JPS6063937U - Lighting device for semiconductor element bonder - Google Patents

Lighting device for semiconductor element bonder

Info

Publication number
JPS6063937U
JPS6063937U JP1983155175U JP15517583U JPS6063937U JP S6063937 U JPS6063937 U JP S6063937U JP 1983155175 U JP1983155175 U JP 1983155175U JP 15517583 U JP15517583 U JP 15517583U JP S6063937 U JPS6063937 U JP S6063937U
Authority
JP
Japan
Prior art keywords
semiconductor element
bonder
lighting device
light source
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983155175U
Other languages
Japanese (ja)
Inventor
長谷川　秋男
泉　正則
Original Assignee
東京測範株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京測範株式会社 filed Critical 東京測範株式会社
Priority to JP1983155175U priority Critical patent/JPS6063937U/en
Publication of JPS6063937U publication Critical patent/JPS6063937U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の半導体装置ボンダー用照明装置を示す斜
視図、第２図は本考案の実施例を示す斜視図、第３図は
、リードワイヤーボンディング前の半導体素子の一例を
示す斜視図である。 ４・・・・・・半導体素子、５・・・・・・顕微鏡、６
・曲・セラミック等からなる粗面反射体、８・・・・・
・光源。FIG. 1 is a perspective view showing a conventional illumination device for a semiconductor device bonder, FIG. 2 is a perspective view showing an embodiment of the present invention, and FIG. 3 is a perspective view showing an example of a semiconductor element before lead wire bonding. be. 4...Semiconductor element, 5...Microscope, 6
・Rough surface reflector made of curved ceramic, etc., 8...
·light source.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子面上に光を照射して半導体素子を顕微鏡で観
察する照明装置において光源からの光を白色セラミック
等からなる粗面反射体に照射し、当該粗面反射体の反射
光を半導体素子に当てるように上記光源、粗面反射体お
よび半導体素子を配置するようにした半導体素子ボンダ
ー用照明装置。。In an illumination device that irradiates light onto the surface of a semiconductor element and observes the semiconductor element with a microscope, light from a light source is irradiated onto a rough reflector made of white ceramic or the like, and the reflected light from the rough reflector is directed toward the semiconductor element. A lighting device for a semiconductor device bonder, wherein the light source, the rough reflector, and the semiconductor device are arranged so as to illuminate the light source. .
JP1983155175U 1983-10-07 1983-10-07 Lighting device for semiconductor element bonder Pending JPS6063937U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983155175U JPS6063937U (en) 1983-10-07 1983-10-07 Lighting device for semiconductor element bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983155175U JPS6063937U (en) 1983-10-07 1983-10-07 Lighting device for semiconductor element bonder

Publications (1)

Publication Number Publication Date
JPS6063937U true JPS6063937U (en) 1985-05-07

Family

ID=30342793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983155175U Pending JPS6063937U (en) 1983-10-07 1983-10-07 Lighting device for semiconductor element bonder

Country Status (1)

Country Link
JP (1) JPS6063937U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021226A (en) * 2011-07-13 2013-01-31 Hitachi High-Tech Instruments Co Ltd Die bonder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021226A (en) * 2011-07-13 2013-01-31 Hitachi High-Tech Instruments Co Ltd Die bonder
US9099524B2 (en) 2011-07-13 2015-08-04 Fasford Technology Co., Ltd. Die bonder

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