JPH0315254Y2 - - Google Patents
Info
- Publication number
- JPH0315254Y2 JPH0315254Y2 JP1988075660U JP7566088U JPH0315254Y2 JP H0315254 Y2 JPH0315254 Y2 JP H0315254Y2 JP 1988075660 U JP1988075660 U JP 1988075660U JP 7566088 U JP7566088 U JP 7566088U JP H0315254 Y2 JPH0315254 Y2 JP H0315254Y2
- Authority
- JP
- Japan
- Prior art keywords
- section
- printed circuit
- circuit board
- preheating
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 13
- 239000006071 cream Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 8
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 7
- 229910052736 halogen Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 halogen Halogen Chemical class 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988075660U JPH0315254Y2 (zh) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988075660U JPH0315254Y2 (zh) | 1988-06-06 | 1988-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01177076U JPH01177076U (zh) | 1989-12-18 |
| JPH0315254Y2 true JPH0315254Y2 (zh) | 1991-04-03 |
Family
ID=31300719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988075660U Expired JPH0315254Y2 (zh) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0315254Y2 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001198671A (ja) * | 1999-11-12 | 2001-07-24 | Tamura Seisakusho Co Ltd | リフロー装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141199A (ja) * | 1984-12-13 | 1986-06-28 | 富士通株式会社 | チツプ部品の実装方法 |
-
1988
- 1988-06-06 JP JP1988075660U patent/JPH0315254Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141199A (ja) * | 1984-12-13 | 1986-06-28 | 富士通株式会社 | チツプ部品の実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01177076U (zh) | 1989-12-18 |
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