JPH0316346U - - Google Patents
Info
- Publication number
- JPH0316346U JPH0316346U JP7720889U JP7720889U JPH0316346U JP H0316346 U JPH0316346 U JP H0316346U JP 7720889 U JP7720889 U JP 7720889U JP 7720889 U JP7720889 U JP 7720889U JP H0316346 U JPH0316346 U JP H0316346U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- tip
- mounting part
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7720889U JPH0316346U (th) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7720889U JPH0316346U (th) | 1989-06-29 | 1989-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0316346U true JPH0316346U (th) | 1991-02-19 |
Family
ID=31619380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7720889U Pending JPH0316346U (th) | 1989-06-29 | 1989-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0316346U (th) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014072347A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置の製造方法、および、半導体装置 |
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1989
- 1989-06-29 JP JP7720889U patent/JPH0316346U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014072347A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置の製造方法、および、半導体装置 |