JPH03171640A - Device for jointing semiconductor chip - Google Patents

Abstract

PURPOSE:To eliminate a heat dissipation due to a collet for pressing use and to shorten the time to be required for a die bonding by a method wherein a subheat source for heating the collect is provided, this subheat source is made to operate in synchronization with the temperature cycle of a main heat source for heating a stem and a semiconductor chip is heated by the collet at the time of jointing of the chip. CONSTITUTION:An electric heater 8 for collet heating use, which is a subheat source, is made to operate in synchronization with the temperature cycle of a heater, which is a main heat source, of a support block 1 and when a chip 3 is pressed at a point C, a collet 6 is heated to 350 deg.C and its vicinity, for example, by the heater 8. For this, the chip 3 results in being heated from its upper part as well by the collet 6, the temperature of the heater of the block 1 suffices at 230 deg.C or thereabouts, which is considerably lower than the conventional one of the heater, and the time to be required for rising the temperature is shortened. Moreover, as the chip 3 is heated by the collet 6, a brazing metal promptly comes to have comparatibility with the joint surfaces of the chip 3 and the stem 2 and the necessary time between a point B, where a heating is stopped, and a point D, where a cooling is started, is significantly shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an improvement in a bonding device for bonding a semiconductor chip to a stem.

〈Technology of Jubai〉 &IA:t Rue. +l◆When manufacturing a nuclear device, a semiconductor chip is placed on the stem and heated, and the semiconductor chip is attached to the stem using a brazing material interposed between the two. A so-called guibonding process is performed to join the parts.

This bonding is carried out as shown in FIG. 4 by supporting the stem 2 with a support block 1 having a built-in Fti heater, placing the semiconductor chip 3 on top of the stem 2, pressing it with a collet 4 for transfer, and placing it on the stem 2. This is performed with the semiconductor chip 3 fixed. FIG. 5 illustrates the temperature cycle at this time, and the vertical axis represents the temperature of the heater of the support block 1. That is, the stem 2 is set on the support block 1 at point A, the chip 3 is transferred from the sheet by the transfer collet 4 and placed at a predetermined position on the stem 2, and then the transfer collet 4 is raised. Start heating at the point. Then, during heating, the transfer fret 4 descends and presses the chip 3, and the heating is stopped at point D when the brazing material has become familiar with the chip 3 and stem 2. For example, nitrogen gas is supplied from the cooling nozzle 5 shown in FIG. At the same time, the tip 4 is raised using a cooling gas such as the like, and the stem 2 is removed to complete the joining. <Problems to be Solved by the Invention> The arrows in Fig. 4 (.) indicate the movement of heat, and in the above-mentioned method of Jubei, heat radiation occurs by the collet 4. Therefore, in order to raise the chip 3 to a predetermined temperature, it is necessary to heat the stem 2 to a higher temperature, which not only increases the time required but also reduces the oxidation of the stem and the lifespan of the heater in the support block 1. There were problems such as the length becoming shorter.
The present invention has focused on these points, and has been made for the purpose of eliminating the heat dissipation by the pressing collet, shortening the time required for bonding, and solving the above-mentioned gambling problem.

<Means for Solving Problem a> In order to achieve the above-mentioned object, this invention provides a collet for suppression and a sub-heat source for heating it, and uses this sub-heat source as a main heat source for heating the stem. It operates in synchronization with the temperature cycle, and the collet heats the semiconductor chip during bonding.

Effect> Since the semiconductor chip is heated from the collet side as well, the temperature of the semiconductor chip rises to a predetermined value without increasing the temperature of the stem, and the bonding is completed in a short time.

Embodiment> Next, an illustrated embodiment will be described. FIG. 1 is a schematic diagram of the main parts of the device, FIG. 2 is a diagram showing a joint part, and diagram @ 3 is a diagram showing a temperature cycle.

In the figure, 1, 2, 3 and 5 are the support block, stem, semiconductor chip and cooling nozzle as in the conventional example,
An electric heater (not shown) is embedded in the support block 1. 6 is a collet for pressing according to the present invention. This collet 6 is attached to a collet head 7 so that it can be moved as appropriate, and is heated by an electric six heater 8 for heating. Note that 9 is a heat insulating material that prevents heat from escaping to the upper side, and 10 is a heat sink that prevents heat from being trapped.

The Gui bonding process is basically carried out with the stem 2 supported by the support block 1 and the semiconductor chip 3 placed on the stem 2 being held down by the fret 6 in the same manner as in the example described in connection with FIG. However, PISa
The difference after the start of heating at point B in the figure is as follows.

That is, the electric heater 8 for heating the collet, which is an auxiliary heat source, is operated in synchronization with the temperature cycle of the heater of the support block 1, which is the main heat source, and when pressing the chip 3 at point C, the collet 6 is activated by the heater. 8 for example 3
It is heated to around 50[''C].For this reason,
The chip 3 is also heated from above by the collet 6, and the heater temperature of the support block 1, which in FIG. A fairly low temperature of around 230 [''C] is sufficient, and the time required to raise the temperature is shortened.Furthermore, since the chip 3 is heated at the fret 6, the brazing material (not shown) is used.
quickly adapts to the joining surface of the tip 3 and the stem 2, and the cooling point is transferred from point A, where the tip 3 is placed on the stem 2, to point D, where heating stops and cooling begins, and then the cooling point is transferred to the tip 3 and the collet 6. , the total time until point E where the stem 2 and the upper end of the support block 1 are cooled and the joining is completed is about 5 minutes longer than the conventional method.
It is shortened to 0[%1. In addition, PjS2 diagram (a)
The arrows in the figure indicate the transfer of heat during heating.

Effects of the Invention> As is clear from the embodiments described above, in the present invention, an auxiliary heat source is provided on the side of the collet that presses the semiconductor chip, and the semiconductor chip is heated by the collet during bonding.

Therefore, there is no need to heat the stem more than necessary, unlike conventional systems that heated the stem only from the support block side.
By shortening the time required to raise the temperature and the time required to blend the brazing filler metal, it is possible to significantly shorten the time required for the Gui bonding process, and it also reduces the oxidation of the stem and the life of the support block heater 77. The l8I problem is also solved.

[Brief explanation of the drawing]

- 4aI side view and front view of the main parts of the embodiment, Figure 2 (a
) and FIG. 2(b) are a side view and front view of the joint, respectively, FIG. 3 is a diagram showing the temperature cycle, and FIG. 4(a) and FIG. The side view and front view of the joint, and Figure tjS5 are diagrams showing the temperature cycle. 1・
...Support block, 2...Stem 3...Semiconductor Chisso 5...Cooling/Zuru 6...Collet for pressing 8...Electric heater

Claims (1)

[Claims] 1. In a semiconductor chip bonding apparatus configured to support a stem with a support block, place a semiconductor chip on the stem, and bond the semiconductor chip to the stem while pressing with a pressing collet, the collet is A semiconductor chip bonding apparatus characterized in that a sub-heat source for heating is provided, the sub-heat source is operated in synchronization with the temperature cycle of a main heat source for heating a stem, and the semiconductor chip is heated by a collet during bonding.