JPH031541U - - Google Patents

Info

Publication number
JPH031541U
JPH031541U JP1989060433U JP6043389U JPH031541U JP H031541 U JPH031541 U JP H031541U JP 1989060433 U JP1989060433 U JP 1989060433U JP 6043389 U JP6043389 U JP 6043389U JP H031541 U JPH031541 U JP H031541U
Authority
JP
Japan
Prior art keywords
coupler
refrigerant
drain
flow path
refrigerant flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989060433U
Other languages
English (en)
Other versions
JPH0720922Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989060433U priority Critical patent/JPH0720922Y2/ja
Publication of JPH031541U publication Critical patent/JPH031541U/ja
Application granted granted Critical
Publication of JPH0720922Y2 publication Critical patent/JPH0720922Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案による電子基板の冷却構造を示
すもので、冷却運転時の状態を示す断面図、第２
図は装置補修時のクーリングプレートを示す断面
図、第３図は冷媒の排出状態を説明するクーリン
グプレートの斜視図、第４図は従来の電子基板の
冷却構造を示す断面図である。 図において、１０は電子基板、１１は半導体素
子、１２は冷媒流路、１３はクーリングプレート
、１６は冷媒入口、１７は冷媒出口、１８はドレ
インカプラ、１９は雄カプラ、２０は圧力調整弁
、２４は雌カプラ、２５はドレインホースである
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電子基板１０上に搭載された半導体素子１１に
    対して、冷媒を供給する冷媒流路１２と、この冷
    媒流路１２の端部に設置されるドレインカプラ１
    ８と、冷却運転時、冷媒流路１２内の冷媒圧を一
    定に維持する圧力調整弁２０を備えるとともに、
    上記ドレインカプラ１８に取り付けられる雄カプ
    ラ１９と、装着補修時、冷媒流路１２内の冷媒を
    外部に排出するドレインホース２５を備え、上記
    ドレインカプラ１８に取り付けられる雌カプラ２
    ４とを具備し、上記ドレインカプラ１８に対して
    、雄カプラ１９あるいは雌カプラ２４を選択的に
    併用したことを特徴とする電子基板の冷却構造。
JP1989060433U 1989-05-26 1989-05-26 電子基板の冷却構造 Expired - Lifetime JPH0720922Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Publications (2)

Publication Number Publication Date
JPH031541U true JPH031541U (ja) 1991-01-09
JPH0720922Y2 JPH0720922Y2 (ja) 1995-05-15

Family

ID=31587792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989060433U Expired - Lifetime JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Country Status (1)

Country Link
JP (1) JPH0720922Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015082565A (ja) * 2013-10-22 2015-04-27 富士通株式会社 電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015082565A (ja) * 2013-10-22 2015-04-27 富士通株式会社 電子機器

Also Published As

Publication number Publication date
JPH0720922Y2 (ja) 1995-05-15

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