JPH03149252A - Sealing material for piezoelectric resonating component - Google Patents
Sealing material for piezoelectric resonating componentInfo
- Publication number
- JPH03149252A JPH03149252A JP28843889A JP28843889A JPH03149252A JP H03149252 A JPH03149252 A JP H03149252A JP 28843889 A JP28843889 A JP 28843889A JP 28843889 A JP28843889 A JP 28843889A JP H03149252 A JPH03149252 A JP H03149252A
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- piezoelectric
- resin
- cavity
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003566 sealing material Substances 0.000 title claims abstract description 42
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 15
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、圧電共振部品の外装材として用いられる封止
材料に関し、特に、圧電基板に構成された振動領域上に
空洞を形成するように圧電共振部品の周囲を外装樹脂で
封止した構造を得るための封止材料に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a sealing material used as an exterior material for a piezoelectric resonant component, and particularly to a sealing material that is used to form a cavity over a vibration region configured on a piezoelectric substrate. The present invention relates to a sealing material for obtaining a structure in which the periphery of a piezoelectric resonant component is sealed with an exterior resin.
第１図（ａ）及び（ｂ）に、エネルギ閉込め型圧電共振
部品の一例を示す、なお、第１図（ｂ）では、後述の封
止材料の図示は省略しである。圧電共振部品ｌでは、圧
電基板２０両主面に振動電極３．４が形成されている。FIGS. 1(a) and 1(b) show an example of an energy confinement type piezoelectric resonant component. In FIG. 1(b), illustration of a sealing material to be described later is omitted. In the piezoelectric resonant component 1, vibrating electrodes 3.4 are formed on both main surfaces of the piezoelectric substrate 20.
振動電極３は、圧電基板２の一方端縁から中央側に向か
って延びるように、振動電極４は圧電基板２の他方端縁
から同じく中央側に向かって延びるように形成されてい
る。振動電極３．４は、圧電基板２の中央領域において
圧電基板２を介して表裏対向されている。The vibrating electrode 3 is formed to extend from one edge of the piezoelectric substrate 2 toward the center, and the vibrating electrode 4 is formed to extend from the other edge of the piezoelectric substrate 2 toward the center. The vibrating electrodes 3.4 are opposed to each other with the piezoelectric substrate 2 interposed therebetween in the central region of the piezoelectric substrate 2.
振動電極３，４には、それぞれ、リード端子５゜６が接
合されている。そして、リード端子５．６の先端部分を
除いて全体が封止材料７により被覆されている。Lead terminals 5 and 6 are connected to the vibrating electrodes 3 and 4, respectively. The entire lead terminal 5.6 except the tip portion is covered with a sealing material 7.
なお、振動電極３，４が対向している振動領域には、空
洞８が形成されている。空洞８ば、振動領域の振動を妨
げないために設けられているものである。Note that a cavity 8 is formed in the vibration region where the vibration electrodes 3 and 4 face each other. The cavity 8 is provided so as not to interfere with the vibration in the vibration region.
上記の封止材料７を構成する材料としては、従来、常温
では液体のエポキシ樹脂に充填剤を混合したものが用い
られている。空洞８の形成は、振動領域の上方にワック
スを塗布し、しかる後封止材料をその上から被覆し、封
止材料を熱硬化させる際の熱により、ワックスを封止材
料７側に吸収させることにより行われている。Conventionally, as a material constituting the above-mentioned sealing material 7, a mixture of a filler and an epoxy resin, which is liquid at room temperature, has been used. The cavity 8 is formed by applying wax above the vibration region, then covering it with a sealing material, and absorbing the wax into the sealing material 7 side by the heat generated when the sealing material is thermally cured. This is done by
〔発明が解決しようとする技術的課題〕しかしながら、
従来のワックスを用いた空洞８の形成に際しては、第２
図（ａ）、（ｂ）及び第３図を参照して説明するように
、下記の問題が生じがちであった。[Technical problem to be solved by the invention] However,
When forming the cavity 8 using conventional wax, the second
As will be explained with reference to Figures (a) and (b) and Figure 3, the following problems tended to occur.
空洞８の形成に際しては、まず第２図（ａ）に示すよう
に、振ａｉａ域上にワックス９を塗布し、常温では液状
の封止材料７で周囲を被覆し、昇温する。昇温が６０℃
程度までの間は、第２図（ａ）に示すように、ワックス
９は溶融しない。In forming the cavity 8, first, as shown in FIG. 2(a), a wax 9 is applied onto the aia area, the surrounding area is covered with a sealing material 7 which is liquid at room temperature, and the temperature is raised. Temperature rise is 60℃
As shown in FIG. 2(a), the wax 9 does not melt until this point.
さらに昇温を続け、６０〜７０℃程度の温度となった場
合、モノマーの段階では温度上昇に伴って封止材料７を
構成している合成樹脂の粘度が低下する。その結果、第
２図（ｂ）に示すように、液状となったワックスが封止
材料内に浸透する過程において、封止材料７の形状が維
持できなくなり、圧電基板２の表面に設けられた振動電
極３に付着することがある。When the temperature continues to rise further and reaches a temperature of about 60 to 70°C, the viscosity of the synthetic resin constituting the sealing material 7 decreases at the monomer stage as the temperature rises. As a result, as shown in FIG. 2(b), the shape of the sealing material 7 could not be maintained during the process in which the liquid wax permeated into the sealing material, and the shape of the sealing material 7 could not be maintained. It may adhere to the vibrating electrode 3.
さらに昇温を続け、７０〜１５０℃の温度に至と、第３
図に示すように、振動電極３に接触していた封止材料７
は振動電極３から再度分離されるが、この場合、封止材
料の一部７ａが振動電極３上に残存しがちてあった。The temperature continued to rise further, reaching a temperature of 70 to 150℃, and the third
As shown in the figure, the sealing material 7 that was in contact with the vibrating electrode 3
was again separated from the vibrating electrode 3, but in this case a portion 7a of the sealing material tended to remain on the vibrating electrode 3.
その結果、振動電極３上に付着した封止材料の一部７ａ
により、振動がダンピングされたり、所望の圧電特性が
得られないことがあった。As a result, a portion 7a of the sealing material adhered to the vibrating electrode 3
As a result, vibrations may be damped or desired piezoelectric characteristics may not be obtained.
よって、本発明の目的は、空洞形成に際し圧電基板上ま
たは振動電極上に封止材料が付着し難い、従って圧電特
性の劣化が生じ難い圧電共振部品川封止材料を提供する
ことにある。Therefore, an object of the present invention is to provide a sealing material for a piezoelectric resonant component in which the sealing material is less likely to adhere to the piezoelectric substrate or the vibrating electrode during cavity formation, and therefore less likely to cause deterioration of the piezoelectric characteristics.
〔技術的課題を解決するための手段及び作用〕本発明は
、圧電共振部品の振動領域上に空洞を形成するように外
装を施した構造に用いる樹脂外装用封止材料であって、
分子量３０００〜４０００のエポキシ樹脂またはフェノ
ール樹脂と、無機充填剤とを含むことを特徴とするもの
である。[Means and effects for solving the technical problems] The present invention is a resin exterior sealing material used in a structure in which the exterior is provided to form a cavity above the vibration region of a piezoelectric resonant component,
It is characterized by containing an epoxy resin or phenol resin with a molecular weight of 3,000 to 4,000 and an inorganic filler.
本発明において用い得るエポキシ樹脂またはフェノール
樹脂としては、種々の構造のものが用い得るが、分子量
３０００〜４０００の範囲にあるものを用いる必要があ
る。The epoxy resin or phenol resin that can be used in the present invention can have various structures, but it is necessary to use one with a molecular weight in the range of 3,000 to 4,000.
分子量３０００〜４０００のエポキシ樹脂またはフェノ
ール樹脂を用いるのは、分子量３０００未満では、常温
で液状であり、低粘度であるため、ワックスの樹脂側へ
の浸透過程において樹脂の形状を維持し得なくなり、樹
脂が圧電基板の振動電極の表面に付着するおそれがある
からである。他方、分子量が４０００より大きな樹脂で
ば、粘度が高くなり過ぎ、塗布作業性が低下するからで
ある。The reason for using an epoxy resin or phenol resin with a molecular weight of 3000 to 4000 is that if the molecular weight is less than 3000, it is liquid at room temperature and has a low viscosity, so the shape of the resin cannot be maintained during the process of wax penetration into the resin side. This is because the resin may adhere to the surface of the vibrating electrode of the piezoelectric substrate. On the other hand, if the molecular weight is more than 4000, the viscosity will become too high and the coating workability will deteriorate.
従って、本発明では、常温で固体の分子量３０００〜４
０００のエポキシ樹脂またはフェノール樹脂が用いられ
る。Therefore, in the present invention, the solid molecular weight at room temperature is 3000 to 4.
000 epoxy resin or phenolic resin is used.
また、本発明の封止材料では、上記のようなエポキシ樹
脂またばフェノール樹脂に対して、シリ力、炭酸カルシ
ウムまたはアルミナ等の任意の無機充填剤が適宜の割合
で混合されている。この無機充填剤は、外装の機械的強
度を高めるために混合されているものであり、従来より
圧電共振部品の封止材料を構成するために用いられてい
る適当な範囲の割合で混合される。Further, in the sealing material of the present invention, an arbitrary inorganic filler such as silicate, calcium carbonate, or alumina is mixed with the above-mentioned epoxy resin or phenol resin in an appropriate ratio. This inorganic filler is mixed in order to increase the mechanical strength of the exterior, and is mixed in a proportion within an appropriate range that is conventionally used to constitute the sealing material of piezoelectric resonant components. .
（発明の効果〕
本発明では、封止材料が分子量３０００〜４０００のエ
ポキシ樹脂またはフェノール樹脂と無機充填剤とを含む
ものからなり、分子量３０００〜４０００のエポキシｍ
ｙＭまたはフェノール樹脂は常温で固体であり、ワック
スが樹脂側に浸透される温度領域における保形性に優れ
ている。(Effects of the invention) In the present invention, the sealing material is made of an epoxy resin or phenol resin with a molecular weight of 3000 to 4000 and an inorganic filler, and an epoxy resin with a molecular weight of 3000 to 4000 is used.
yM or phenol resin is solid at room temperature and has excellent shape retention in the temperature range where wax is permeated into the resin side.
従って、ワックスを樹脂側に浸透させて空洞を形成する
に際し、封止材料が圧電基板や振動電極に付着すること
を確実に防止することができる。Therefore, when forming a cavity by infiltrating the resin side with wax, it is possible to reliably prevent the sealing material from adhering to the piezoelectric substrate or the vibrating electrode.
よって、圧電共振部品の良品率を高めることがてき、信
頼性に優れた圧電共振部品を安定に量産することができ
る。Therefore, the yield rate of piezoelectric resonant components can be increased, and highly reliable piezoelectric resonant components can be stably mass-produced.
第１図に示した圧電共振部品ｌを実施例の封止材料を用
いて構成し、評価した。A piezoelectric resonant component 1 shown in FIG. 1 was constructed using the sealing material of the example and evaluated.
まず、公知の圧電共振部品の製造方法に従って、圧電基
板２の両主面に振動電極３，４を形成し、リード端子５
．６を接合したものを用意した。First, according to a known method for manufacturing piezoelectric resonant components, vibrating electrodes 3 and 4 are formed on both main surfaces of a piezoelectric substrate 2, and lead terminals 5
．． 6 was prepared by joining them together.
次に、分子量３０００のフェノール変性エポキシ樹脂と
、平均粒径２４ｐｍのシリ力とを、重量比で１＝９の割
合で混合し、この混合物に溶剤としてメチルエチルケト
ンを固形分に対して２０体積％の割合で混合し、封止材
料ペーストを作製した。Next, a phenol-modified epoxy resin with a molecular weight of 3000 and a silicone resin with an average particle size of 24 pm were mixed in a weight ratio of 1=9, and methyl ethyl ketone was added as a solvent to this mixture at a concentration of 20% by volume based on the solid content. A sealing material paste was prepared by mixing in the following proportions.
次に、前述したようにリード端子５．６が接合された圧
電共振部品の振動電極３．４の上面に、融点６０℃のワ
ックスを塗布したものを、上記の封止材料ペースト中に
浸漬し、全体を封止材料ペーストで被覆した。Next, wax with a melting point of 60° C. is applied to the top surface of the vibrating electrode 3.4 of the piezoelectric resonant component to which the lead terminal 5.6 is bonded as described above, and then immersed in the above sealing material paste. , the whole was covered with sealing material paste.
次に、封止材料ペーストを１時間程自然乾燥し、しかる
後４５℃の温度で１時間加熱し溶剤を除去した。引き続
き１５０℃の温度まで１時間昇温し、１５０℃の温度に
３０分間保持することにより樹脂を硬化させた。硬化後
、自然冷却することにより、外装用封止材料で封止され
た圧電共振部品を得た。Next, the sealing material paste was naturally dried for about 1 hour, and then heated at a temperature of 45° C. for 1 hour to remove the solvent. Subsequently, the temperature was raised to 150°C for 1 hour, and the resin was cured by maintaining the temperature at 150°C for 30 minutes. After curing, a piezoelectric resonant component sealed with an exterior sealing material was obtained by cooling naturally.
また、分子量３２００．３５００及び４０００のフェノ
ール変性エポキシ樹脂を用いて、同様にして外装川封止
材料で封止された圧電共振部品を得た。Furthermore, using phenol-modified epoxy resins with molecular weights of 3200.3500 and 4000, piezoelectric resonant components sealed with exterior sealing materials were obtained in the same manner.
上記のようにして得た実施例の各圧電共振部品を、切断
し、空洞が形成されている部分の断面を顕微鏡で観察し
た。その結果、分子量が３０００〜４０００の範囲にあ
るのフェノール変性エポキシ樹脂を用いた上記各実施例
では、樹脂が振動電極上や圧電基板の主面上に付着して
おらず、従って圧電共振部品の振動領域がダンピングさ
れていないことがわかった。Each piezoelectric resonant component of the example obtained as described above was cut, and the cross section of the portion where the cavity was formed was observed under a microscope. As a result, in each of the above examples using a phenol-modified epoxy resin with a molecular weight in the range of 3000 to 4000, the resin did not adhere to the vibrating electrode or the main surface of the piezoelectric substrate, and therefore the piezoelectric resonant component It was found that the vibration region was not damped.
比較のために、分子量８００のフェノール変性エポキシ
樹脂を用いたほかは、上記と同様にして、圧電共振部品
を作製した。この比較例の圧電共振部品においても、空
洞が設けられている部分の断面を顕微鏡で観察したとこ
ろ、かなりの割合で振動電極上あるいは圧電基板上への
フェノール樹脂の付着が認められた。For comparison, a piezoelectric resonant component was fabricated in the same manner as above, except that a phenol-modified epoxy resin with a molecular weight of 800 was used. In the piezoelectric resonant component of this comparative example, when the cross section of the portion where the cavity was provided was observed under a microscope, it was found that a considerable amount of phenol resin was adhered to the vibrating electrode or the piezoelectric substrate.
第１図（ａ）及び（ｂ）は、それぞれ、本発明フー
が適用される圧電共振部品の一例を示す断面図及び封止
材料の樹脂を省略した状態の斜視図、第２図（ａ）及び
（ｂ）は従来の封止材料を用いた場合の空洞形成工程を
説明するための各断面図、第３図は従来の封止材料を用
いた場合の問題点を説明するための断面図である。
図において、ｌは圧電共振部品、２は圧電基板、３．４
は振動電極、５．６はリード端子、７は封止材料、８は
空洞を示す。FIGS. 1(a) and (b) are a cross-sectional view and a perspective view, respectively, showing an example of a piezoelectric resonant component to which the present invention is applied, and FIG. 2(a) is a perspective view with the sealing material resin omitted. and (b) are cross-sectional views for explaining the cavity forming process when a conventional sealing material is used, and FIG. 3 is a cross-sectional view for explaining the problems when using a conventional sealing material. It is. In the figure, l is a piezoelectric resonant component, 2 is a piezoelectric substrate, 3.4
5 is a vibrating electrode, 5.6 is a lead terminal, 7 is a sealing material, and 8 is a cavity.
Claims (1)
装を施すための封止材料であって、 分子量３０００〜４０００のエポキシ樹脂またはフェノ
ール樹脂と、無機充填剤とを含むことを特徴とする圧電
共振部品の封止材料。[Claims] A sealing material for applying an exterior so as to form a cavity over the vibration region of a piezoelectric resonant component, comprising an epoxy resin or phenol resin with a molecular weight of 3000 to 4000, and an inorganic filler. A sealing material for piezoelectric resonant components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28843889A JPH03149252A (en) | 1989-11-06 | 1989-11-06 | Sealing material for piezoelectric resonating component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28843889A JPH03149252A (en) | 1989-11-06 | 1989-11-06 | Sealing material for piezoelectric resonating component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03149252A true JPH03149252A (en) | 1991-06-25 |
Family
ID=17730214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28843889A Pending JPH03149252A (en) | 1989-11-06 | 1989-11-06 | Sealing material for piezoelectric resonating component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03149252A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05167380A (en) * | 1991-12-16 | 1993-07-02 | Murata Mfg Co Ltd | Lamination type piezoelectric component and manufacture thereof |
| JPH0697754A (en) * | 1992-09-16 | 1994-04-08 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JPH06152292A (en) * | 1992-11-13 | 1994-05-31 | Murata Mfg Co Ltd | Production of piezo-electric resonator |
| JP2011165696A (en) * | 2010-02-04 | 2011-08-25 | Murata Mfg Co Ltd | Method of manufacturing winding coil component |
| KR20150103885A (en) * | 2014-03-04 | 2015-09-14 | 주식회사 한샘 | high-glossy panel for furniture material and manufacturing method thereof |
-
1989
- 1989-11-06 JP JP28843889A patent/JPH03149252A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05167380A (en) * | 1991-12-16 | 1993-07-02 | Murata Mfg Co Ltd | Lamination type piezoelectric component and manufacture thereof |
| JPH0697754A (en) * | 1992-09-16 | 1994-04-08 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JPH06152292A (en) * | 1992-11-13 | 1994-05-31 | Murata Mfg Co Ltd | Production of piezo-electric resonator |
| JP2011165696A (en) * | 2010-02-04 | 2011-08-25 | Murata Mfg Co Ltd | Method of manufacturing winding coil component |
| KR20150103885A (en) * | 2014-03-04 | 2015-09-14 | 주식회사 한샘 | high-glossy panel for furniture material and manufacturing method thereof |
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