
Family
ID=18043294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31360289A Pending JPH03173213A (en) | 1989-12-01 | 1989-12-01 | Surface acoustic wave device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03173213A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6528924B1 (en) * | 1996-05-24 | 2003-03-04 | Siemens Aktiengesellschaft | Electronic component, in particular a component operating with surface acoustic waves |
-
1989
- 1989-12-01 JP JP31360289A patent/JPH03173213A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6528924B1 (en) * | 1996-05-24 | 2003-03-04 | Siemens Aktiengesellschaft | Electronic component, in particular a component operating with surface acoustic waves |
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