JPH03160795A - Automatic mounting apparatus for electronic component - Google Patents

Abstract

PURPOSE:To store production state data during a mounting operation in a plurality of banks under each predetermined condition and to improve operability by providing the plurality of banks for storing the data during the mounting operation under each condition. CONSTITUTION:An interface 28 has a rotary board 1, a component presence/ absence sensor 5, a positioning unit 8, a component attitude sensor 9, an XY table 13, a component supply base 16, etc., connected thereto. These control elements are programcontrolled by a CPU 29 as a controller. A memory 30 stores data regarding a mounting operation, and also stores sensed data by respective sensing means. An interface 31 has a computer body 32, a start switch 33, a monitor television 36, a timepiece 37 with a calendar connected thereto. A condition setter 34 designates which bank 35 to store production state data out of daily, weekly, monthly banks 35. Thus, a worker can arbitrarily form various production state data to improve its operability.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an automatic electronic component mounting device for mounting chip-shaped electronic components onto a printed circuit board. (Example) Conventional technology In the past, only one location was provided in the storage device to store abnormal data during the mounting operation. (c) Problems to be solved by the invention It was inconvenient to use because it was only possible to create abnormality occurrence status data under certain conditions (for example, abnormality occurrence rate during a day). In an automatic electronic component mounting apparatus for mounting electronic components on top, a plurality of banks are provided to store production status data during mounting operation for each condition.

(*) Effect Due to the above configuration, production status data during the mounting operation is stored in a plurality of banks for each predetermined condition.

(F) Example Hereinafter, an example of the present invention will be described in detail based on the drawings. A plurality of suction heads (4) each having a plurality of suction nozzles (3) for picking up, adsorbing and transporting chip components (W) from a component supply device (2) are provided. (5) refers to the chip components (W). This is a component presence detection device that detects whether or not (W) is suctioned and held by the suction nozzle (3), and detects whether the light emitted from the light emitting element (6>) is received by the light receiving element (7). In other words, if the light emitted from the light emitting element (6) is blocked by the chip component (W) and is not received by the light receiving element (7), one component is present, and if the light is received, there is "no component". .

(8) When the suction nozzle (3) suctions the chip component (W), the center of the chip component (W) and the nozzle (3) are aligned, and the mounting direction of the printed circuit board (P) is adjusted. This is a positioning device that rotates a chip component m by rotating a chip component m, and a plurality of positioning units are provided so as to correspond to the size of the component.

(9) is a component posture detection device that detects chip components (w) in poor suction postures, such as those that are suctioned in a standing position (hereinafter referred to as "standing dip") by the suction nozzle (3). When the chip component (K) is normally attracted, the light emitting element (10) and the light receiving element (L) are placed in the lower position of the suction nozzle (3) where the chip component (W) does not block the light.
By installing 1〉 in pairs, the light can be directed to the chip components (
If it is interrupted by ga〉, it will be detected as an abnormal posture.

(13> is an XY table on which the printed circuit board (P) is placed, and is moved in XY by an X-axis servo motor (14>) and a Y-axis servo motor (15).

<16) is a component supply stand on which a large number of the above-mentioned component supply devices (2) are placed, and the ball screw (1) is driven by a drive motor (17).
8), it is guided by the guide rod (l9) and moved horizontally.

(20) is the chip component (W) that became the above-mentioned vertical chip.
This is a parts ejecting means for ejecting.

(21) is a nozzle selection device that selects a desired suction nozzle (3) according to the chip component (W) to be suctioned next time, and the device meshes with a gear (not shown) provided on the outer diameter part of the suction head section <4>. After that, the suction part (4) is selectively rotated by the rotation of a gear rotated by a drive motor (not shown). <22) (23) is the xY table 4 (13) (7)X
Sensors (24) and (25) are sensors for detecting overrun movement in the Y direction.

(26) and (27) are sensors for detecting the movement of the first bar run of the parts supply table (16).

(28> is an interface, which includes the rotary disk (1), component presence/absence detection device e (5), positioning device (8), component attitude detection device e (9), XY table (13), FM product supply stand (16) ), etc., and each of these control elements is program-controlled by a CPU (29) serving as a control device.

(30> is a memory that stores various data related to the mounting operation, and also stores detection data from each detection means.

(31) is the interface, and the computer body (31) is the interface.
2>, start switch (33>, monitor TV (3)
6> and a calendar clock (37>) are connected.

(34) (34) (34) is a condition setting that specifies which bank (35) (35) (35) of the daily, weekly, and monthly banks (35) (35) (35) to store the production status data. It is a device.

Of course, it is also possible to store it in all banks (35) (35) (35). (38) (39) (40) (41) are management data provided in the respective banks (35) (35) (35);
This is a counter that counts abnormal data, suction error data for each component supply device, and suction error data for each suction nozzle.

The operation will be explained below.

A desired component supply device (2) is selected by horizontal movement of the component supply table (16), and is placed on standby at the suction position of the suction nozzle (3). Then, the suction nozzle (3) is moved downward by a vertical movement mechanism (not shown), comes into contact with the chip component (W), suctions the chip component (W), and then is moved upward to hold it in a predetermined position. The suction nozzle (3) that adsorbs the chip component (W) by the rotation of the rotary disk (1) passes between the light emitting element (6>) and the light receiving element (7) of the component presence/absence detection device (5>).At this time, If the chip part (W) is sucked by the suction nozzle (3>),
The light emitted from the light emitting element <6> is the chip component (W)
The light emitted from the light emitting element (6) is blocked by the light emitting element (6), and the device (5) sends a signal indicating "parts present" to the CPU (29). is received by the light-receiving element (7), and therefore the device (5)
) sends a ``no parts'' signal to the CPU (29). Here, the subsequent operation in the case where one component is present will be explained.

The chip component (W>) sucked by the suction nostle (3) is positioned by the positioning device (8).

The position of the positioned chip group product (KA) is detected by the next component position detection device (9), and the suction nozzle (3) is
), the CPU (2) confirms that it is normal.
For example, the chip component (W) is sent to the suction nozzle (3).
), a signal indicating "abnormality" is sent to the CPU (29).

Here, the subsequent operation in the case of 'normal' will be explained.

The chip component (W) suctioned by the suction nozzle (3>) is placed on the printed circuit board (P) on the XY table (13), which is positioned and moved in the X-axis direction and Y-axis direction by the rotation of the rotary disk (1>). Suction nozzle (3) located above the upper mounting position
is placed on the printed circuit board (P) by the downward movement of.

Further, in the component presence/absence detection device (5>), the suction nozzle (3) detected as having no component is controlled not to perform any subsequent positioning operation, component orientation detection operation, or mounting operation.

Furthermore, after the component presence/absence detection device <5) detected that 1 component was present, the positioning device (8) positioned the chip component (W), and then the component orientation detection device (9) detected 1 abnormality. The suction nozzle (3) for which this is detected is also controlled not to perform the subsequent four mounting operations.

In addition, chip parts (W) that have been determined not to be installed
is discharged by the parts discharge means (20). Next, a desired suction nozzle (3>) is selected by the nozzle selection device (21) according to the chip component (W) to be suctioned the next time, and the chip component (SJ) is suctioned.

Thereafter, the same operation continues, and chip parts (W) are mounted on the printed circuit board (P). Here, the operation of creating one day's production status data during the mounting operation will be explained. First, the worker sets the daily bank (35) to the condition setting device (
34>.

Then, the mounting operation proceeds sequentially according to the steps of the mounting operation, and when the CPU (29) detects that the operation from step to one board (P) has been completed, the CPU (29) sets the number of processed boards in the management data counter 38) to r1. ”
The total number of parts handled is equal to the number of chip parts (W) handled.
When it receives a signal saying "no parts" from the parts presence device (5), it counts the total number of parts missing by "1", and when it receives a signal saying "1 abnormality" from the parts position detection device (9), it counts the standing chip. Count the total number to 11. These data are the 6th
It is stored in the management data as shown in the figure.

Furthermore, the data described below is stored in the abnormal data shown in FIG. That is, the counter (39> is, for example,
When the Y table (13) moves xY, the sensor (22) (
23) (24) and (25) detect the first bar run and count the number of abnormal stops, and when the parts supply table (16) moves horizontally, the sensors (26) and (27) detect the first bar run and stop abnormally. Count the number of times.

Figure 8 shows data regarding suction errors for each component supply device.
The counter (40) counts the total number of parts handled, the total number of no parts, the total number of standing chips, and the total number of suction errors in the same component supply device (2). Figure 9 shows data regarding suction errors for each suction nozzle, and a counter (41) counts the total number of parts handled, total number of parts not handled, total number of standing chips, and total number of suction errors for the same suction nozzle (3). Then, when the calendar clock (37) reaches the specified time, the CPU (29) clears each of the above-mentioned data as shown in FIG.

Alternatively, banks (35) may be provided for each type of printed circuit board (P) to store each data.Here,
As shown in Figure 12, in an example of creating production status data for two types of printed circuit boards (P), the bank (35
) (35) stores management data for each printed circuit board (P), abnormality data, suction error data for each component supply device, and suction error data for each suction nozzle.

Furthermore, as shown in FIG. 13, four banks (35) (3
5) (35) By providing (35), the above 2.
You can set various times each day to clear the clear conditions for each type of printed circuit board (P), and whether the operator clears them manually.Of course, you can set up any number of banks (35), including seven If this is done, data can be stored for all examples of this embodiment.

(g) Effects of the invention Workers can now create various production status data at will, making it easier to use.

[Brief explanation of the drawing]

Figures 1 and 2 are a configuration circuit diagram and a plan view of an automatic electronic component sorting device, Figure 3 is a diagram showing a component no-detection device, and Figures 4 and 5 are a diagram of a component attitude detection device. The operation diagrams, Figures 6 to 9, show the management data, abnormality data, and suction error data for each component supply device displayed on the monitor TV screen.
Figures 10 and 11 are flowcharts for creating production status data;
The figure and FIG. 13 are diagrams showing other embodiments. (34)...Condition setting device, (35)...Bank, (38)(39)(40)(41)...Counter.

Claims (1)

[Claims] (1) An electronic component automatic mounting device for mounting chip-shaped electronic components onto a printed circuit board, characterized in that a plurality of banks are provided for storing production status data during mounting operation for each condition. Automatic loading device.