JPH03149855A - Manufacture of cap with window glass - Google Patents

Abstract

PURPOSE:To enable a manufacturing method which is easier than before to be adopted, the manufacturing man-hour to be reduced for reducing manufacturing cost, and then yield to be improved by machining a cap material for forming the cap main body, performing plating, and then sealing a window glass to a window part of the cap by a resin. CONSTITUTION:When producing a cap with a window glass which is used for a semiconductor container which houses a semiconductor element such as a semiconductor laser element, a cap main body 10 is formed by machining a cap material, plating is performed to the formed cap main body 10, and a window glass 14 is sealed to the window part of the cap by a resin 16. For example, by using a soft iron as a material, the cap main body 10 where a transmission hole 12 for transmitting light is provided at the top of the hat shape, nickel plating is performed, and then the window glass 14 is adhered to the periphery of the transmission hole 12 using the adhesive 16 from the inside. Thus, the manufacturing process can be simplified and limitation in materials to be used according to the request for matching thermal coefficient of expansion can be eliminated, thus reducing the manufacturing cost drastically.

Description

[Detailed description of the invention] (Industrial Icheon field) The present invention relates to a method for manufacturing a cap with a window glass.

(Prior Art) A semiconductor container in which a semiconductor element such as a semiconductor laser element is mounted includes an airtight terminal having a stem to which the semiconductor element is bonded and a cap with a window glass sealed to the stem.

In conventional airtight terminals, the lead wire is glass-sealed to the stem.
The cap is manufactured by glass welding the window glass to the cap, but manufacturing by glass welding in this way protects the laser element etc. from the external environment, so it has a high degree of heat resistance, moisture resistance, and high reliability. This is because the equipment is required to do so.

Conventionally, window glass is welded to the cap as follows.

First, a cap body is formed into a predetermined shape, and the cap body is oxidized to form an oxide film on the inner wall of the cap body. Next, low-melting glass is applied around the window to which the window glass is to be bonded, and after a glaze treatment is performed, the window glass is welded. Oxide film deposition treatment, glaze treatment, and window glass welding are all done by heat treatment.

The reason why an oxide film is formed on the inner wall of the cap body as mentioned above is because the wettability of the glass to the oxide film causes the glass to be welded, and if the cap body itself is coated with low melting point glass, the window glass cannot be welded. be.

After welding the window glass, necessary plating treatments such as nickel plating are applied to the product. --.

(Problem to be solved by the invention) As mentioned above, when manufacturing caps with window glass used for semiconductor containers such as airtight terminals, heating is required when forming an oxide film, glazing treatment, and glass welding. Therefore, complicated work has to be done.

Also. Because of this heat treatment, plating must be done after the window glass has been welded. Therefore, if the product is crushed in the plating solution or washed with water, the window glass may become contaminated. Adhesive or glass WI
There is a problem that the R part may be attacked.

Also. Since the glass is welded, it is necessary to match the thermal expansion coefficients of the window glass and the cap, and the cap material must be made of an expensive metal with a thermal expansion coefficient close to that of the glass, such as an iron-nickel-cobalt alloy. There are restrictions on the material.

As described above, the conventional manufacturing method for caps with window glass has problems such as the number of manufacturing steps required, the high rate of defects, and the expensive materials used. There is a need to reduce costs by adopting this method.

Therefore, the present invention has been made to solve the above-mentioned problems, and its purpose is to enable the adoption of a simpler manufacturing method than the conventional method, thereby reducing the number of manufacturing steps and manufacturing costs. To provide a method for manufacturing a cap with a window glass, which can reduce production costs and improve yield.

(Means for solving Il!fi) The present invention has the following configuration to achieve the above object.

That is, in a method for manufacturing a cap with a window glass used for a semiconductor container that houses a semiconductor device such as a semiconductor laser device, a cap material is processed to form a cap body, and the formed cap body is plated. Special Embodiment characterized in that a window glass is sealed to the window portion of the cap using a resin) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 shows an embodiment of a cap with a window glass manufactured by the method of the present invention.

In the figure, IO is the hat-shaped cap body, part 1.
A light transmission hole 12 is bored in nPl.

Reference numeral 14 denotes a window glass that is adhered around the through hole 12 using an adhesive 16 from the inside of the cap body l-0. In one embodiment, soft iron is used as the material for the cap body lO, and after the cap is formed, nickel plating is applied, and the window glass 1
4 was glued.

The manufacturing process according to the present invention is as follows.

That's right, ■Cap shape → ■Plating → ■Y! Adhesive application → ■ Window glass adhesion In this manufacturing method, there is no heating process, so there is no need to match the coefficient of thermal expansion between the material of the cap body lO and the window glass 14. Therefore, the cap body lO
As the material, a material having a coefficient of thermal expansion different from that of the window glass, such as soft iron, may be used.

Also. Since the window glass is bonded using an adhesive, the cap body 10 can be coated with rough plating. This prevents the window glass 14 and the adhesive 16 from being eroded by the glazing solution and from being stained during the treatment process.

In addition, the adhesive used is not constant.

Various platings can be used for the plating applied to the cap. Also. Some actual products have a cap shape in which the window glass is attached at an angle, and the above manufacturing method can be applied to such products as well.

For comparison, the conventional cap manufacturing process is as follows.

■Cap molding → ■Oxide film deposition →■Low melting point glass coating → ■Glaze treatment→ ■Window glass welding → O
Plating Here, ■, ■, and ■ are heat treatment steps.

FIG. 2 shows a cap manufactured by a conventional method. The material of the cap body 10a is an iron-nickel-copal l-alloy, and the window glass 14 is sealed to the cap body 10a by a low-melting glass 18.

Comparing the method of this example with the conventional method, the method of this example takes advantage of the method of bonding window glass using an adhesive, which eliminates the need for heat treatment, which greatly simplifies the manufacturing process. .

Also. In the conventional method, plating had to be applied after the window glass was welded, but with this method.

Since the window glass is bonded after plating, it is possible to eliminate defects such as staining of the window glass. In addition, the manufacturing process is simplified and the materials used are no longer limited by key terms such as matching thermal expansion coefficients, making it possible to significantly reduce manufacturing costs, which are about 1/2 of the conventional manufacturing cost. It becomes possible to lower costs.

The performance of the cap obtained by the above manufacturing method can fully satisfy the specifications required for a cap with a window glass for semiconductor containers such as airtight terminals. This is because the performance of semiconductor devices such as laser devices has improved significantly in recent years, and the conditions required for semiconductor containers such as airtight terminals are no longer as strict as they used to be. This is because, depending on the application of the semiconductor container, very strict conditions may not be necessary.

Therefore, this manufacturing method is an extremely effective method for manufacturing a cap with a window glass that satisfies certain specifications and can reduce costs.

The present invention has been variously explained above using preferred embodiments, but the present invention is not limited to these embodiments.
Of course, many modifications can be made without departing from the spirit of the invention.

(Effects of the Invention) According to the method for manufacturing a cap with a window glass according to the present invention, a cap that satisfactorily meets certain specification conditions can be manufactured by an extremely simple method. In addition to improving the quality of the product, the materials used are not limited, and the cost of the product can be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of a cap with a window glass manufactured by the method of the present invention, and FIG. 2 is a sectional view showing a conventional example of a cap with a window glass. 10--Cap body, 12--Through hole, 14--
-Window glass, 1 piece--Adhesive, 18--Low melting point glass.

Claims (1)

[Claims] 1. In a method for manufacturing a cap with a window glass used for a semiconductor container for accommodating a semiconductor device such as a semiconductor laser device, the cap material is processed to form a cap body, and the formed cap body is A method for producing a cap with a window glass, which comprises plating and then sealing the window glass to the window portion of the cap using resin.