JPH0316335U - - Google Patents
Info
- Publication number
- JPH0316335U JPH0316335U JP1989076959U JP7695989U JPH0316335U JP H0316335 U JPH0316335 U JP H0316335U JP 1989076959 U JP1989076959 U JP 1989076959U JP 7695989 U JP7695989 U JP 7695989U JP H0316335 U JPH0316335 U JP H0316335U
- Authority
- JP
- Japan
- Prior art keywords
- spot light
- wire bonding
- diagram showing
- bonding position
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図はこの考案においてスポツトライト照射
角度が切換わる場合の実施例によるワイヤボンデ
イング装置を示す構成図、第２図は複数のスポト
ライトのＯＮ−ＯＦＦを切換える場合の他の実施
例を示す構成図、第３図は高さ検出機能を備えた
場合の他の実施例を示す図、第４図はスポツトラ
イトが無い場合の従来のワイヤボンデイング装置
を示す図、第５図はスポツロライトがある場合の
従来のワイヤボンデイング装置を示す図である。
図中、１はキヤピラリ、２はワイヤ、３はクラ
ンパ、４はワイヤシユプール、５は顕微鏡、６は
基板、７はチツプ部品、８はボンデイングパツド
、９は加熱台（固定台）、１０はスポツトライト
、１１は高さ検出センンサ、１２はコントローラ
。なお、図中同一符号は同一又は相当部分を示す
。
FIG. 1 is a block diagram showing a wire bonding apparatus according to an embodiment of the present invention in which the spot light irradiation angle is switched, and FIG. 2 is a block diagram showing another embodiment in which a plurality of spot lights are switched between ON and OFF. , Fig. 3 is a diagram showing another embodiment with a height detection function, Fig. 4 is a diagram showing a conventional wire bonding device without a spot light, and Fig. 5 is a diagram showing a conventional wire bonding device with a spot light. FIG. 1 is a diagram showing a conventional wire bonding device. In the figure, 1 is a capillary, 2 is a wire, 3 is a clamper, 4 is a wire pool, 5 is a microscope, 6 is a board, 7 is a chip component, 8 is a bonding pad, 9 is a heating table (fixing table), 10 is a spotlight, 11 is a height detection sensor, and 12 is a controller. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
ライト、このスポツトライトがボンデイング面の
高さが変化しても正確にボンデイング位置を示す
機構を備えたことを特徴とするワイヤボンデイン
グ装置。 A wire bonding device comprising a spot light for indicating the wire bonding position, and a mechanism for the spot light to accurately indicate the bonding position even if the height of the bonding surface changes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076959U JPH0316335U (en) | 1989-06-28 | 1989-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076959U JPH0316335U (en) | 1989-06-28 | 1989-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316335U true JPH0316335U (en) | 1991-02-19 |
Family
ID=31618898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989076959U Pending JPH0316335U (en) | 1989-06-28 | 1989-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316335U (en) |
-
1989
- 1989-06-28 JP JP1989076959U patent/JPH0316335U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0316335U (en) | ||
| JPS5842706U (en) | Measuring device | |
| JPS6117741U (en) | Illumination device for pattern position recognition | |
| JPS62116600U (en) | ||
| JP2504538Y2 (en) | LED array device | |
| JPH01113338U (en) | ||
| JPS6063937U (en) | Lighting device for semiconductor element bonder | |
| JPH01113336U (en) | ||
| JPH01113339U (en) | ||
| JPH0247039U (en) | ||
| JPS6194804U (en) | ||
| JPH01109390U (en) | ||
| JPS609258U (en) | Bonding condition control device | |
| JPS6144840U (en) | IC lead bend detection and selection device | |
| JPH0212719U (en) | ||
| JPS5971139U (en) | Pyroelectric infrared detector | |
| JPS62140441U (en) | ||
| JPH0365242U (en) | ||
| JPS59157792U (en) | Laser processing equipment | |
| JPH044780U (en) | ||
| JPH0172973U (en) | ||
| JPS58187710U (en) | Printing plate pattern area ratio measuring device | |
| JPH01174944U (en) | ||
| JPS6260037U (en) | ||
| JPH01146416U (en) |