JPH03163812A - Capacitor - Google Patents
CapacitorInfo
- Publication number
- JPH03163812A JPH03163812A JP30400489A JP30400489A JPH03163812A JP H03163812 A JPH03163812 A JP H03163812A JP 30400489 A JP30400489 A JP 30400489A JP 30400489 A JP30400489 A JP 30400489A JP H03163812 A JPH03163812 A JP H03163812A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- semiconductor integrated
- integrated circuit
- power supply
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 239000012212 insulator Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 5
- 235000012489 doughnuts Nutrition 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はコンデンサ、特に半導体集積回路の電源回路の
ノイズ吸収に用いるコンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a capacitor, and particularly to a capacitor used for noise absorption in a power supply circuit of a semiconductor integrated circuit.
一般に半導体集積回路に直流電源を供給する場合、第５
図に示すように、電源に混入しているノイズによる誤動
作を防止するためにノイズ吸収用のコンデンサ７を電源
ライン６の正極・負極間に接続させている。従来、この
電源ノイズ吸収用のコンデンサ７は半導体集積回路４の
外側に半導体集積回路から離して装着されていた。Generally, when supplying DC power to a semiconductor integrated circuit, the fifth
As shown in the figure, a noise absorbing capacitor 7 is connected between the positive and negative electrodes of the power supply line 6 to prevent malfunctions due to noise mixed in the power supply. Conventionally, this power supply noise absorbing capacitor 7 has been mounted outside the semiconductor integrated circuit 4 and separated from the semiconductor integrated circuit.
−Ｅ述の如く、従来は半導体集積凹路の外に更に付加的
に電源ノイズ吸収用としてコンデンサを装着するために
どうしてもその分の面積がとられてしまうという問題点
がある。そこで本発明の目的は以上の欠点を解決し、実
装面積をチップサイズのみにおさえ、実装面積の縮小化
を図ることのできる電源ノイズ吸収用のコンデンサを提
供することにある。As mentioned above, the conventional method has the problem that a capacitor for absorbing power supply noise is additionally installed in addition to the semiconductor integrated concave path, which inevitably takes up area. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a power supply noise absorbing capacitor that can solve the above-mentioned drawbacks and reduce the mounting area by reducing the mounting area only to the chip size.
本発明のコンデンサは、半導体集積回路のパッケージの
底面の大きさと同等またはそれ以下の大きさで、薄板状
とし、かつ、絶縁体を挟んでいる電極の一部が薄板状の
外周部より外側に半導体集積回路の電源端子位置に対応
して引き出されている構或になっている。The capacitor of the present invention has a thin plate shape with a size equal to or smaller than the bottom surface of a semiconductor integrated circuit package, and a part of the electrodes sandwiching an insulator is located outside the outer circumference of the thin plate. The structure is such that it is drawn out in correspondence with the position of the power supply terminal of the semiconductor integrated circuit.
このコンデンサをパッケージ下面に装着することにより
実装面積の縮小を図ることができる。By mounting this capacitor on the bottom surface of the package, the mounting area can be reduced.
以下、本発明の詳細をその実施例につき、図面を参照し
て説明する。第１図は本発明の一実施例のコンデンサの
外観斜視図、第２図は第１図のＡＡ′を通る縦の面での
断面図、第３図はこのコンデンサを半導体集積回路と共
にプリント基板に装着した時の外観斜視図である。−ま
た、第４図は第２図と同様な断面図で多少形体を変えた
ものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the drawings. Fig. 1 is an external perspective view of a capacitor according to an embodiment of the present invention, Fig. 2 is a sectional view taken along a vertical plane passing through AA' in Fig. 1, and Fig. 3 shows this capacitor together with a semiconductor integrated circuit on a printed circuit board. FIG. -Also, FIG. 4 is a sectional view similar to FIG. 2, but with a slightly different shape.
このコンデンサは導体１で成る電極間に絶縁体２を挟ん
だ薄板状の構造になっており、各導体１の一部端部３は
薄板形状の外側に突き出てドーナツ状になっている。こ
のドーナツ状の部分は半導体集積回路の電源ピンとの接
続接点となる。This capacitor has a thin plate-like structure in which an insulator 2 is sandwiched between electrodes made of conductors 1, and a partial end 3 of each conductor 1 protrudes outside the thin plate shape to form a donut shape. This donut-shaped portion serves as a connection point to the power supply pin of the semiconductor integrated circuit.
コンデンサは、第３図に示すように、半導体集積回路４
の下面に装着されて半導体集積回路４と共にプリント基
板１０に取付けられる。この時、半導体集積回路４の電
源ピン４ａはコンデンサ５のドーナツ状の電極部分３の
孔に挿入されてコンデンサ５と接続している。この結果
、コンデンザ５はプリント基板の電源ライン６と接続す
ることになる。The capacitor is connected to the semiconductor integrated circuit 4 as shown in FIG.
The semiconductor integrated circuit 4 is attached to the printed circuit board 10 together with the semiconductor integrated circuit 4. At this time, the power supply pin 4a of the semiconductor integrated circuit 4 is inserted into the hole of the donut-shaped electrode portion 3 of the capacitor 5 and connected to the capacitor 5. As a result, the capacitor 5 is connected to the power line 6 of the printed circuit board.
以上の説明においては例として、ＤＩＲパッケージの下
面にコンデンサを装着して使用するものとしたが、これ
に限られることＣよなく、＝１ンデンサの電極部分を引
き出すことによって、例えばＰＧＡのような他の形体の
パッケージにおいても同様の効果が１：１られ、本発明
の「１的を達成することは明らかである。また、第４図
のようなコンデンサの形体をとることによって容量を増
すことも可能である。In the above explanation, as an example, it is assumed that a capacitor is attached to the bottom surface of the DIR package, but the use is not limited to this. It is clear that similar effects can be achieved in packages of other shapes on a 1:1 basis, achieving the first objective of the present invention.Also, it is possible to increase the capacitance by adopting the shape of the capacitor as shown in FIG. is also possible.
半導体集積回路の電源ピンとの接続接点となるコンデン
サの電極部分は実施例の形状以外の形状、例えば馬蹄形
等どのような形状でもよい。The electrode portion of the capacitor, which serves as a connection point with the power supply pin of the semiconductor integrated circuit, may have any shape other than the shape of the embodiment, such as a horseshoe shape.
要は電源ビンと接触するようになっていればよい。The point is that it just needs to come into contact with the power bottle.
以上の説明で明らがな如く本発明のコンデンザによれば
、実装面積の縮小を図ることができる。As is clear from the above description, according to the capacitor of the present invention, the mounting area can be reduced.
第１図は本発明の一実施例のコンデンサの本体の外観斜
視図、第２図は第１図のＡ−Ａ’を通る縦の面での断面
図、第３図はコンデンサを半導体集積回路と共にプリン
ト基板に装着した外観斜視図、第４図は本発明の別の実
結例の断面図、第５図は従来の技術のコンデンザ使用の
外観斜視図である。
１・・・導体、２・・・絶縁体、３・・・電源ピンとの
接続接点、４・・・半導体集積回路、５・・・コンデン
サ、６・・・電源ライン、７・・・外付けのコンデンサ
。Fig. 1 is an external perspective view of the main body of a capacitor according to an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along the line AA' in Fig. 1, and Fig. 3 shows the capacitor in a semiconductor integrated circuit. FIG. 4 is a sectional view of another embodiment of the present invention, and FIG. 5 is a perspective view of the appearance of a conventional capacitor using a capacitor. 1...Conductor, 2...Insulator, 3...Connection contact with power pin, 4...Semiconductor integrated circuit, 5...Capacitor, 6...Power line, 7...External connection capacitor.
Claims (1)
はそれ以下の大きさで、薄板状とし、かつ、絶縁体を挟
んでいる電極の一部が薄板状の外周部より外側に半導体
集積回路の電源端子位置に対応して引き出されているこ
とを特徴とするコンデンサ。The power supply terminal of the semiconductor integrated circuit is the same size as or smaller than the bottom surface of the semiconductor integrated circuit package, and is in the form of a thin plate, and a part of the electrode sandwiching the insulator is located outside the outer periphery of the thin plate. A capacitor characterized by being drawn out according to its position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30400489A JPH03163812A (en) | 1989-11-21 | 1989-11-21 | Capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30400489A JPH03163812A (en) | 1989-11-21 | 1989-11-21 | Capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03163812A true JPH03163812A (en) | 1991-07-15 |
Family
ID=17927902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30400489A Pending JPH03163812A (en) | 1989-11-21 | 1989-11-21 | Capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03163812A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2724054A1 (en) * | 1994-06-09 | 1996-03-01 | Samsung Electronics Co Ltd | SEMICONDUCTOR PACKAGE MOUNTING STRUCTURE |
| US7061772B2 (en) | 2002-08-05 | 2006-06-13 | Nec Tokin Corporation | Electronic circuit with transmission line type noise filter |
-
1989
- 1989-11-21 JP JP30400489A patent/JPH03163812A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2724054A1 (en) * | 1994-06-09 | 1996-03-01 | Samsung Electronics Co Ltd | SEMICONDUCTOR PACKAGE MOUNTING STRUCTURE |
| US7061772B2 (en) | 2002-08-05 | 2006-06-13 | Nec Tokin Corporation | Electronic circuit with transmission line type noise filter |
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