JPH03153318A - Manufacture of laminated board - Google Patents

Manufacture of laminated board

Info

Publication number
JPH03153318A
JPH03153318A JP1291085A JP29108589A JPH03153318A JP H03153318 A JPH03153318 A JP H03153318A JP 1291085 A JP1291085 A JP 1291085A JP 29108589 A JP29108589 A JP 29108589A JP H03153318 A JPH03153318 A JP H03153318A
Authority
JP
Japan
Prior art keywords
resin
laminate
heating
temperature
laminated body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1291085A
Other languages
Japanese (ja)
Inventor
Riichi Otake
利一 大竹
Motoharu Hiruta
蛭田 元治
Hitoshi Kato
均 加藤
Munekazu Hayashi
宗和 林
Satoshi Demura
智 出村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP1291085A priority Critical patent/JPH03153318A/en
Publication of JPH03153318A publication Critical patent/JPH03153318A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To prevent generation of a void due to an insufficient outflow of resin by fixing a board thickness by preventing an excessive outflow of the precured resin, by a method wherein the precure of impregnated resin of both side edge parts of a laminated body with preheating is advanced more than that of the other part. CONSTITUTION:A resin-impregnated base is manufactured as a continued long-sized matter, a plurality of sheets of which are piled upon one another, resin is regulated into a fixed resin content at need and then a metallic foil or a cover film and one side or both the sides of the base are stuck together. Although this laminated body 6 is preheated and the impregnated resin is precured, for example, a heating part corresponding to an axial direction of the laminated body 6 is divided into at least three heating zones as this preheating furnace, temperature of the respective heating zones can be controlled individually and both the end heating zones are set up at a higher temperature than that of the central heating zone. Then an extent of precure of both side fringe parts of widthwise direction of the laminated body 6 is advanced more than that of the other part. The preheated laminated body 6 finally cured by a continuous heating and pressurizing machine such as a double belt press, becomes a laminated plate and post-cured at need.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、特に電気、電子機器等に用いられるプリント
基板用等に好適な積層板の製法を改善したものに関する
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improved method of manufacturing a laminated board suitable for printed circuit boards used particularly in electrical and electronic equipment.

〔従来の技術〕[Conventional technology]

積層板は、電気、電子機器等に用いられるプリント基板
の基板本体として広く用いられている。
Laminated boards are widely used as the main body of printed circuit boards used in electrical and electronic devices.

この積層板の製法の一つとして、ガラスクロス等の長尺
な基材に熱硬化性樹脂を含浸させた長尺の樹脂含浸基材
を所定枚数重ね合わせ、その片面又は両面に長尺の金属
箔又はカバーフィルムを貼り合わせて積層体を得、これ
を予備加熱して含浸樹脂を予備硬化させ、次いでダブル
ベルトプレスで加熱加圧成形して上記予備硬化した樹脂
を本硬化させる連続的積層板の製法は知られている(特
開昭60−155440号公報など)。
One of the manufacturing methods for this laminate is to stack a predetermined number of long resin-impregnated base materials such as glass cloth with a thermosetting resin, and to attach a long metal plate to one or both sides of the long resin-impregnated base materials. A continuous laminate in which a laminate is obtained by bonding foils or cover films together, the laminate is preheated to precure the impregnated resin, and then heated and pressure molded using a double belt press to fully cure the precured resin. The manufacturing method is known (Japanese Unexamined Patent Publication No. 155440/1983, etc.).

この連続的積層板の製法における予備加熱は、積層体の
進行方向前方程温度が高くなるように温度勾配を制御す
ることも行われているが、積層体の輻方向ではこのよう
な温度制御が行われず、両側の間は同じ温度設定になっ
ている。
Preheating in this method of manufacturing continuous laminates involves controlling the temperature gradient so that the temperature increases toward the front in the direction of travel of the laminate; however, such temperature control is not possible in the direction of the radial direction of the laminate. This is not done and the temperature setting is the same between both sides.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、このような条件で予備加熱された積層体
は、均一加熱という点で好ましいが、予備加熱による含
浸樹脂の予備硬化が少な過ぎると、次の工程の加熱加圧
成形の本硬化の際に予備硬化した樹脂が両側縁から流出
する量が過多になり、得られた積層板の両側縁の板厚が
中央部のものより薄くなり、板厚精度が低下するという
問題がある。また、予備加熱による予備硬化が過度にな
ると上記の本硬化の際に予備硬化した樹脂の流出が少な
すぎ、この樹脂の流出とともに抜ける空気が抜けず、得
られた積層板中にボイドが発生するという問題を生じる
。このように、加熱加圧成形工程で、樹脂を適度に流出
させ、厚さが均一でボイドの発生のない積層板を得るた
めには、従来の予備加熱条件ではその選択範囲が狭いも
のであった。
However, although a laminate preheated under such conditions is preferable in terms of uniform heating, if the pre-curing of the impregnated resin by pre-heating is too small, it will cause problems during the main curing of the next step of hot-press molding. There is a problem in that an excessive amount of pre-cured resin flows out from both side edges, and the thickness of the obtained laminate at both side edges becomes thinner than that at the center, resulting in a decrease in thickness accuracy. In addition, if the precuring by preheating becomes excessive, too little of the precured resin flows out during the above-mentioned main curing, and the air that escapes with the flow of resin cannot escape, resulting in voids in the resulting laminate. The problem arises. In this way, in the hot-pressure molding process, in order to properly flow out the resin and obtain a laminate with a uniform thickness and no voids, the range of options available under conventional preheating conditions is narrow. Ta.

〔課題を解決するための手段〕[Means to solve the problem]

本発明者らは、このような課題を解決するために鋭、t
 vr究した結果、予備加熱による積層体の両側縁部の
含浸樹脂の予備硬化をその他の部分より進行させること
、例えば予備加熱炉内の加熱部分を積層体の幅方向に3
つ以上のゾーンに分割し、これを個別に温度制御可能と
し、これにより好ましくは積層体の中央部よりもその両
側縁部が高い温度で加熱されるように温度設定すること
により、上記加熱加圧成形の際に予備硬化した樹脂の過
度な流出を防止して板厚を一定にするとともに、その樹
脂の流出不足によるボイドの発生を防止することができ
ることをつきとめ、本発明をするに至ったものである。
In order to solve such problems, the present inventors have made a
As a result of the VR research, it was found that the pre-curing of the impregnated resin on both side edges of the laminate by preheating progresses more than other parts, for example, the heating part in the preheating furnace is heated 3 times in the width direction of the laminate.
By dividing the laminate into two or more zones, making it possible to individually control the temperature, and setting the temperature so that preferably the side edges of the laminate are heated at a higher temperature than the center, We have discovered that it is possible to prevent excessive outflow of pre-cured resin during pressure molding to maintain a constant plate thickness, and also to prevent the occurrence of voids due to insufficient outflow of the resin, leading to the creation of the present invention. It is something.

すなわち、本発明は、長尺の樹脂含浸基材を複数積層さ
せた材料を有する積層体を予備硬化させ、次いで加熱加
圧硬化させる積層板の製法において、上記積層体の幅方
向両側縁部の予備硬化の程度を他の部分より進行させる
ことを特徴とする積層板の製法を提供するものである。
That is, the present invention provides a method for producing a laminate in which a laminate having a material in which a plurality of elongated resin-impregnated base materials are laminated is pre-cured, and then cured by heating and pressure. The present invention provides a method for manufacturing a laminate, characterized in that the degree of preliminary curing progresses more than in other parts.

この際、積層体の幅方向両側縁部の予備硬化温度がその
他の部分の温度より高く設定された加熱炉により該積層
体を予備硬化させることも好ましく、さらに加熱炉が積
層体の幅方向3つ以上の個別に温度制御可能な加熱ゾー
ンを有することも好ましく、また、加熱炉は赤外線加熱
炉で、あることも好ましい。
At this time, it is also preferable to pre-cure the laminate in a heating furnace in which the pre-curing temperature of both edges in the width direction of the laminate is set higher than the temperature of other parts, and furthermore, the heating furnace It is also preferred to have more than one individually temperature controllable heating zone, and it is also preferred that the heating furnace is an infrared heating furnace.

以下に本発明の詳細な説明する。The present invention will be explained in detail below.

本発明における樹脂含浸基材は基材に液状樹脂を含浸さ
せたもので、その液状樹脂としては特に限定されず、溶
剤に溶解されたものでも良いが溶剤を含有しない液状熱
硬化性樹脂(但し、重合性ビニル七ツマー等の反応性希
釈剤は除く)が好ましく、エポキシ樹脂、不飽和ポリエ
ステル樹脂、エポキシビニルエステル樹脂、ジアリルフ
タレート樹脂などが代表例として挙げられる。
The resin-impregnated base material in the present invention is a base material impregnated with a liquid resin, and the liquid resin is not particularly limited, and may be one dissolved in a solvent, but a liquid thermosetting resin that does not contain a solvent (however, , excluding reactive diluents such as polymerizable vinyl nitrates) are preferred, and typical examples include epoxy resins, unsaturated polyester resins, epoxy vinyl ester resins, diallyl phthalate resins, and the like.

上記樹脂含浸基材の基材としては、クラフト紙、リンタ
ー紙、ガラスクロス、ガラス不織布等が代表例として挙
げられるが、これらに限定されるものではない。
Typical examples of the base material for the resin-impregnated base material include kraft paper, linter paper, glass cloth, glass nonwoven fabric, etc., but the present invention is not limited to these.

上記樹脂含浸基材の片面又は両面に用いられる金属箔と
しは、100μ蒙以下の厚みの電解或いは圧延銅箔が代
表的なものとして挙げられ、その他アルミニウム箔等を
用いても良い、また、カバーフィルムとしては、ポリエ
ステルフィルム、ポリイミドフィルム等が挙げられる。
The metal foil used on one or both sides of the resin-impregnated base material is typically an electrolytic or rolled copper foil with a thickness of 100 μm or less, and other materials such as aluminum foil may also be used. Examples of the film include polyester film and polyimide film.

上記樹脂含浸基材を製造するには、従来公知の方法で上
記樹脂を上記基材に含浸させて得られる。
The resin-impregnated base material can be produced by impregnating the base material with the resin using a conventionally known method.

これらの樹脂含浸基材は連続した長尺物として製造され
、その複数枚が重ね合わされ、必要に応じて所定の樹脂
含有量に調節された後、その片面又は両面に上記金属箔
又はカバーフィルムが貼り合わされ、連続な長尺の樹脂
含浸基材の積層体が得られる。
These resin-impregnated base materials are manufactured as continuous long products, and after stacking multiple sheets and adjusting the resin content to a predetermined value as necessary, the metal foil or cover film is coated on one or both sides of the resin-impregnated base material. By laminating them together, a continuous laminate of resin-impregnated base materials is obtained.

この積層体は予備加熱されてその含浸樹脂が予備硬化さ
れるが、その予備加熱炉としては、例えば積層体の幅方
向に対応する加熱部が3つ以上の加熱ゾーンに分割され
、それぞれの加熱ゾーンは個別に温度制御ができ、両端
の加熱ゾーンを中央の加熱ゾーンより高い温度に設定で
きるものが好ましい、加熱方式としては、熱風加熱、赤
外線加熱(遠赤外線加熱及び近赤外線加熱も含む)、高
周波加熱等が用いられ、これらは併用することもできる
This laminate is preheated to pre-cure its impregnated resin, but the preheating furnace is divided into three or more heating zones, each corresponding to the width direction of the laminate. It is preferable that the temperature of the zones can be controlled individually, and the heating zones at both ends can be set to a higher temperature than the central heating zone.Heating methods include hot air heating, infrared heating (including far-infrared heating and near-infrared heating), High frequency heating and the like are used, and these can also be used in combination.

熱風加熱方式の場合には、加熱される積層体の幅方向に
わたって設けられた熱風吐出口を3つ以上の吐出口に分
割し、温度の異なる熱風を吹き出すようにすれば、両端
の温度を高く、中央の温度を低くして温度勾配を設ける
ことができる。また、赤外線加熱方式は、面状あるいは
棒状ヒータを加熱される積層体の幅方向に沿って分割し
て設け、それぞれを個別に電圧調節により温度調整すれ
ば良い、温度勾配の制御が容易であるという点からは、
赤外線加熱方式が好ましい。
In the case of the hot air heating method, by dividing the hot air outlet provided across the width of the laminate to be heated into three or more outlets and blowing out hot air at different temperatures, the temperature at both ends can be raised. , a temperature gradient can be created by lowering the temperature in the center. In addition, in the infrared heating method, the temperature gradient can be easily controlled by dividing the planar or rod-shaped heater into parts along the width direction of the laminate to be heated, and adjusting the temperature of each separately by adjusting the voltage. From that point of view,
Infrared heating method is preferred.

上記予備加熱を行うに当たっては、予備硬化後の積層体
の中央部を切り取り、170℃、20Kg/ cIll
の条件で試験的に加熱加圧成形して本硬化させ、上下の
金属箔又はカバーフィルムを除く積層体の全i!量のう
ちの本硬化に際して積層体外に流出した樹脂分の割合(
流出率)が3〜20ilf量%であり、8かつ予備硬化
後の積層体の両側縁部を切り取り、上記と同様に170
℃、20Kg/−の条件で試験的に加熱加圧成形し、本
硬化させた時の流出率が1〜15重量%であって上記中
央部の樹脂の流出率よりも小さい、という条件で予備硬
化させることが好ましい。
When performing the above preheating, cut out the central part of the precured laminate and heat it at 170°C and 20kg/cIll.
The whole laminate except the upper and lower metal foils or cover films was cured by heating and pressure molding under the following conditions. Percentage of resin flowing out of the laminate during main curing (
The flow rate) is 3 to 20ilf%, 8 and the both side edges of the pre-cured laminate are cut and 170% is
℃ and 20 kg/- under the conditions that the outflow rate when fully cured is 1 to 15% by weight and smaller than the outflow rate of the resin in the center part. Preferably, it is cured.

このためには、積層体の両側縁部の予備加熱温度を高く
、中央部の予備加熱温度を低くする方法が一つの方法と
して挙げられ1.この場合その温度差をどのように設定
するかは、用いる樹脂の種類により左右されるが、通常
は2〜30t、好ましくは4〜20℃であり、中央部の
予備加熱温度は通常70〜180℃、予備加熱時間は通
常1〜15分である。
One method for this purpose is to increase the preheating temperature at both side edges of the laminate and lower the preheating temperature at the center.1. In this case, how to set the temperature difference depends on the type of resin used, but it is usually 2 to 30 t, preferably 4 to 20°C, and the preheating temperature in the center is usually 70 to 180 t. ℃, and the preheating time is usually 1 to 15 minutes.

ここで、両側縁部とは幅方向全長の両側縁を合わせた長
さの割合が60%以下、好ましくは5〜50%の部分を
言う。
Here, the term "both side edges" refers to a portion where the ratio of the combined length of both side edges of the total length in the width direction is 60% or less, preferably 5 to 50%.

上記は温度差すなわち温度勾配により予備硬化の程度を
調節したが、温度を一定にして加熱時間を調節すること
もでき、また、温度勾配を設けるとともに加熱時間差を
設け、両者を併用しても良い、その他風量を変えたり、
樹脂の硬化剤の量や種類を変えることによっても予備硬
化の程度を異ならせることができる。
In the above, the degree of pre-curing was adjusted by the temperature difference, that is, the temperature gradient, but it is also possible to keep the temperature constant and adjust the heating time, or it is also possible to provide a temperature gradient and a heating time difference, and use both together. , or change the air volume,
The degree of pre-curing can also be varied by changing the amount and type of curing agent in the resin.

予備加熱された積層体は、ダブルベルトプレス等の連続
加熱加圧成形機により本硬化させられ、積層板となり、
必要に応して後硬化させる。ダブルベルトプレスとして
は、ロール加圧方式、曲面圧方式、空気面圧方式等の加
圧方式のものが用いられるが、一対のエンドレスベルト
で積層体を加熱加圧しながら移行させ得る構造のもので
あれは特に限定されるものではない、この本硬化の条件
としテハ、通常90〜200℃、1〜50Kg/−が好
ましい。
The preheated laminate is fully cured using a continuous heating and pressure forming machine such as a double belt press to form a laminate.
Post-cure if necessary. Pressure systems such as a roll pressure system, curved surface pressure system, and air surface pressure system are used as double belt presses, but those with a structure that can transfer the laminate while heating and pressurizing it with a pair of endless belts are used. The conditions for this main curing are not particularly limited, and the preferred temperature is usually 90 to 200°C and 1 to 50 kg/-.

〔実施例〕〔Example〕

次に本発明の詳細な説明する。 Next, the present invention will be explained in detail.

なお、部は重量部、%は重量%を示す、また、ガラスク
ロスは特に断りがない限りすべて厚さ0.18簡のもの
を使用した。
Incidentally, parts are parts by weight, and % is weight %. Unless otherwise specified, all glass cloths with a thickness of 0.18 strips were used.

実施例1 ビスフェノール^とエピクロルヒドリンとの反応により
得られたエポキシ当量190なるエポキシ樹脂16.9
部と、テトラブロモビスフェノール^とエピクロルヒド
リンとの反応により得られたエポキシ当量が370なる
エポキシ樹脂26.5部と、メチルテトラヒドロ無水フ
タル酸26.6部、ベンジルジメチルアミン0.7部、
テトラブロモビスフェノールAとエピクロルヒドリンと
の反応により得られたエポキシ当量が370なるエポキ
シ樹脂のメタクリレート(60%)とスチレンモノマー
(40%)よりなるエポキシビニルエステル樹脂30部
及び・−パーへキサ3M)(日本油脂■製重合開始剤)
0.6部を混合せしめ、常温無溶剤液状樹脂を調製した
Example 1 Epoxy resin with epoxy equivalent of 190 obtained by reaction of bisphenol^ and epichlorohydrin 16.9
26.5 parts of an epoxy resin with an epoxy equivalent of 370 obtained by the reaction of tetrabromobisphenol^ and epichlorohydrin, 26.6 parts of methyltetrahydrophthalic anhydride, 0.7 parts of benzyldimethylamine,
30 parts of an epoxy vinyl ester resin consisting of methacrylate (60%) of an epoxy resin with an epoxy equivalent of 370 obtained by the reaction of tetrabromobisphenol A and epichlorohydrin and styrene monomer (40%) and .-perhexa 3M) ( Polymerization initiator manufactured by NOF ■)
0.6 parts were mixed to prepare a solvent-free liquid resin at room temperature.

この樹脂を幅1020■の連続な8枚のガラスクロスの
各々に、樹脂とガラスクロスの重量比が43=57にあ
るように含浸させる。この樹脂含浸基材8枚を息ね合わ
せ、更にこの重ね合わせ体の両面に厚さ35μ園の電解
銅箔を貼り合わせ、積層体を得た。
This resin is impregnated into each of eight continuous glass cloths each having a width of 1020 cm so that the weight ratio of resin to glass cloth is 43=57. Eight of these resin-impregnated base materials were pressed together, and electrolytic copper foil with a thickness of 35 μm was bonded to both sides of this stacked body to obtain a laminate.

一方、第1図のように、220 m幅の遠赤外線面状ヒ
ータ1.2.3.4.5、を加熱しようとする積層体6
の幅方向に沿って第1図のように5個並べ、全ヒータ幅
を1140w5とする。同様に積層体6を挾んでその下
側に、上記と同様のヒータl゛、2°、3″、4°、5
゛を設ける0次に、ヒータ2.3.4及び2°、3°、
4°を同じ出力に調整し、l、5及び1′、5゛のヒー
タをこれらより高い出力に調整して、8層体の両側縁部
6a、6bが加熱されてから1分後に125℃、中央部
6cが加熱されてから1分後に120℃に達し、その後
これら温度が一定に保持されるように設定し、その温度
で5分加熱した。
On the other hand, as shown in FIG.
Five heaters are arranged along the width direction as shown in FIG. 1, and the total width of the heaters is 1140w5. Similarly, the same heaters l'', 2°, 3'', 4°, 5
The heater 2.3.4 and 2°, 3°,
4° to the same output, and adjust the heaters 1, 5, 1', and 5' to higher outputs, and 1 minute after both side edges 6a, 6b of the 8-layer body are heated, the temperature reaches 125°C. The temperature reached 120° C. one minute after the central portion 6c was heated, and the temperature was then set to be kept constant and heated at that temperature for 5 minutes.

なお、温度は積層体の厚み方向の中心に熱電対を挿入し
、積層体内部で測定した。
Note that the temperature was measured inside the laminate by inserting a thermocouple into the center of the laminate in the thickness direction.

上記両側縁部6a、6b及び中央部6Cの一部を切り取
り、170℃、20Kg/ cIllで加熱加圧成形し
た時の樹脂流出率はそれぞれ2.0g%、5.0%であ
った。
When parts of the above-mentioned both side edge parts 6a, 6b and the center part 6C were cut out and heated and press-molded at 170° C. and 20 kg/cIll, the resin flow rates were 2.0 g% and 5.0%, respectively.

次に上記予備加熱された積層体を高温高圧の面圧方式で
170℃に設定されたダブルベルトプレスにより20に
g/−の圧力下、5分間加熱加圧成形した。成形物は裁
断し、両側縁からはみ出た樹脂を除き(トリミング) 
、1000鶴X iooom X 1.6 nのサイズ
の積層板を得た。このものを170℃、60分間、無圧
力下後硬化を行った。下記の物性試験を行い、その結果
を表1示す。
Next, the preheated laminate was heated and pressure-molded for 5 minutes under a pressure of 20 g/- using a double belt press set at 170 DEG C. using a high-temperature, high-pressure surface pressure method. Cut the molded product and remove the resin protruding from both sides (trimming)
A laminate with a size of 1,000 cranes x iooom x 1.6 n was obtained. This material was post-cured at 170° C. for 60 minutes without pressure. The following physical property tests were conducted and the results are shown in Table 1.

■ 積層板からの樹脂流出率(%) 加熱成形した後の積層板を長さ11000tに裁断し、
トリミングする前のその両側(幅10200)から流出
した樹脂分A (g)、上下の銅箔を除いた積層体の全
重量B(g)として下記の式より求める。
■ Resin outflow rate (%) from the laminate The laminate was cut into a length of 11,000 tons after being heated and formed.
The amount of resin A (g) flowing out from both sides (width 10200) before trimming and the total weight B (g) of the laminate excluding the upper and lower copper foils are calculated from the following formula.

A(gン/B(g)X  100   (%)■ 板厚
精度(n) 切断及びトリミングされた1000w X 1000+
+nの積層板の長さ方向左側の1辺の中央部から内側に
5、の部分■と、左側の1辺の中央部から内側に12〜
500flの部分■と、左側の1辺の中央部から内側に
995flの部分■の位置の厚みをそれぞれ測定した。
A(gn/B(g)
5, inward from the center of one side on the left in the length direction of the +n laminate, and 12 ~ inward from the center of one side on the left.
The thickness was measured at the position of the 500 fl part (2) and the 995 fl part (2) inward from the center of one side on the left side.

■ ボイドの有無 積層板表面に銅箔のふくれの発生の有無を目視判定した
■ Presence of voids The presence or absence of blistering of the copper foil on the surface of the laminate was visually determined.

実施例2 実施例1における第1図に基づ(予備加熱のヒータの出
力設定を以下のようにする。
Example 2 Based on FIG. 1 in Example 1 (the output settings of the heater for preheating were set as follows).

3.3″く212″ 、4,4°<1.l“、5,5゛
そして中央部のヒータ3.3°による積層体の加熱温度
を120℃、その両側の中間のヒータ2,2′4.4”
による積層体の加熱温度を123℃、両端部のヒータl
、1゛、5,5′による積層体の加熱温度を126℃と
した以外は実施例1と同様にして積層板を得た。予備硬
化後の積層体の両側縁部(126℃加?!部分)と中央
部(120℃加熱部分)を切り取り、170℃、20に
g/ cdで加熱加圧成形した時の樹脂流出率はそれぞ
れ、1.0%、5.0%であった。上記積層板について
実施例Iと同様に測定し、その結果を表1に示す。
3.3″ x 212″, 4.4°<1. 1", 5,5゛, and the heating temperature of the laminate by the heater 3.3° in the center is 120°C, and the heaters 2,2'4.4" in the middle on both sides
The heating temperature of the laminate was set to 123℃, and the heater l at both ends was heated to 123℃.
A laminate was obtained in the same manner as in Example 1, except that the heating temperature of the laminate by , 1', 5, 5' was 126°C. After pre-curing, the laminate was cut out from both side edges (the part heated to 126°C?!) and the center part (the part heated to 120°C), and then heated and pressure-molded at 170°C and 20 g/cd. The resin flow rate was They were 1.0% and 5.0%, respectively. The above laminate was measured in the same manner as in Example I, and the results are shown in Table 1.

比較例1 実施例1における第1図のヒータすべての出力を同一と
し、積層体の加熱温度を120℃にした以外は同様にし
て積層板を得た。この積層板についても実施例1と同様
に測定した結果を表1に示す。
Comparative Example 1 A laminate was obtained in the same manner as in Example 1 except that the outputs of all the heaters shown in FIG. 1 were the same and the heating temperature of the laminate was 120°C. This laminate was also measured in the same manner as in Example 1, and the results are shown in Table 1.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、積層板の製法において樹脂含浸基材の
材料を有する積層体の予備硬化をその両側縁部をその他
の部分より進行させたので、後の工程で加熱加圧成形し
て本硬化させる際に、樹脂の過度の流出が抑制されて得
られる積層板の板厚が一定に保たれ、その精度が良く、
また、積層体の中央部は予備硬化の進行が遅いので上記
加熱加圧成形の際に、この部分の樹脂の流動は円滑に行
われ樹脂中に含まれる空気を抜くことができ、積層板の
ボイドの発生を抑制することができる。
According to the present invention, in the method for manufacturing a laminate, the preliminary curing of the laminate having the resin-impregnated base material is progressed on both side edges of the laminate more than the other parts, so that the laminate is molded under heat and pressure in a later step. During curing, excessive outflow of resin is suppressed, and the thickness of the resulting laminate is kept constant, with good precision.
In addition, pre-curing progresses slowly in the central part of the laminate, so during the above-mentioned heat and pressure molding, the resin in this part flows smoothly and the air contained in the resin can be removed, allowing the laminate to The generation of voids can be suppressed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法を実施する際に使用する装置の断
面説明図である。 図中、1〜5.1゛〜5°はヒータ、6は積層体、6a
、6bはその両側縁部、6cは中央部である。 平成1年11月lO日 105−
FIG. 1 is an explanatory cross-sectional view of an apparatus used in carrying out the method of the present invention. In the figure, 1-5.1゛-5° is the heater, 6 is the laminate, 6a
, 6b are both side edges, and 6c is the center. November 1999 105-

Claims (1)

【特許請求の範囲】 1、長尺の樹脂含浸基材を複数積層させた材料を有する
積層体を予備硬化させ、次いで加熱加圧硬化させる積層
板の製法において、上記積層体の幅方向両側縁部の予備
硬化の程度を他の部分より進行させることを特徴とする
積層板の製法。 2、積層体の幅方向両側縁部の予備硬化温度がその他の
部分の温度より高く設定された加熱炉により該積層体を
予備硬化させる請求項1記載の積層板の製法。 3、予備硬化を積層体の幅方向に対応する少なくとも3
つの個別に温度制御可能な加熱ゾーンを有する加熱炉に
より行う請求項1記載の積層板の製法。 4、予備硬化を赤外線加熱炉により行う請求項1、2又
は3記載の積層板の製法。
[Scope of Claims] 1. A method for manufacturing a laminate in which a laminate comprising a plurality of elongated resin-impregnated substrates is precured, and then cured by heating and pressure, wherein both edges in the width direction of the laminate are cured by heat and pressure. A method for manufacturing a laminate, characterized in that the degree of pre-curing in some parts is more advanced than in other parts. 2. The method for producing a laminate according to claim 1, wherein the laminate is pre-cured in a heating furnace in which the pre-curing temperature of both edges in the width direction of the laminate is set higher than the temperature of other parts. 3. Pre-curing at least 3 times corresponding to the width direction of the laminate
2. A method for producing a laminate according to claim 1, which is carried out in a heating furnace having two individually temperature controllable heating zones. 4. The method for manufacturing a laminate according to claim 1, 2 or 3, wherein the preliminary curing is performed in an infrared heating furnace.
JP1291085A 1989-11-10 1989-11-10 Manufacture of laminated board Pending JPH03153318A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1291085A JPH03153318A (en) 1989-11-10 1989-11-10 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1291085A JPH03153318A (en) 1989-11-10 1989-11-10 Manufacture of laminated board

Publications (1)

Publication Number Publication Date
JPH03153318A true JPH03153318A (en) 1991-07-01

Family

ID=17764247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1291085A Pending JPH03153318A (en) 1989-11-10 1989-11-10 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPH03153318A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014208466A1 (en) * 2013-06-25 2014-12-31 昭和電工株式会社 Method for producing and device for producing photocurable resin film
WO2014208468A1 (en) * 2013-06-25 2014-12-31 昭和電工株式会社 Method for producing and device for producing photocurable resin film
JP2017128056A (en) * 2016-01-21 2017-07-27 株式会社石野製作所 Heating device for thermoplastic carbon fiber material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014208466A1 (en) * 2013-06-25 2014-12-31 昭和電工株式会社 Method for producing and device for producing photocurable resin film
WO2014208468A1 (en) * 2013-06-25 2014-12-31 昭和電工株式会社 Method for producing and device for producing photocurable resin film
CN105263687A (en) * 2013-06-25 2016-01-20 昭和电工株式会社 Method for producing and device for producing photocurable resin film
JPWO2014208468A1 (en) * 2013-06-25 2017-02-23 昭和電工株式会社 Photocurable resin film manufacturing apparatus and manufacturing method
TWI613236B (en) * 2013-06-25 2018-02-01 昭和電工股份有限公司 Device and method for manufacuring photocurable resin film
JP2017128056A (en) * 2016-01-21 2017-07-27 株式会社石野製作所 Heating device for thermoplastic carbon fiber material

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