JPH0315178Y2 - - Google Patents
Info
- Publication number
- JPH0315178Y2 JPH0315178Y2 JP4407183U JP4407183U JPH0315178Y2 JP H0315178 Y2 JPH0315178 Y2 JP H0315178Y2 JP 4407183 U JP4407183 U JP 4407183U JP 4407183 U JP4407183 U JP 4407183U JP H0315178 Y2 JPH0315178 Y2 JP H0315178Y2
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- metal plate
- heat
- drive electrode
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Special Spraying Apparatus (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、駆動電極と対向電極間に高周波電圧
を印加させることにより超音波を発振し、その振
動エネルギーで対向電極に接した液体を霧化させ
るバイモルフ圧電形超音波振動子に関するもので
ある。[Detailed description of the invention] Industrial application field This invention oscillates ultrasonic waves by applying a high-frequency voltage between a drive electrode and a counter electrode, and uses the vibration energy to atomize the liquid in contact with the counter electrode. This invention relates to a bimorph piezoelectric ultrasonic transducer.
従来例の構成とその問題点
従来のバイモルフ圧電形超音波振動子は第1図
に示すように構成され、すなわち圧電素子1の片
面の中央に駆動電極2を設けるとともに、他面よ
り前記駆動電極2を設けた面の周囲まで対向電極
3を設けている。そして液体面からの反射超音波
や液体中に含まれる化学物質から対向電極3や圧
電素子を保護するために、対向電極3の上にステ
ンレス鋼などの保護金属板4を耐熱性導電接着剤
5で貼り付けている。前記駆動電極2と対向電極
3には振動子リード6をハンダで接続している。Structure of a conventional example and its problems A conventional bimorph piezoelectric ultrasonic transducer is structured as shown in FIG. The counter electrode 3 is provided up to the periphery of the surface on which the electrode 2 is provided. In order to protect the counter electrode 3 and the piezoelectric element from reflected ultrasonic waves from the liquid surface and chemical substances contained in the liquid, a protective metal plate 4 made of stainless steel or the like is attached to the counter electrode 3 using a heat-resistant conductive adhesive 5. It is attached with. A vibrator lead 6 is connected to the drive electrode 2 and counter electrode 3 with solder.
ところでこの種の振動子は一般に対向電極に接
する液体が枯渇した場合は、音響インピーダンス
が激減するため、振動子に過電流が流れるととも
に自己発熱し、振動子自身が破壊するのみなら
ず、振動子を保持する物体へ熱的なストレスを与
えてしまうことがある。したがつて振動子そのも
のが熱暴走を断ち切る構造を備えておくと有効で
ある。しかし、液体が枯渇しているにもかかわら
ず駆動したために生じる破壊や熱暴走から振動子
を保護するため、従来は振動子を駆動する側で液
体の有無や振動子を流れる電流レベルを検出し
て、異常と認めた場合は振動子の駆動を停止する
方法が実施されている。しかし検出系が正常に動
作しなかつた場合には熱暴走の問題は残る。この
熱暴走に対して従来の振動子は特別にその防止対
策を施していない。 By the way, in general, when the liquid in contact with the counter electrode of this type of vibrator is depleted, the acoustic impedance is drastically reduced, so an overcurrent flows through the vibrator and it generates self-heating, which not only destroys the vibrator itself, but also damages the vibrator. may cause thermal stress to the object holding it. Therefore, it is effective if the vibrator itself has a structure to cut off thermal runaway. However, in order to protect the vibrator from destruction and thermal runaway caused by driving it even when the liquid is depleted, conventionally the side driving the vibrator detects the presence or absence of liquid and the level of current flowing through the vibrator. Therefore, if an abnormality is detected, a method is implemented in which the drive of the vibrator is stopped. However, if the detection system does not operate properly, the problem of thermal runaway remains. Conventional vibrators do not take any special measures to prevent this thermal runaway.
考案の目的
本考案は上記状況に鑑み、熱暴走状態になつて
もその状態を断ち切つて振動子を保持する物体へ
熱的ストレスを与えないバイモルフ圧電形振動子
を提供するにある。Purpose of the Invention In view of the above-mentioned circumstances, the present invention provides a bimorph piezoelectric vibrator that can break the thermal runaway state and do not apply thermal stress to the object holding the vibrator.
考案の構成
前記目的を達成するため、本考案は駆動電極に
リード線引出し用金属板をエポキシ系耐熱性導電
接着剤で貼り合わせた構成としたものである。そ
して圧電素子から多量の熱が発生した場合はその
熱で上記金属板が駆動電極よりはずれ、安全性が
確保されるものである。Structure of the Invention In order to achieve the above object, the present invention has a structure in which a metal plate for drawing out lead wires is bonded to the drive electrode using an epoxy heat-resistant conductive adhesive. When a large amount of heat is generated from the piezoelectric element, the metal plate is separated from the drive electrode by the heat, thereby ensuring safety.
実施例の説明
以下本考案の一実施例を第2図にもとづき説明
する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
第2図は本考案のバイモルフ圧電形超音波振動
子の構造図であり、第1図と比べ、駆動電極2の
周辺の構造が異なるだけであるから、同一部分に
ついては同一番号をつけて説明を省略する。本実
施例の特徴とする構成はリード引き出し用金属板
8を駆動電極2上の一部に銀または銅の金属粉末
を体積比60%混入した常温硬化型のエポキシ系耐
熱性導電接着剤5を用いて貼り合わせた構成にあ
る。このリード引き出し用金属板8の材質は、ハ
ンダ付性・導電性の点から鋼などが有効である。
そして振動子リード6は、リード引き出し用金属
板8にハンダ9で接続している。 FIG. 2 is a structural diagram of the bimorph piezoelectric ultrasonic transducer of the present invention. Compared to FIG. 1, the only difference is the structure around the drive electrode 2, so the same parts are given the same numbers and explained. omitted. The characteristic structure of this embodiment is that the metal plate 8 for leading out the leads is partially covered with a heat-resistant conductive adhesive 5 containing a room temperature curable epoxy type epoxy-based conductive adhesive 5 mixed with silver or copper metal powder at a volume ratio of 60%. It has a structure in which it is pasted together using As the material of this lead drawing metal plate 8, steel or the like is effective from the viewpoint of solderability and conductivity.
The vibrator lead 6 is connected to a metal plate 8 for lead extraction with solder 9.
以上のような構造において、液体が枯渇して圧
電素子1から発熱が始まつて温度が上昇すると、
駆動電極2上へ塗布した耐熱性導電接着剤5はリ
ード引出し用金属板8と駆動電極2の接続部にあ
るため、両者の接触抵抗で局部的に高温となり、
耐熱性導電接着剤5は硬化した接着剤自体の強度
が低下するとともに、内包する空気が熱膨張して
内部の結合力が弱められる。さらに圧電素子1の
上下振動による振り切り力が加わつているため、
リード引出し用金属板8は駆動電極2から離脱
し、圧電素子1の駆動は停止される。リード引出
し用金属板8は、対向電極3上より面積が小さく
熱放散効果の小さい駆動電極2上へ設ける方が、
本考案の目的に沿う形となる。 In the above structure, when the liquid is depleted and the piezoelectric element 1 starts to generate heat and the temperature rises,
Since the heat-resistant conductive adhesive 5 coated on the drive electrode 2 is located at the connection between the metal plate 8 for lead extraction and the drive electrode 2, it becomes locally high temperature due to the contact resistance between the two.
In the heat-resistant conductive adhesive 5, the strength of the cured adhesive itself decreases, and the air contained therein thermally expands, weakening the internal bonding force. Furthermore, since the swinging force due to the vertical vibration of the piezoelectric element 1 is added,
The lead drawing metal plate 8 is separated from the drive electrode 2, and the drive of the piezoelectric element 1 is stopped. It is better to provide the metal plate 8 for lead extraction on the drive electrode 2, which has a smaller area and has a smaller heat dissipation effect than on the counter electrode 3.
This form is in line with the purpose of this invention.
考案の効果
前記実施例の説明より明らかなように、本考案
によれば液体が枯渇しているにもかかわらず駆動
したために生じる振動子の熱暴走状態を、振動子
を保持する物体に熱的ストレスを与える前に断ち
切ることができ、その実用的効果は大きい。Effects of the Invention As is clear from the description of the above embodiment, according to the present invention, the thermal runaway state of the vibrator caused by driving it even though the liquid is depleted can be prevented by thermally applying heat to the object holding the vibrator. It is possible to cut off stress before it causes stress, which has a great practical effect.
第1図は従来のバイモルフ圧電形超音波振動子
の断面図、第2図は本考案の一実施例のバイモル
フ圧電形超音波振動子の断面図である。
2……駆動電極、5……耐熱性導電接着剤、6
……振動子リード、8……リード引出し用金属
板、9……ハンダ。
FIG. 1 is a sectional view of a conventional bimorph piezoelectric ultrasonic transducer, and FIG. 2 is a sectional view of a bimorph piezoelectric ultrasonic transducer according to an embodiment of the present invention. 2... Drive electrode, 5... Heat resistant conductive adhesive, 6
... Vibrator lead, 8 ... Metal plate for lead extraction, 9 ... Solder.
Claims (1)
金属粉末を混入したエポキシ系耐熱性導電接着剤
でリード引出し用金属板を貼り合わせ、その金属
板にリード線をハンダ付けしたバイモルフ圧電形
超音波振動子。 On a part of the drive electrode formed by sintering metal,
A bimorph piezoelectric ultrasonic transducer in which a metal plate for lead extraction is bonded with an epoxy heat-resistant conductive adhesive mixed with metal powder, and a lead wire is soldered to the metal plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4407183U JPS59150569U (en) | 1983-03-25 | 1983-03-25 | Bimorph piezoelectric ultrasonic transducer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4407183U JPS59150569U (en) | 1983-03-25 | 1983-03-25 | Bimorph piezoelectric ultrasonic transducer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59150569U JPS59150569U (en) | 1984-10-08 |
JPH0315178Y2 true JPH0315178Y2 (en) | 1991-04-03 |
Family
ID=30174601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4407183U Granted JPS59150569U (en) | 1983-03-25 | 1983-03-25 | Bimorph piezoelectric ultrasonic transducer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59150569U (en) |
-
1983
- 1983-03-25 JP JP4407183U patent/JPS59150569U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59150569U (en) | 1984-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH11176887A (en) | Semiconductor device and manufacture thereof | |
JPH0315178Y2 (en) | ||
JP3445894B2 (en) | Pressure transducer | |
JP2549911Y2 (en) | Ultrasonic transducer | |
JP2605784B2 (en) | Ultrasonic transducer | |
US6757946B2 (en) | Wire bonding method | |
JPH05343603A (en) | Semiconductor device | |
JPH0879894A (en) | Ultrasonic probe | |
JP3693450B2 (en) | Solid-state image sensor device | |
JPH0810737B2 (en) | Chip carrier and manufacturing method thereof | |
JP2000105157A (en) | Semiconductor pressure sensor | |
JP6809866B2 (en) | Micropump and fluid transfer device | |
JPS6031832Y2 (en) | ultrasonic cleaner | |
JP2882155B2 (en) | Simple exterior type electrostrictive effect element | |
JP4214577B2 (en) | Semiconductor pressure sensor | |
JPS58182256A (en) | Manufacture of semiconductor device | |
JPS60110145A (en) | Resin-sealed type semiconductor device | |
JP2929934B2 (en) | Lead thermocompression head | |
JP2536626Y2 (en) | Hybrid integrated circuit | |
JPS61245709A (en) | Manufacture of surface wave filter | |
JPS59148419A (en) | Thickness shear piezoelectric oscillator | |
JPS63155735A (en) | Wiring substrate for semiconductor device | |
JP2000105160A (en) | Semiconductor pressure sensor | |
JPH06177701A (en) | Surface acoustic wave device | |
JPS6022719Y2 (en) | ultrasonic transducer |