JPH031541U - - Google Patents
Info
- Publication number
- JPH031541U JPH031541U JP1989060433U JP6043389U JPH031541U JP H031541 U JPH031541 U JP H031541U JP 1989060433 U JP1989060433 U JP 1989060433U JP 6043389 U JP6043389 U JP 6043389U JP H031541 U JPH031541 U JP H031541U
- Authority
- JP
- Japan
- Prior art keywords
- coupler
- refrigerant
- drain
- flow path
- refrigerant flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989060433U JPH0720922Y2 (ja) | 1989-05-26 | 1989-05-26 | 電子基板の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989060433U JPH0720922Y2 (ja) | 1989-05-26 | 1989-05-26 | 電子基板の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031541U true JPH031541U (cg-RX-API-DMAC7.html) | 1991-01-09 |
| JPH0720922Y2 JPH0720922Y2 (ja) | 1995-05-15 |
Family
ID=31587792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989060433U Expired - Lifetime JPH0720922Y2 (ja) | 1989-05-26 | 1989-05-26 | 電子基板の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720922Y2 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015082565A (ja) * | 2013-10-22 | 2015-04-27 | 富士通株式会社 | 電子機器 |
-
1989
- 1989-05-26 JP JP1989060433U patent/JPH0720922Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015082565A (ja) * | 2013-10-22 | 2015-04-27 | 富士通株式会社 | 電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720922Y2 (ja) | 1995-05-15 |