JPH03157832A - Adhering device for optical disk parts - Google Patents

Abstract

PURPOSE:To prevent misalignment by providing a lower frame with a disk substrate holding mechanism which can hold a disk substrate in a prescribed position and sticking an alignment shaft to the center of the lower frame and providing the disk substrate holding mechanism with plural pairs of holding levers and springs. CONSTITUTION:A device consists of an upper frame 22 and a lower frame 24, and the lower frame is provided with a disk substrate holding mechanism 31 which can hold a disk substrate 28 at a prescribed distance from the upper face of the lower frame in parallel with this upper face. An alignment shaft 52 which is fitted to respective center holes of a disk substrate 29 set on the upper face of the lower frame and the disk substrate 28 held by the disk substrate holding mechanism 31 to align these disk substrates 28 and 29 is stuck to the center of the lower frame. The disk substrate holding mechanism 31 consists of plural pairs of holding levers 32 and springs 34, and holding levers 32 can be shaked with pins 36 fixed to the lower frame as fulcrums. Thus, the disk substrate on the disk substrate holding mechanism and the disk substrate on the lower frame are surely and easily aligned.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a gluing device for optical disc parts.

(B) Conventional Technology An optical disk is constructed by bonding two disk substrates each having a recording layer on one side. For this purpose, for example, as shown in Japanese Patent Application Laid-Open No. 61-80534, bonding is performed by sandwiching an adhesive between the bonding portions of two disk substrates and pressing both disk substrates to a pressure n4.

(c) Problems to be Solved by the Invention However, in the conventional optical disc manufacturing method as described above, it is necessary to apply an adhesive to the disc substrate, which is a laborious process, and it is difficult to form a uniform adhesive film. This was difficult, and there were cases where air bubbles remained in the joint. Furthermore, when the disk substrate is pressurized, the adhesive oozes out and causes firmness, which requires deburring work.

In connection with the above-mentioned problems, Japanese Patent Application Laid-Open No. 6150232 discloses a technique for constructing an optical disk by attaching a plastic film coated with an adhesive to a transparent substrate. However, this method is for single-sided recording optical discs, and cannot be applied to joining two disc substrates together. Furthermore, in this case, there is no need to align the two disk substrates, so of course no alignment technique is disclosed at all.

The present invention aims to solve the above problems.

(d) Means for Solving the Problems The optical disk component bonding device according to the present invention is a double-sided adhesive bonding device for bonding optical disk components to the side on which the recording layer is formed of a disk substrate having a recording layer formed on one side, and to another optical disk. There is a device for peeling off and pasting the release film on the other side of the sheet, and it consists of an upper mold (22) and a 1,000° mold (24), and the lower mold has a disk substrate (28) attached to the upper surface of the lower mold. A disk substrate holding mechanism (31) that can hold the disk at a predetermined distance from the center is provided in parallel with the disk substrate holding mechanism (31). The centering shaft (
52) is fixed, and the disk board holding mechanism includes multiple sets of holding levers (32) and springs (
34), the holding lever can swing around a pin (36) fixed to the lower die, and the spring applies a force to the holding lever to move its tip side upward. The holding lever is configured so that when only the force from the spring is applied, it can be stopped with the tip of the lever located above the two surfaces of the lower mold. The disk substrate can be held by the portion (32a), and the holding lever is configured to be pushed and swung by this when the upper mold is lowered to release the disk substrate.

Note that the symbols in parentheses indicate corresponding members in the embodiments described later.

(e) Function: By using the optical disk component bonding device according to the present invention, one of the disk substrates can be held in the disk substrate holding mechanism of the lower die, and moreover, the disk substrate holding mechanism of the lower die can be held by the centering shaft. It is possible to reliably and easily align the lower mold with the upper disk substrate. One disk substrate is held by the disk substrate holding mechanism, and the other disk substrate is placed on the bottom surface of the mold. A rough double-sided adhesive sheet was attached to the other disk substrate, and the release film on the top surface was peeled off. In this state, the two disk substrates can be bonded together by pressing the 1-mold and the lower mold. Note that the upper mold is pressurized in a vacuum chamber.

(F) Embodiment The optical disk component bonding apparatus 12 according to the present invention is used in combination with a vacuum press apparatus IO, as shown in FIG. The vacuum press device 10 includes a fixed table 14 and a pressure plate 1.
6. It has a pressurizing cylinder 18, a vacuum chamber 20, etc.
Adhesive device 1 for optical disc components installed in a vacuum chamber 20
Pressure force can be applied to 2 from the pressure plate 16.

The inside of the vacuum chamber 20 is brought into a vacuum state by a vacuum pump (not shown).

An optical disc component bonding device 12 is shown in FIGS. 1 and 2.

The bonding device 12 for optical disc parts is of type 7 22 and g)Ii.
lI24 is connected to O17, and both are connected to pin 26 and hole 2.
”/ Hinge connected by 2 3, ta/,・1
．．・Hole 27 &t is an elongated hole in the J direction.

(7) Holding gears 32 and springs 34, which constitute the disk bale plate holding mechanism 31, are arranged at three positions around the lA circumference. A halting lever 32 is supported by a dowel 36 on the top type 24 for one swing function.
The holding portion 32a and the driven portion 32b are provided on the distal end side. The spring 34 is arranged on the holding lever 32 so as to be rotated about the pin 36 by one angle.

The holding lever 32 is stopped by the spring 34,
b is in a horizontal state, and the holding portion 32a is in an inclined state.

The mold 24 has three holes 48 as shown in FIG. 3, and a spring 50 is disposed within the holes 48. Further, the T'-shaped 24 has a pin 54 mounted vertically 4-J as shown in FIG. and
The pin 54 can fit into the hole 55. 2. Next, we will explain the operation 4 of the embodiment of 4'. 2. First, the outside of the vacuum chamber 20 is , tj, as shown in FIG. A double-sided adhesive sheet 1-44 is pasted on one side of the disk substrate 29. In the state shown in Figure 5, the double-sided name sheet 1-44
The release film on the -I side is invaginated. Next, another disk substrate 28 is installed in the disk substrate holding mechanism 311-. That is, the outer diameter portion of the disk substrate 28 is supported by the holding portion 32a of the halting lever 32. Since the disk substrates 28 and 29 have a center hole that fits into the centering shaft 52, the centering of both disks 28 and 29 can be adjusted by the hole. In this state 1. , QQ 22 is closed and placed in the vacuum chamber 20 of the vacuum press device 10.

In addition, in this state +J! A spring 50 that balances the weight of the upper mold 22 acts on J22, and the upper mold 22 is lifted up by one horn, so that there is a gap between the disk, the substrate 28, and the disk substrate 29, as shown in FIG. Gap A in a small state
or maintained.

As shown in FIG. 7, the structure of the vacuum press device 10 is
After installing the optical disk component bonding device 12 in the I chamber 20, the vacuum chamber 20 is evacuated to a temperature of 2-3/100 torr (Torr).
rr) vacuum state.

Then, the pressure plate 16 is lowered. The pressure plate 16 is the upper mold 2
2 and lower it. When the upper mold 22 is lowered 1.--, the holding lever 32 swings about the pin 36. Therefore, the holding state of the disk forest board 28 is released, and the disk substrate 28 falls onto the disk substrate 29F. Next, the pressure plate 16 is further lowered by one step to apply pressure between the disk substrate 28 and the disk substrate 29 as shown in FIG. By kneading, both names are glued together. 1
As described above, since the bonding is performed within the vacuum chamber 20, no air bubbles remain at the joint between the disk substrates 28 and 29. Next, the disc component bonding device 12 is taken out from the vacuum chamber 20, the upper mold 22 is opened, and the
7- Two disk substrates 28 and 29 (
Once the optical disc is removed, the adhesion of one optical disc is completed. Although the toe type 22 is hinged to the dot type 24, it is also possible to attach the -1 type to the machining board instead of the go.

(G) Effects of the Invention As explained above, according to the present invention, two disc plates can be made using a double-sided adhesive sheet! 1; Since the adhesive is bonded to the adhesive, no air bubbles remain in the contact area, and a high-quality optical disc can be obtained. Since the adhesive is uniformly applied to the double-sided adhesive sheet, problems such as adhesive extrusion and flaking do not occur, and post-treatment at least 1 is not necessary. Furthermore, since the disk substrate is held until the pressing force from the pressing plate is applied, it is possible to reliably and safely manufacture an optical disk without a first layer without requiring any special operations.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of the gluing apparatus for optical disc parts according to the present invention (a 1-m cross-section taken along the line T in Fig. 2), Fig. 2 is a plan view of the gluing apparatus for optical disc parts, and Fig. 2 is a cross-sectional view taken along line III-Llf in Figure 2, and Figure 4 is a cross-sectional view along line I in Figure 2.
5 is a cross-sectional view taken along the line V-IV, FIG. 5 is a diagram showing a state in which a disc substrate is installed in an adhesive device for optical disc components, and FIG. 6 is a diagram showing a state in which pressure is applied to a disc substrate by an adhesive device for optical disc components. , FIG. 7 is a diagram showing a state in which an optical disk component bonding device is installed in a vacuum press device. DESCRIPTION OF SYMBOLS 10... Vacuum press device, 12... Optical disc component bonding device, 16... Pressure plate, 20... Vacuum chamber, 2
2... Upper mold, 24... Lower mold, 26... Pin, 28
... Disk board, 29... Disc board, 31.
... Disk board holding mechanism, 32... Holding lever 34... Spring, 44... Double-sided adhesive sheet, 50... Spring, 52... Centering shaft. 1 rs

Claims (1)

[Claims] Peel off the release film on the other side of a double-sided adhesive sheet attached to another optical disk and attach it to the side on which the recording layer is formed of a disk substrate with a recording layer formed on one side. In an optical disk component bonding device, the optical disk component bonding device is composed of an upper mold and a lower mold, and the lower mold has a disk substrate holding mechanism that can hold the disk substrate parallel to the upper surface of the lower mold and at a predetermined distance from the upper surface of the lower mold. In addition, in the center of the lower die, there is an alignment shaft that aligns the disk substrate installed on the upper surface of the lower die and the disk substrate held by the disk substrate holding mechanism by fitting into these center holes. is fixed, and the disk substrate holding mechanism is composed of multiple sets of holding levers and springs, and the holding lever can swing around a pin fixed to the lower mold as a fulcrum.
The spring exerted a force on the holding lever to move the tip of the lever upward, and when only the force from the spring was acting on the holding lever, the tip of the lever was located above the top surface of the lower mold. The holding lever can hold the disk substrate by its tip, and when the upper die is lowered, the holding lever is pushed and swung to release the disk substrate. An optical disk component bonding device configured as follows.