JPH03148900A - Led mounter - Google Patents
Led mounterInfo
- Publication number
- JPH03148900A JPH03148900A JP1268624A JP26862489A JPH03148900A JP H03148900 A JPH03148900 A JP H03148900A JP 1268624 A JP1268624 A JP 1268624A JP 26862489 A JP26862489 A JP 26862489A JP H03148900 A JPH03148900 A JP H03148900A
- Authority
- JP
- Japan
- Prior art keywords
- led
- main body
- board
- section
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 10
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 10
- 239000000057 synthetic resin Substances 0.000 claims abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000003449 preventive effect Effects 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 23
- 238000001514 detection method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はＬＥＤを基板に取付けるためのＬＥＤ取付装置
に関し、特に、高い取付精度が要求される位置検出また
は回転検出用のＬＥＤ取付装置に関するものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to an LED mounting device for mounting an LED on a substrate, and particularly to an LED mounting device for position detection or rotation detection that requires high mounting accuracy. It is.
［従来の技術］
従来のこの種のＬＥＤ取付装置として、実開昭６１−５
２３５９号公報に掲載の技術を挙げることができる。[Prior art] As a conventional LED mounting device of this kind, the Utility Model Application No. 61-5
The technique disclosed in Japanese Patent No. 2359 can be mentioned.
第４図は前掲公報に開示された従来のＬＥＤ取付装置を
示す断面図である。FIG. 4 is a sectional view showing a conventional LED mounting device disclosed in the above-mentioned publication.
図において、（２１）は基板、（２２）は前記基板（２
１）に形成された取付孔、（２３）は前記取付孔（２２
）を介して基板（２１）にアウトサートされた合成樹脂
製のホルダ、（２４）は前記ホルダ（２３）の上部に形
成された収容部である。（２５）は前記収容部（２４）
に収容されたＬＥＤであり、接着剤（２６）を介してホ
ルダ（２３）に固定されている。（２７）はＬＥＤ（２
５）のリード線、（２８）はホルダ（２３）に貫設され
たリード線挿通孔である。In the figure, (21) is the substrate, and (22) is the substrate (2).
The mounting hole (23) is formed in the mounting hole (22).
) is a holder made of synthetic resin that is outsert to the substrate (21), and (24) is a accommodating portion formed on the upper part of the holder (23). (25) is the housing part (24)
The LED is housed in the holder (23) and fixed to the holder (23) via an adhesive (26). (27) is an LED (2
5), the lead wire (28) is a lead wire insertion hole provided through the holder (23).
上記のように構成された従来のＬＥＤ取付装置において
は、ＬＥＤ （２５）がホルダ（２３）を介して基板（
２１）に取付けられているので、ＬＥＤ （２５）が正
確な位置及び方向でフォトトランジスタ（図示略）に対
向して、回転検出または位置検出の機能を果すことがで
きる。In the conventional LED mounting device configured as described above, the LED (25) is attached to the substrate (25) via the holder (23).
21), so that the LED (25) faces the phototransistor (not shown) at a precise position and direction, allowing it to perform the function of rotation detection or position detection.
［発明が解決しようとする課題］
ところが、従来のＬＥＤ取付装置によると、前述したよ
うに、ホルダ（２３）を基板（２１）にアウトサート成
形する必要があるので、基板（２１）の製作コストが高
くついた。また、ＬＥＤ（２５）をホルダ（２３）に対
し接着剤（２６）を使用して固定する必要があるため、
ＬＥＤ （２５）の取付が面倒で、作業能率も悪かった
。[Problem to be Solved by the Invention] However, according to the conventional LED mounting device, as mentioned above, it is necessary to outsert mold the holder (23) onto the substrate (21), which reduces the manufacturing cost of the substrate (21). was expensive. Also, since it is necessary to fix the LED (25) to the holder (23) using adhesive (26),
Installing the LED (25) was troublesome and work efficiency was poor.
そこで、本発明の課題は、安価な構造により、ＬＥＤを
基板に対し簡単かつ精度よく取付けることができるＬＥ
Ｄ取付装置を提供することにある。Therefore, an object of the present invention is to provide an LED that can be easily and precisely attached to a board with an inexpensive structure.
D. To provide a mounting device.
［課題を解決するための手段］
上記課題を解決するために、本発明のＬＥＤ取付装置は
、基板の取付孔に挿入される本体と、基板の一面に当接
して本体を位置決めする位置決部と、基板の他面に係合
して本体を抜止めする弾性変形可能な抜止部と、本体の
先端部でＬＥＤを収容する収容部と、その収容部内のＬ
ＥＤの外周面を弾性的に把持する把持部と、その把持部
に把持されたＬＥＤの基端面を支持する支持部と、ＬＥ
Ｄのリード線を本体の外部へ導く挿通部とを合成樹脂材
料で一体的に形成したものである。[Means for Solving the Problems] In order to solve the above problems, the LED mounting device of the present invention includes a main body that is inserted into a mounting hole of a board, and a positioning part that positions the main body by coming into contact with one surface of the board. , an elastically deformable retaining part that engages with the other surface of the board to prevent the main body from coming out, a housing part that accommodates the LED at the tip of the main body, and an L inside the housing part.
a gripping part that elastically grips the outer circumferential surface of the ED; a support part that supports the proximal end surface of the LED gripped by the gripping part;
An insertion portion for guiding the lead wire D to the outside of the main body is integrally formed with a synthetic resin material.
［作用］
本発明のＬＥＤ取付装置において、ＬＥＤを本体の収容
部に収容すると、ＬＥＤの外周面は把持部により弾性的
に把持されるとともに、ＬＥＤの基端面が支持部によっ
て位置決め支持され、かつ、ＬＥＤのリード線は挿通部
を介して本体の外部へ導かれる。このため、ＬＥＤを本
体に対しワンタッチの操作で正確に組付けることができ
る。[Function] In the LED mounting device of the present invention, when the LED is housed in the accommodating portion of the main body, the outer peripheral surface of the LED is elastically gripped by the gripping portion, and the proximal end surface of the LED is positioned and supported by the supporting portion, and , the lead wire of the LED is led to the outside of the main body via the insertion part. Therefore, the LED can be accurately assembled to the main body with a one-touch operation.
また、ＬＥＤを組付けた状態で本体を基板の取付孔に挿
入すると、抜止部が弾性変形して取付孔を通過したのち
、基板の他面に係合し、その抜止部と基板の他面との係
合によって、本体が基板に対し抜止めされると同時に、
位置決部と基板の一面との当接により、本体が基板に対
して位置決めされる。したがって、ＬＥＤを組付けた本
体を基板に対しワンタッチの操作で精度よく取付けるこ
とができる。しかも、各構成部分が本体に一体形成され
ているので、従来とは異なり、装置全体を基板とは別個
に合成樹脂材料で安価に製作することができる。In addition, when the main body is inserted into the mounting hole of the board with the LED assembled, the retaining part elastically deforms and passes through the mounting hole, and then engages with the other surface of the board, and the retaining part and the other surface of the board At the same time, the main body is prevented from coming off from the board by engaging with the
The main body is positioned with respect to the substrate by contact between the positioning portion and one surface of the substrate. Therefore, the main body with the LED assembled thereon can be attached to the board with high precision by a one-touch operation. Furthermore, since each component is integrally formed with the main body, the entire device can be manufactured at low cost from a synthetic resin material separately from the substrate, unlike the conventional method.
［実施例１
以下、本発明を具体化した実施例を図面に基づいて説明
する。[Example 1] Hereinafter, an example embodying the present invention will be described based on the drawings.
第１図は本発明による一実施例のＬＥＤ取付装置を示す
断面図、第２図はＬＥＤの本体への組付方法を示す説明
図、第３図は本体の基板への取付方法を示す説明図であ
る。Fig. 1 is a sectional view showing an LED mounting device according to an embodiment of the present invention, Fig. 2 is an explanatory diagram showing a method of assembling the LED to the main body, and Fig. 3 is an explanatory diagram showing the method of mounting the main body to the substrate. It is a diagram.
図において、（１）は基板、（２）は基板（１）に形成
された取付孔、（３）はＬＥＤ、（３ａ）はＬＥＤ （
３）の基端に形成された鍔部、（４）はＬＥＤ （３）
のリード線である。In the figure, (1) is the board, (2) is the mounting hole formed in the board (1), (3) is the LED, and (3a) is the LED (
The flange formed at the base end of 3), (4) is an LED (3)
This is the lead wire.
（５）は基板（１）の取付孔（２）に下側から挿入され
た本体であり、合成樹材料により略円柱状に成形されて
いる。（６）は前記本体（５）の基端に鍔状に一体形成
された位置決部であり、基板（１）の下面に当接して本
体（５）の挿入位置を決定している。（７）は前記位置
決部（６）の上方において本体（５）の外周に切込形成
された一対の弾性変形可能な抜止部であり、それらの下
端が基板（５）の上面に係合することにより、本体（５
）の下方への脱落を阻止している。The main body (5) is inserted from below into the mounting hole (2) of the substrate (1), and is formed into a substantially cylindrical shape from a synthetic wood material. Reference numeral (6) denotes a positioning portion integrally formed in the shape of a brim at the base end of the main body (5), which comes into contact with the lower surface of the substrate (1) to determine the insertion position of the main body (5). (7) is a pair of elastically deformable retaining parts that are cut into the outer periphery of the main body (5) above the positioning part (6), and their lower ends engage with the upper surface of the substrate (5). By doing this, the main body (5
) from falling downward.
（８）は本体（５）の上端部に形成された収容部であり
、ここに、前記ＬＥＤ （３）が上方から収容される。(8) is a housing portion formed at the upper end of the main body (5), in which the LED (3) is housed from above.
（９）は前記収容部（８）の内周面より内側へ突出する
ように本体（５）の上端部に切込形成された一対の把持
部であり、収容部（８）内のＬＥＤ Ｃ３）の外周面を
弾性的に把持するとともに、ＬＥＤ （３）の鍔部（３
ａ）を上方から押え保持している。(9) is a pair of gripping parts formed in the upper end of the main body (5) so as to protrude inward from the inner circumferential surface of the housing part (8), and the gripping parts are a pair of gripping parts that are cut into the upper end of the main body (5) so as to protrude inward from the inner circumferential surface of the housing part (8). ) of the LED (3).
a) is held with a press from above.
（１０）は前記把持部（９）の下方において本体（５）
に段状に一体形成された支持部であり、把持部（９）に
把持されたＬＥＤ （３）の基端面を下方から支持して
いる。（１１）は前記支持部（１０）から下方へ貫通す
るように本体（５）に穿設された挿通部であり、ＬＥＤ
（３）のリード線（４）を本体（５）の外部へ導いて
いる。(10) is a main body (5) below the grip part (9).
This is a support part that is integrally formed in a step-like manner and supports the base end surface of the LED (3) held by the grip part (9) from below. (11) is an insertion part bored in the main body (5) so as to penetrate downward from the support part (10), and the LED
The lead wire (4) of (3) is guided to the outside of the main body (5).
次に、上記のように構成された本実施例のＬＥＤ取付装
置の動作を説明する。Next, the operation of the LED mounting device of this embodiment configured as described above will be explained.
まず、ＬＥＤ （３）を本体（５）に組付ける場合には
、第２図の（ａ）に示すように、本体（５）の上方から
ＬＥＤ （３）を収容部（８）内に収容し、リード線（
４）を挿通部（１１）に挿通する。First, when assembling the LED (3) to the main body (5), as shown in FIG. and the lead wire (
4) into the insertion portion (11).
すると、第２図の（ｂ）に示すように、把持部（９）が
ＬＥＤ （３）の鍔部（３ａ）に係合して、自身の弾性
に抗し外方へ押し拡げられる。そして、鍔部（３ａ）と
把持部（９）との係合が解離される位置までＬＥＤ （
３）が下方へ挿入されると、第２図の（ｃ）に示すよう
に、把持部（９）が自身の弾性に従って原形に復帰して
、ＬＥＤ （３）の外周面を弾性的に把持する。また、
このとき、ＬＥＤ （３）の基端面は支持部（１０）に
よって下方から位置決め支持されるとともに、リード線
（４）は挿通部（１１）を介して本体（５）の外部へ導
かれる。これにより、ＬＥＤ （３）が本体（５）上に
正確な位置で確実に組付けられる。Then, as shown in FIG. 2(b), the grip part (9) engages with the collar part (3a) of the LED (3) and is pushed outward against its own elasticity. Then, the LED (
3) is inserted downward, the grip part (9) returns to its original shape according to its own elasticity and elastically grips the outer peripheral surface of the LED (3), as shown in FIG. 2(c). do. Also,
At this time, the base end surface of the LED (3) is positioned and supported from below by the support part (10), and the lead wire (4) is guided to the outside of the main body (5) via the insertion part (11). This ensures that the LED (3) is assembled onto the main body (5) at an accurate position.
次に、ＬＥＤ （３）を組付けた本体（５）を基板（１
）の取付孔（２）に取付ける場合には、第３図の（ａ）
に示すように、基板（１）の下方から本体（５）を取付
孔（２）に挿入する。すると、第３図の（ｂ）に示すよ
うに、抜止部（７）が取付孔（２）の内周面に係合して
、自身の弾性に抗し内方へ彎曲変形される。そして、抜
止部（７）と取付孔（２）との係合が解離される位置ま
で本体（５）が上方へ挿入されると、第３図の（Ｃ）に
示すように、抜止部（７）が自身の弾性に従って原形に
復帰して、基板（１）の上面に係合するとともに、位置
決部（６）が基板（１）の下面に当接する。これにより
、本体（５）の位置決め及び抜止めがなされ、本体（５
）が基板（１）に対して正確な位置で確実に取付けられ
る。なお、ＬＥＤ （３）の交換等に際しては、抜止部
（７）を内側へ変形すれば、ＬＥＤ （３）と共に本体
（５）を基板（１）から容易に取外すことができる。Next, the main body (5) with the LED (3) assembled is attached to the board (1).
) when installing in the mounting hole (2) of (a) in Figure 3.
As shown in , insert the main body (5) into the mounting hole (2) from below the board (1). Then, as shown in FIG. 3(b), the retaining portion (7) engages with the inner circumferential surface of the attachment hole (2) and is bent inward against its own elasticity. When the main body (5) is inserted upward to the position where the engagement between the retaining portion (7) and the mounting hole (2) is released, the retaining portion ( 7) returns to its original shape according to its own elasticity and engages with the upper surface of the substrate (1), and the positioning portion (6) comes into contact with the lower surface of the substrate (1). This positions the main body (5) and prevents it from coming off.
) is reliably attached to the substrate (1) at an accurate position. When replacing the LED (3), the main body (5) together with the LED (3) can be easily removed from the board (1) by deforming the retaining portion (7) inward.
このように、本実施例のＬＥＤ取付装置は、基板（１）
の取付孔（２）に挿入される本体（５）と、基板（１）
の下面に当接して本体（５）を位置決めする位置決部（
６）と、基板（１）の上面に係合して本体（５）を抜止
めする弾性変形可能な抜止部（７）と、本体（５）の上
端部でＬＥＤ（３）を収容する収容部（８）と、その収
容部（８）内のＬＥＤ （３）の外周面を弾性的に把持
する把持部（９）と、その把持部（９）に把持されたＬ
ＥＤ （３）の基端面を支持する支持部（１０）と、Ｌ
ＥＤ （３）のリード線（４）を本体（５）の外部へ導
く挿通部（１１）とを合成樹脂材料で一体的に形成した
ものである。In this way, the LED mounting device of this embodiment is mounted on the substrate (1).
The main body (5) inserted into the mounting hole (2) and the board (1)
The positioning part (
6), an elastically deformable retaining part (7) that engages with the top surface of the substrate (1) and prevents the main body (5) from being removed, and a housing that accommodates the LED (3) at the upper end of the main body (5). (8), a grip part (9) that elastically grips the outer peripheral surface of the LED (3) in the housing part (8), and an L gripped by the grip part (9).
a support portion (10) that supports the proximal end surface of the ED (3);
An insertion portion (11) for guiding the lead wire (4) of the ED (3) to the outside of the main body (5) is integrally formed of a synthetic resin material.
したがって、上記実施例のＬＥＤ取付装置によれば、Ｌ
ＥＤ （３）を収容部（８）に収容するだけのワンタッ
チ操作で、ＬＥＤ （３）−を本体（５）に確実かつ正
確に組付けることができる。また、ＬＥＤ （３）を組
付けた本体（５）を基板（１）の取付孔（２）に挿入す
るだけのワンタッチ操作で、本体（５）を基板（１）に
確実かつ精度よく取付けることができる。Therefore, according to the LED mounting device of the above embodiment, L
The LED (3) can be reliably and accurately assembled to the main body (5) by a one-touch operation of simply housing the ED (3) in the housing part (8). In addition, the main body (5) can be reliably and precisely attached to the board (1) with a one-touch operation by simply inserting the main body (5) with the LED (3) assembled into the mounting hole (2) of the board (1). Can be done.
それ故、ＬＥＤ （３）をフォトトランジスタ（図示略
）に正確な位置及び方向で対向させて、正確な回転検出
または位置検出を行うことができる。しかも、位置決部
（６）、抜止部（７）、収容部（８）、把持部（９）、
支持部（１０）、及び、挿通部（１１）の各構成部分が
本体（５）に一体形成されているので、ホルダを基板に
アウトサート成形していた従来とは異なり、装置全体を
基板（１）とは別個に合成樹脂材料で安価に製作するこ
とができる。Therefore, by arranging the LED (3) to face a phototransistor (not shown) in an accurate position and direction, accurate rotation detection or position detection can be performed. Moreover, the positioning part (6), the retaining part (7), the accommodating part (8), the gripping part (9),
The support part (10) and the insertion part (11) are integrally formed on the main body (5), so unlike the conventional method in which the holder is outsert molded on the board, the entire device is mounted on the board ( Separately from 1), it can be manufactured at low cost from a synthetic resin material.
また、本実施例のＬＥＤ取付装置は基板（１）とは別個
に製作されるものであるから、基板（１）の材質に関係
なく、広範囲の使用が可能である。Furthermore, since the LED mounting device of this embodiment is manufactured separately from the substrate (1), it can be used in a wide range of applications regardless of the material of the substrate (1).
そのうえ、抜止部（７）の下端を適宜量削り落せば、基
板（１）の厚みの変化に対応して、ＬＥＤ（３）を確実
かつ精度よく取付けることができる。Moreover, by cutting off the lower end of the retaining portion (7) by an appropriate amount, the LED (3) can be mounted reliably and accurately in response to changes in the thickness of the substrate (1).
なお、上記実施例のＬＥＤ （３）は鍔部（３ａ）を有
しているが、本発明はこの種のＬＥＤ （３）のみに適
用されるものではなく、鍔部（３ａ）を有しないＬＥＤ
であっても、把持部（９）と支持部（１０）との作用に
より、そのＬＥＤを本体（５）に対し正確な位置で確実
に組付けることができる。しかしながら、上記実施例の
ように、鍔部（３ａ）を有するＬＥＤ （３）の場合は
、その鍔部（３ａ）が把持部（９）により上方から押え
保持されるので、ＬＥＤ （３）の上方への移動を確実
に規制できる。Note that although the LED (3) in the above embodiment has a flange (3a), the present invention is not applied only to this type of LED (3), and it does not have a flange (3a). LED
Even if it is, the LED can be reliably assembled to the main body (5) at an accurate position due to the action of the grip part (9) and the support part (10). However, in the case of the LED (3) having the flange (3a) as in the above embodiment, the flange (3a) is held down from above by the grip (9), so that the LED (3) Upward movement can be reliably regulated.
［発明の効果１
以上のように、本発明のＬＥＤ取付装置は、基板の取付
孔に挿入される本体と、基板の一面に当接して本体を位
置決めする位置決部と、基板の他面に係合して本体を抜
止めする弾性変形可能な抜止部と、本体の先端部でＬＥ
Ｄを収容する収容部と、その収容部内のＬＥＤの外周面
を弾性的に把持する把持部と、その把持部に把持された
ＬＥＤの基端面を支持する支持部と、ＬＥＤのリード線
を本体の外部へ導く挿通部とを合成樹脂材料で一体的に
形成したものであるから、ＬＥＤを本体に一対し、また
、本体を基板に対しそれそぞれワンタッチの操作で簡単
かつ精度よく組付けることができるとともに、装置全体
を合成樹脂材料で安価に製作できるという効果がある。[Effect of the invention 1 As described above, the LED mounting device of the present invention includes a main body inserted into a mounting hole of a board, a positioning part that positions the main body by contacting one surface of the board, and a positioning part that positions the main body by contacting one surface of the board. An elastically deformable retaining part that engages and prevents the main body from falling out, and an LE at the tip of the main body.
D, a holding part that elastically holds the outer peripheral surface of the LED in the holding part, a support part that supports the proximal end surface of the LED held by the holding part, and a lead wire of the LED that is attached to the main body. Since the insertion part that leads to the outside of the LED is integrally formed of synthetic resin material, the LED can be assembled to the main body and the main body can be assembled to the board easily and precisely with one-touch operation. This has the effect that the entire device can be manufactured from synthetic resin material at low cost.
【図面の簡単な説明】
第１図は本発明のＬＥＤ取付装置の一実施例を示す断面
図、第２図は本発明の一実施例におけるＬＥＤの本体へ
の組付方法を示す説明図、第３図は本発明のＬＥＤ取付
装置の一実施例における本体の基板への取付方法を示す
説明図、第４図は従来のＬＥＤ取付装置を示す断面図で
ある。
図において、
１：基板 ２：取付孔
３ ： ＬＥＤ ４ ：リード線５：
本体 ６：位置決部アニ抜止部
８：収容部
９：把持部 １０：支持部
１１：挿通部
である。
なお、図中、同一符号及び同一記号は同一または相当部
分を示すものである。
代理人 弁理士 大音 増雄 外２名
１：基板
２：取付孔
３：ＬＥＤ[Brief Description of the Drawings] Fig. 1 is a sectional view showing an embodiment of the LED mounting device of the present invention, Fig. 2 is an explanatory diagram showing a method of assembling the LED to the main body in an embodiment of the present invention, FIG. 3 is an explanatory diagram showing a method for attaching the main body to a substrate in an embodiment of the LED mounting device of the present invention, and FIG. 4 is a sectional view showing a conventional LED mounting device. In the figure: 1: Board 2: Mounting hole 3: LED 4: Lead wire 5:
Main body 6: Positioning part Ani removal prevention part
8: Accommodating portion 9: Gripping portion 10: Supporting portion 11: Inserting portion. Note that in the drawings, the same reference numerals and symbols indicate the same or equivalent parts. Agent: Patent attorney Masuo Ohone (2 others) 1: Board 2: Mounting hole 3: LED
Claims (1)
に当接して前記本体を位置決めする位置決部と、基板の
他面に係合して本体を抜止めする弾性変形可能な抜止部
と、本体の先端部でＬＥＤを収容する収容部と、前記収
容部内のＬＥＤの外周面を弾性的に把持する把持部と、
前記把持部に把持されたＬＥＤの基端面を支持する支持
部と、ＬＥＤのリード線を本体の外部へ導く挿通部とを
合成樹脂材料で一体的に形成したことを特徴とするＬＥ
Ｄ取付装置。(1) A main body that is inserted into the mounting hole of the board, a positioning part that positions the main body by contacting one side of the board, and an elastically deformable retainer that engages with the other surface of the board to prevent the main body from coming out. a accommodating part that accommodates the LED at the tip of the main body, and a gripping part that elastically grips the outer peripheral surface of the LED in the accommodating part;
An LE characterized in that a support part that supports the proximal end surface of the LED held by the grip part and an insertion part that guides the lead wire of the LED to the outside of the main body are integrally formed of a synthetic resin material.
D mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1268624A JPH03148900A (en) | 1989-10-16 | 1989-10-16 | Led mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1268624A JPH03148900A (en) | 1989-10-16 | 1989-10-16 | Led mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03148900A true JPH03148900A (en) | 1991-06-25 |
Family
ID=17461131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1268624A Pending JPH03148900A (en) | 1989-10-16 | 1989-10-16 | Led mounter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03148900A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017028137A (en) * | 2015-07-24 | 2017-02-02 | 富士機械製造株式会社 | Part mounting apparatus and part mounting method |
| JP2019153817A (en) * | 2019-06-20 | 2019-09-12 | 株式会社Ｆｕｊｉ | Part mounting apparatus and part mounting method |
| CN114144055A (en) * | 2021-11-17 | 2022-03-04 | 江苏开放大学（江苏城市职业学院） | Single-color surface-mounted LED positioning module mounting device and method for computer communication |
-
1989
- 1989-10-16 JP JP1268624A patent/JPH03148900A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017028137A (en) * | 2015-07-24 | 2017-02-02 | 富士機械製造株式会社 | Part mounting apparatus and part mounting method |
| JP2019153817A (en) * | 2019-06-20 | 2019-09-12 | 株式会社Ｆｕｊｉ | Part mounting apparatus and part mounting method |
| CN114144055A (en) * | 2021-11-17 | 2022-03-04 | 江苏开放大学（江苏城市职业学院） | Single-color surface-mounted LED positioning module mounting device and method for computer communication |
| CN114144055B (en) * | 2021-11-17 | 2022-06-24 | 江苏开放大学（江苏城市职业学院） | Single-color surface-mounted LED positioning module mounting device and method for computer communication |
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