JPH03151189A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH03151189A JPH03151189A JP28770389A JP28770389A JPH03151189A JP H03151189 A JPH03151189 A JP H03151189A JP 28770389 A JP28770389 A JP 28770389A JP 28770389 A JP28770389 A JP 28770389A JP H03151189 A JPH03151189 A JP H03151189A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cream solder
- cream
- caprylic acid
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 97
- 239000006071 cream Substances 0.000 title claims abstract description 50
- 239000012190 activator Substances 0.000 claims abstract description 25
- 230000004907 flux Effects 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 9
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 51
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 claims description 25
- 229960002446 octanoic acid Drugs 0.000 claims description 25
- 238000004140 cleaning Methods 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 abstract description 17
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 abstract 8
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 abstract 4
- 238000005406 washing Methods 0.000 abstract 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 14
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 14
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 14
- 238000007639 printing Methods 0.000 description 10
- 239000004359 castor oil Substances 0.000 description 9
- 235000019438 castor oil Nutrition 0.000 description 9
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 9
- 229910052736 halogen Inorganic materials 0.000 description 8
- 150000002367 halogens Chemical class 0.000 description 8
- 238000009413 insulation Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 239000004034 viscosity adjusting agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- -1 amine hydrochlorides Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- CBPYOHALYYGNOE-UHFFFAOYSA-M potassium;3,5-dinitrobenzoate Chemical compound [K+].[O-]C(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 CBPYOHALYYGNOE-UHFFFAOYSA-M 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- ISYORFGKSZLPNW-UHFFFAOYSA-N propan-2-ylazanium;chloride Chemical compound [Cl-].CC(C)[NH3+] ISYORFGKSZLPNW-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、はんだ付後のフラックス残渣除去不要のクリ
ームはんだおよびファインパターン用のクリームはんだ
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cream solder that does not require removal of flux residue after soldering and a cream solder for fine patterns.
[従来の技術]
近年、クリームはんだが用いられる電子基板はますます
小型化される傾向があり、プリント回路にマウントする
素子のチップ化に伴う部品の微小化、実装密度の上昇、
高度集積化が進められ、電子材料の′:!4極間距離や
パターンの間隔はますます挟められている。[Conventional technology] In recent years, electronic boards that use cream solder have become increasingly smaller.As elements mounted on printed circuits are made into chips, components become smaller and packaging density increases.
High degree of integration is progressing, and electronic materials':! The distance between the four poles and the spacing between the patterns are becoming increasingly narrower.
したがって1回路間の高い絶縁性の確保や、接合強度、
接合精度、熱安定性等に関し、クリームはんだについて
も高度な要請が成されるに至っている。Therefore, ensuring high insulation between one circuit, bonding strength,
Cream solders have also come to be highly demanding in terms of bonding accuracy, thermal stability, and the like.
クリームはんだは主としてリフロー法が使用されている
が、最初に基板にクリームはんだを印刷した後、チップ
化された素子をマウントし、加熱炉を通してはんだを溶
融し、接合をすることが一般的である。The reflow method is mainly used for cream solder, but it is common to first print cream solder on a board, then mount the chipped element, melt the solder in a heating furnace, and bond. .
すなわち、クリームはんだに要請される性能は、人体に
対する安全性、良好なはんだ付性、高絶縁性、非腐食性
及び保存中に劣化しない等の一般的なはんだフラックス
に要請される性能の他。In other words, the performance required for cream solder is in addition to the performance required for general solder flux, such as safety for the human body, good solderability, high insulation, non-corrosion, and no deterioration during storage.
印刷特性およびはんだ付後洗浄をしないことが望ましい
が5通常は洗浄することが必要である。すなわち、クリ
ームはんだ中のハロゲン系活性剤の残渣により、金属成
分が腐食されるおそれがあるためである。したがって洗
浄性において優れていることが要求され、主にフロンで
洗浄される。Although it is preferable not to clean after printing characteristics and soldering, cleaning is usually necessary. That is, this is because the metal components may be corroded by the residue of the halogen-based activator in the cream solder. Therefore, it is required to have excellent cleaning properties, and is mainly cleaned with Freon.
ところが、近年フロンは地球のオゾン層破壊の原因とさ
れているため、フラックス残渣除去をしないで済むはん
だの要求は当然のものである。However, in recent years, fluorocarbons have been considered to be a cause of depletion of the earth's ozone layer, so it is natural that there is a demand for a solder that does not require removal of flux residue.
一方、クリームはんだを精密電子部品に使用する際には
、印刷性に優れていること及びデイスペンサーからの吐
出性に優れていることが必要であり、印刷後は吐出物が
ニジミやブレを生じないことが必要である。On the other hand, when using cream solder for precision electronic components, it must have excellent printability and dischargeability from a dispenser, and after printing, the discharged material may smudge or blur. It is necessary that there be no.
[発明を解決しようとする課題]
本発明は、
■ はんだ付に際して、素子をマウントはんだ付した後
、フラックス残渣を洗浄除去不要のクリームはんだの開
発
■ 印刷パターンの微細化に伴なう良好な印刷性のある
クリームはんだの開発
を目的としたものである。[Problems to be Solved by the Invention] The present invention is: ■ Development of cream solder that does not require cleaning and removal of flux residue after mounting and soldering of elements ■ Good printing due to miniaturization of printed patterns The purpose of this project was to develop a cream solder with good properties.
第1の目的であるはんだ何役の洗浄不要クリームはんだ
は、従来はんだ溶融時に回路導体(金属)表面の酸化物
除去及びクリームはんだ中のはんだ粉末表面の酸化物除
去のため活性剤としてハロゲン化水素酸(通常はアミン
の塩酸塩等の形)が必要とされていたものを、これをカ
プリル酸で代賛できることを見出したことに基づくもの
である。The first purpose of solder cream solder, which does not require cleaning, is to use hydrohalic acid as an activator to remove oxides on the surface of circuit conductors (metals) when melting solder, and to remove oxides on the surface of solder powder in cream solder. This is based on the discovery that caprylic acid can be used to compensate for the need for amines (usually in the form of amine hydrochlorides, etc.).
従来のクリームはんだにはハロゲン系化合物(例えばジ
エチルアミン塩酸塩、イソプロピルアミン塩酸塩、モノ
エヂルアミン塩酸塩または臭化水素酸塩等)を活性剤と
して添加し、はんだの濡れ性を改善し、はんだ粉末の酸
化物除去及び再酸化防止を計っている。In conventional cream solder, halogen compounds (e.g. diethylamine hydrochloride, isopropylamine hydrochloride, monoedylamine hydrochloride or hydrobromide, etc.) are added as activators to improve solder wettability and prevent oxidation of solder powder. It is designed to remove substances and prevent re-oxidation.
しかし、素子をはんだ付した後1回路表面にハロゲン化
合物が残存していると空気中の水分、酸素等により金属
の腐食を促進し、絶縁の低下、短絡または回路の接続不
良等、神々のトラブルの原因となることは良く知られて
おり、洗浄が必要とされており、フロン洗浄、水洗浄な
どが行なわれるのが普通である。However, if halogen compounds remain on the surface of a circuit after the elements are soldered, moisture, oxygen, etc. in the air will accelerate corrosion of the metal, causing problems such as reduced insulation, short circuits, and poor circuit connections. It is well known that this is the cause of this, and cleaning is required, and cleaning with Freon or water is usually performed.
しかし、近年オゾン層の破壊防止のためフロン使用の規
制、近い将来使用禁止の可能性がある。However, in recent years, the use of fluorocarbons has been regulated to prevent the destruction of the ozone layer, and there is a possibility that its use will be banned in the near future.
一方、水洗浄はフロン洗浄はど効率的でなく。On the other hand, water cleaning is not as efficient as Freon cleaning.
更に廃液処理等種々の未解決の問題があって、はんだ何
役洗浄不要のハロゲン系活性剤を含まず、洗浄をしない
でこれらと同じ活性作用を有する高信頼性のクリームは
んだの開発が必要となってきた。Furthermore, there are various unresolved issues such as waste liquid treatment, and it is necessary to develop a highly reliable cream solder that does not contain halogen-based activators that do not require cleaning, and has the same activating effect without cleaning. It's here.
これとは別に部品の微小化1回路の高度集積化傾向はは
んだパターンの間隔の一層の微細化の要求となり、必然
的にはんだ粉体の微粉化となり、扮の比表面積が太き(
なるため、粉末の表面酸化量が増加しやすい傾向にある
。それが従来の配合のクリームはんだに右いては、増加
した酸化物を完全に還元し、未溶解やハンダボールの生
成を防ぐため、ハロゲン系活性剤の増量をしなければな
らなかった。しかし、これはハロゲン系活性剤の残渣が
フロン洗浄や水洗浄で完全に除去できず。Apart from this, the trend toward miniaturization of components and high integration of single circuits has created a demand for further miniaturization of the spacing between solder patterns, which inevitably leads to the miniaturization of solder powder, which increases the specific surface area of the solder (
Therefore, the amount of surface oxidation of the powder tends to increase. However, with conventional cream solder formulations, it was necessary to increase the amount of halogen-based activator in order to completely reduce the increased oxides and prevent undissolved solder balls from forming. However, the residue of the halogen-based activator cannot be completely removed by cleaning with Freon or water.
腐食を招く恐れがあるという問題があった。There was a problem that it could lead to corrosion.
したがって、ファインパターン用クリームはんだの開発
も必要とされていた。Therefore, there was a need to develop cream solder for fine patterns.
L3題を解決するための手段]
本発明は上記のごとき種々の問題点を粉末状はんだ、樹
脂、溶剤等を含有する組成物にカプリル酸を含有したク
リームはんだを開発することにより解決した。Means for Solving Problem L3] The present invention has solved the various problems described above by developing a cream solder containing caprylic acid in a composition containing powdered solder, resin, solvent, etc.
特に非洗浄用クリームはんだとしては、フラックス成分
(本発明において、クリームはんだの粉末状はんだを除
くすべての成分をいう。)に対して活性剤としてカプリ
ル酸を5〜35重量%を添加したクリームはんだを提供
する。In particular, cream solder for non-cleaning use is a cream solder in which 5 to 35% by weight of caprylic acid is added as an activator to the flux component (in the present invention, this refers to all components of cream solder excluding powdered solder). I will provide a.
また、ファインパターン用クリームはんだとしては、他
の活性剤と共にフラックス成分に対してカプリル酸を2
0〜35重琶%添加したクリームはんだを提供する。In addition, as a cream solder for fine patterns, caprylic acid is added to the flux component along with other active agents.
To provide a cream solder containing 0 to 35% by weight.
非洗浄用クリームはんだに使用する原材料は、はんだ粉
末、樹脂、溶剤、粘度調整剤及びカプリル酸からなる。The raw materials used in the non-cleaning cream solder consist of solder powder, resin, solvent, viscosity modifier, and caprylic acid.
この場合のはんだ粉末としては、 共晶はんだ (Sn 63%−pb 37%。In this case, the solder powder is eutectic solder (Sn 63%-pb 37%.
融点
183℃)
銀入りはんだ
(Sn 62%−Pb 3G%−Ag 2%融点178
℃)
高温はんだ
(Pb 95%−8「15%、融点305℃)または、
(Pb 95%−5n 3%−八g 2% 、融点2
98℃)低温はんだ
(Sn 46%−Pb 46%−Bi 8%、融点16
5℃)等の粉末で、73μm(200メツシユ)以下の
ものが使用される。Melting point 183℃) Silver-containing solder (Sn 62%-Pb 3G%-Ag 2% Melting point 178
℃) High temperature solder (Pb 95%-8'15%, melting point 305℃) or (Pb 95%-5n 3%-8g 2%, melting point 2
98℃) Low temperature solder (Sn 46%-Pb 46%-Bi 8%, melting point 16
A powder having a temperature of 73 μm (200 mesh) or less is used.
樹脂としては、主としてロジン類、例えば重合ロジン、
天然ロジン(ウッドロジン、ガムロジン)、水素添加ロ
ジン、マレイン化ロジン、不均化ロジンが使用される。As the resin, mainly rosins, such as polymerized rosin,
Natural rosin (wood rosin, gum rosin), hydrogenated rosin, maleated rosin, disproportionated rosin are used.
溶剤としては、多(の有機系溶剤が使用できるが1例え
ばブチルカルピトール、テレピネオール、テキサノール
、ブチルカルピトールアセテート等が使用できる。As the solvent, many organic solvents can be used, including butylcarpitol, terpineol, texanol, butylcarpitol acetate, and the like.
粘度調整剤としては、硬化ヒマシ油、・水素添加ヒマシ
油、ヤシ油、ステアリン酸等を用いる。As the viscosity modifier, hydrogenated castor oil, hydrogenated castor oil, coconut oil, stearic acid, etc. are used.
活性剤はカプリル酸を加えることによってはんだ何役の
洗浄が不要となるクリームはんだが得られる。By adding caprylic acid as an activator, a cream solder can be obtained that eliminates the need for cleaning the solder.
この配合割合は、粉末状はんだ87〜93%、樹脂4〜
6%、溶剤1.7〜5%、粘度調整剤0.1〜0.5%
、カプリル酸0.5〜3.5%であって、印刷のライン
幅0.5mm程度までのパターンには使用可能である。The blending ratio is 87-93% powdered solder and 4-4% resin.
6%, solvent 1.7-5%, viscosity modifier 0.1-0.5%
, 0.5 to 3.5% of caprylic acid, and can be used for printing patterns with line widths of up to about 0.5 mm.
しかし、現在は0.3mm幅程度のファインパターンの
要求があり、これに応えるためには別にファインパター
ン用に20μm以下の極微細粉末はんだを使用する必要
があるが、はんだ粉末が微細になると共に表面積は増大
し、酸素量も表面積に比例して増加して、リフロー時に
未溶解やハンダボールの発生が起こりやす(なるため改
善が必要となる。However, currently there is a demand for fine patterns with a width of about 0.3 mm, and in order to meet this demand, it is necessary to separately use ultrafine powder solder of 20 μm or less for fine patterns, but as solder powder becomes finer, The surface area increases, and the amount of oxygen also increases in proportion to the surface area, making it more likely that undissolved solder or solder balls will occur during reflow (this requires improvement).
しかし、カプリル酸は従来のハロゲン化水素酸系活性剤
と併用して活性剤としての作用を発揮し、20μm以下
の極微細粉末はんだを使用してもハンダボールの発生が
なく、例えば0.3μmのごときファインパターンでも
印刷性は大幅に改善され、スムーズに印刷、はんだ付が
出来ることを見出した。However, caprylic acid works as an activator when used in combination with conventional hydrohalic acid activators, and even when using ultrafine powder solder of 20 μm or less, solder balls do not occur, for example, 0.3 μm. We have found that even with fine patterns such as , the printability is greatly improved and printing and soldering can be performed smoothly.
すなわち、ファインパターン用クリームはんだとしては
、はんだ粉末は20μm以下の極微細粉末を用いると共
に、活性剤としては活性の強い従来公知のアミンの塩酸
塩のごときハロゲン系化合物とカプリル酸を併用する。That is, as a cream solder for fine patterns, an extremely fine solder powder of 20 μm or less is used, and as an activator, a highly active halogen compound such as a conventionally known amine hydrochloride and caprylic acid are used in combination.
活性剤としては、クリームはんだに対し0.2〜1.0
%、カプリル酸は2.0〜3.5%配合が好ましい。As an activator, 0.2 to 1.0 for cream solder
%, and caprylic acid is preferably blended in an amount of 2.0 to 3.5%.
[作 用1
クリームはんだにカプリル酸を配合すると、如何なるメ
カニズムかは不明であるが、活性剤の効果を発揮し、ハ
ロゲン系活性剤の添加を必要とせず、非洗浄用クリーム
はんだを得ることができる。[Action 1: When caprylic acid is added to cream solder, the effect of the activator is exhibited, although the mechanism is unknown, and it is possible to obtain non-cleanable cream solder without the need to add a halogen-based activator. can.
ナナ−1,)゛ツバ々−゛ノ田つリー人はんだにカプリ
ル酸を配合するときは、ハロゲン系活性剤の活性効果を
補助し、極微細粉末はんだを使用しているにもかかわら
ず、印刷特性が著しく改善され、短絡や断線もなく、ま
たはんだボールも発生がなく、洗浄後の活性剤残渣が少
ない優れたクリームはんだが得られる。When adding caprylic acid to solder, it assists the activation effect of the halogen activator, and even though ultrafine powder solder is used, An excellent cream solder with significantly improved printing properties, no short circuits or disconnections, no solder balls, and less activator residue after cleaning is obtained.
[実施例1
1 非洗浄用クリームはんだ
(実施例1〜4)
活性剤としてカプリル酸を使用し1粒径lO〜54μm
のほぼ完全球形を呈したはんだ微粉末と樹脂、溶剤、粘
度調節剤を実施例に示す割合で混練してクリームはんだ
とした。[Example 1 1 Non-cleaning cream solder (Examples 1 to 4) Using caprylic acid as an activator, 1 particle size lO ~ 54 μm
A cream solder was prepared by kneading the almost perfectly spherical solder fine powder, a resin, a solvent, and a viscosity modifier in the proportions shown in the examples.
このクリームはんだを銅張回路基板上にピッチ0.5m
mでスクリーン印刷し、230℃でリフローして、はん
だのダレ、はんだボールを評価した。実施例1〜4では
、はんだのダレもなく、はんだボールも全く発生せず、
銅基板のパターン上に鮮明にはんだを付けることができ
た。Apply this cream solder to a copper-clad circuit board at a pitch of 0.5m.
Screen printing was performed at 230° C., and reflow was performed at 230° C., and solder sag and solder balls were evaluated. In Examples 1 to 4, there was no solder dripping and no solder balls were generated.
I was able to clearly attach solder to the pattern on the copper board.
すナー +l 7n−j&(7其#i!JiTA?A1
.?rいア相対湿度60℃、90%R)I中に1000
時間保持した後に0.5mm間隔の回路間に直流100
vを印荷して絶縁抵抗を測定する耐湿負荷実験を行なっ
た。実施例1〜4では耐湿負荷試験1000時間後でも
絶縁抵抗が1000MΩ以上であり、短絡、腐食等の不
良は全くなかった。Suner +l 7n-j & (7 part #i! JiTA? A1
.. ? Relative humidity 60°C, 90%R) I in 1000
After holding for a period of time, 100 d.c.
A moisture resistance load experiment was conducted in which the insulation resistance was measured by applying a voltage of V. In Examples 1 to 4, the insulation resistance was 1000 MΩ or more even after 1000 hours of the humidity load test, and there were no defects such as short circuits or corrosion.
く比較例1〉
比較のため、カプリル酸に代えてオー。イン酸を活性剤
として使用したフラックスを用いてクリームはんだとし
たもの番こりき、同様のテストをした。230℃でリフ
ローした際にはんだボールの発生があり、不良が発生し
た。Comparative Example 1> For comparison, O was used instead of caprylic acid. A similar test was conducted using cream solder using a flux containing inic acid as an activator. When reflowing at 230°C, solder balls were generated and defects occurred.
(実施例1)
Sn63−Pb37 90.O%重合ロジン
5.0%ブチルカルピトール
3.4%カプリル#
1.3%ヒマシ油 0.3
%(実施例2)
Sn62−Ag2−Pb36 90.0%不均化ロジ
ン
ブチルカルピトール
カプリル酸
ヒマシ油
(実施例3)
Sn95−Pb5
重合ロジン
ブチルカルピトール
カプリル酸
ヒマシ浦
(実施例4)
n46−B
水添ロジン
ブチルカルピトール
カプリル酸
ヒマシ油
(比較例1)
Sn63−Pb37
償金ロジン
ブチルカルピトール
18−Pb46
90゜
0%
7%
0%
3%
0%
0%
4%
5%
1 %
0%
0%
9%
0%
1 %
0%
0%
7%
オレイン酸
0%
ヒマシ油
0゜
3%
(以下余白)
11 ファインパターン用クリームはんだ〈実施例5
)
樹脂、溶剤、粘度調整剤、ハロゲン系活性剤とカプリル
酸を併用し、錫63%、鉛37%1粒径約20gm以下
の細かいほぼ完全球形を呈したはんだ極微粉末とを以下
に示す割合で混線してクリームはんだとした。このクリ
ームはんだ粒径が細かいため、ピッチ0.3mmの銅張
回路大根[−に不良なくパターン通りに印刷が可能であ
り。(Example 1) Sn63-Pb37 90. O% polymerized rosin 5.0% butylcarpitol
3.4% Caprylic #
1.3% castor oil 0.3
% (Example 2) Sn62-Ag2-Pb36 90.0% Disproportionated rosin butylcarpitol caprylic acid castor oil (Example 3) Sn95-Pb5 Polymerized rosin butylcarpitol caprylic acid castor oil (Example 4) n46- B Hydrogenated Rosin Butyl Carpitol Caprylic Acid Castor Oil (Comparative Example 1) Sn63-Pb37 Redemption Rosin Butyl Carpitol 18-Pb46 90°0% 7% 0% 3% 0% 0% 4% 5% 1% 0% 0 % 9% 0% 1 % 0% 0% 7% Oleic acid 0% Castor oil 0°3% (Margin below) 11 Cream solder for fine patterns <Example 5
) Resin, solvent, viscosity modifier, halogen-based activator, and caprylic acid are used in combination, and ultrafine solder powder exhibiting a fine, almost perfect spherical shape with a particle size of about 20 gm or less and 63% tin and 37% lead is prepared in the proportions shown below. I mixed the wires with cream solder. Because the grain size of this cream solder is fine, it is possible to print copper-clad circuits with a pitch of 0.3 mm according to the pattern without any defects.
ファインパターンのはんだ付に向いている。Suitable for fine pattern soldering.
5n63−Pb37 (20um以下)90.0%
重合ロジン 5.0%ブチルカ
ルピトール 1.5%塩塩酸ジー−チルア
ミン 0,2%カプリル酸
3,0%ヒマシ油
0.3%〈比較例2−1)
粒径53〜*Oumのはんだ扮を使用した場合は、カプ
リル酸を配合しても0.3mm幅の狭いギャップのパタ
ーンは作れなかった。(ギャップが繋ってしまう。)
〈比較例2−2)
はんだ粉末の粒径を20μm以下とし、ハロゲン系活性
剤を使用し、下記に示す従来配合のクリーム組成とした
場合ははんだポールの発生が多く、絶縁テストで短絡し
てしまう。5n63-Pb37 (20um or less) 90.0% Polymerized rosin 5.0% Butylcarpitol 1.5% Di-thylamine hydrochloride 0.2% Caprylic acid
3.0% castor oil
0.3% (Comparative Example 2-1) When a solder with a particle size of 53 to *Oum was used, a pattern with a narrow gap of 0.3 mm width could not be created even if caprylic acid was blended. (The gaps are connected.) <Comparative Example 2-2> When the particle size of the solder powder is 20 μm or less, a halogen-based activator is used, and the cream composition of the conventional formulation shown below is used, solder poles are generated. There are many cases where a short circuit occurs during an insulation test.
5n63−Pb37 (20gm以下)90.0%
重合ロジン 5.0%ブチルカル
ピトール 4.5%塩酸ジエチルアミン
0.2%ヒマシ油
0.3%(以下余白)
[効 果]
以上の説明から分かる通り、クリームはんだに添加すれ
ばカプリル酸は非腐食性の活性剤として、非洗浄でも信
頓牲を高めることが出来る。また、ファインパターン用
インキの印刷特性を大きく改とすることが分かった。5n63-Pb37 (20gm or less) 90.0% Polymerized rosin 5.0% Butylcarpitol 4.5% Diethylamine hydrochloride
0.2% castor oil
0.3% (blank below) [Effect] As can be seen from the above explanation, caprylic acid, when added to cream solder, serves as a non-corrosive activator and can increase reliability even without cleaning. It was also found that the printing characteristics of fine pattern ink were significantly improved.
したがって、非洗浄用クリームはんだの製造やダレやは
んだボールのない、印刷に際してノズルの閉塞の少ない
優れたクリームはんだを、カプリル酸を配合することに
より簡単に製造できることが分かった7
そしてかくすることにより、リフロー後の洗浄が不要で
実装ラインでの作業性、生産性を大きく改古し、フロン
等の洗浄工程、洗浄槽等の設備、フロン等の回収設備な
どが不要となる等大きなメリットをもたらし、短絡のな
い高信頼性の製品を(1することか可能となった。Therefore, it has been found that by incorporating caprylic acid, it is possible to easily produce a cream solder for non-cleaning, and to produce an excellent cream solder without dripping or solder balls, and with less clogging of nozzles during printing7. , it does not require cleaning after reflow, greatly improving workability and productivity on the mounting line, and brings great benefits such as eliminating the need for fluorocarbon cleaning processes, equipment such as cleaning tanks, and fluorocarbon recovery equipment. It has become possible to create highly reliable products without short circuits.
また、ファインパターン用クリームはんだにおいては印
刷特性の向−ヒに伴う生産性の向上、また印刷の完全性
による短絡や接合不充分等による不合格品の減少、印刷
ニジミ、インキダレ、はんだボールの生成等のトラブル
の少ない優れたクリームはんだを提供できた。In addition, in the case of cream solder for fine patterns, productivity is improved due to improvements in printing characteristics, and the completeness of printing reduces the number of rejected products due to short circuits, insufficient bonding, etc., and the formation of printing bleeds, ink drips, and solder balls. We were able to provide an excellent cream solder with fewer problems such as.
Claims (3)
カプリル酸を含有させたことを特徴とするクリームはん
だ。(1) Cream solder characterized by containing caprylic acid in a composition containing powdered solder, resin, solvent, etc.
て5〜35重量%添加したことを特徴とする非洗浄用ク
リームはんだ。(2) A cream solder for non-cleaning, characterized in that 5 to 35% by weight of caprylic acid is added to the flux component as an activator.
ル酸を20〜35重量%添加したことを特徴とするファ
インパターン用クリームはんだ。(3) A cream solder for fine patterns, characterized in that 20 to 35% by weight of caprylic acid is added to the flux component together with other activators.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28770389A JPH03151189A (en) | 1989-11-04 | 1989-11-04 | Cream solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28770389A JPH03151189A (en) | 1989-11-04 | 1989-11-04 | Cream solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03151189A true JPH03151189A (en) | 1991-06-27 |
Family
ID=17720646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28770389A Pending JPH03151189A (en) | 1989-11-04 | 1989-11-04 | Cream solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03151189A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2020031693A1 (en) * | 2018-08-10 | 2021-08-12 | 株式会社弘輝 | Flux and solder paste |
-
1989
- 1989-11-04 JP JP28770389A patent/JPH03151189A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2020031693A1 (en) * | 2018-08-10 | 2021-08-12 | 株式会社弘輝 | Flux and solder paste |
US11833622B2 (en) | 2018-08-10 | 2023-12-05 | Koki Company Limited | Flux and solder paste |
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