JPH02184084A - Led holding device - Google Patents

Led holding device

Info

Publication number
JPH02184084A
JPH02184084A JP1004315A JP431589A JPH02184084A JP H02184084 A JPH02184084 A JP H02184084A JP 1004315 A JP1004315 A JP 1004315A JP 431589 A JP431589 A JP 431589A JP H02184084 A JPH02184084 A JP H02184084A
Authority
JP
Japan
Prior art keywords
board
led
lead
hole
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1004315A
Other languages
Japanese (ja)
Inventor
Shinji Okubo
大久保 真次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1004315A priority Critical patent/JPH02184084A/en
Publication of JPH02184084A publication Critical patent/JPH02184084A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To reliably position the lead of an LED to the lead insertion hole of a board by mounting the mounting leg of a holding device to the mounting hole of the board and positioning the front end open slit of a guide hole of the holding device to the lead insertion hole of the board. CONSTITUTION:Mounting legs 18 of a holding device 8 are forcedly inserted into the mounting hole 7 of a board 5. The lead 3 of an LED 1 is inserted into the lead mounting hole 6 of the board 5. A engagement section 19 is fitted into the edge of the mounting hole 7 in the rear side of the board 5. As a result, the LED 1 can be kept in a fixed state of a constant height with respect to the board 5. At this time, the mounting legs 18 can easily be inserted into the mounting hole 7, and the front end open slit 13 of the guide hole 12 of a holding device 8 can be positioned to the lead insertion hole 6 of the board 5. Therefore, the lead 3 can be inserted into the lead insertion hole 6 easily and reliably.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電話機、インターホン等に使用するLED 
(発光ダイオード)の保持装置に関する。
[Detailed Description of the Invention] Industrial Application Field The present invention is directed to LEDs used in telephones, intercoms, etc.
(Light Emitting Diode) Holding Device.

従来の技術 従来、この種のLEDは基板に対して一定の高さに取り
付ける必要があり、このため、LEDを円柱状、または
角柱状のスペーサを用いて基板に対して一定高さに保持
させている。以下、上記従来技術の一例について図面を
参照しながら説明する。
Conventional technology Conventionally, this type of LED needs to be mounted at a constant height with respect to the substrate, and for this reason, the LED is held at a constant height with respect to the substrate using a cylindrical or prismatic spacer. ing. Hereinafter, an example of the above-mentioned conventional technology will be explained with reference to the drawings.

第3図および第4図に示すようにLED51のリード5
2の中間部に突部53が設けられている。一方、スペー
サ54は円柱状(または角柱状)に形成され、リード5
2を挿通するための溝(または穴)55が形成されてい
る。
Lead 5 of LED 51 as shown in FIGS. 3 and 4.
A protrusion 53 is provided in the middle of the two. On the other hand, the spacer 54 is formed in a cylindrical (or prismatic) shape, and the lead 5
A groove (or hole) 55 for inserting the 2 is formed.

そして、LED51のリード52をスペーサ54の溝5
5に挿通1.、+7−ド52の突部53をスペーサ54
の上面に当接し、この状態でLED51のリード52を
基板56のリード挿通用穴57に挿通させると共に、ス
ペーサ54の下面を基板56に当接することにより、L
ED51の基板56に対する高さを一定にすることがで
きる。
Then, connect the lead 52 of the LED 51 to the groove 5 of the spacer 54.
Insert into 5 1. , the protrusion 53 of the +7- door 52 is connected to the spacer 54.
In this state, the lead 52 of the LED 51 is inserted into the lead insertion hole 57 of the board 56, and the bottom surface of the spacer 54 is brought into contact with the board 56.
The height of the ED 51 relative to the substrate 56 can be made constant.

発明が解決しようとする課題 しかしながら、上記のような従来技術では、LED51
と基板56との位置決めは、LED51のリード52と
基板56の穴57により行なわれているため、ガタがあ
り、LED51が曲がり、正確な位置に取り付けるのが
困難であった。特に角形のLED51の場合には、その
曲がりが顕著となり、外観に劣る。また、LED51の
リード52がスペーサ54に固定状態に保持されていな
いため、LED51のリード52を基板56の穴57に
挿入する際、スペーサ54を脱落したり、しかも、LE
D51のリード52がスペーサ閘に隠れて見にくく、基
板56の穴57に挿入しにくい。また、LED51が抜
は止め状態に保持されていないため、リード52を基板
56の穴57に挿入した後、半田付けを行なうまでの間
で基板51を移動したり、反転させると、LED51が
基板56から脱落してしまい、また、半田付けの際、基
板56を反転させることにより、LED51が基板56
から脱落したり、浮き上がってしまう。デイツプによる
半田付けにおいても、デイツプ槽を移動する際の振動等
により、LED51が基板56から浮き上がった状態で
半田付けされてしまうなどの課題があった。
Problems to be Solved by the Invention However, in the prior art as described above, the LED 51
Since the positioning between the LED 51 and the substrate 56 is performed using the leads 52 of the LED 51 and the holes 57 of the substrate 56, there is play and the LED 51 is bent, making it difficult to attach it to an accurate position. Particularly in the case of a rectangular LED 51, the bending becomes noticeable and the appearance is poor. Furthermore, since the lead 52 of the LED 51 is not held in a fixed state by the spacer 54, when the lead 52 of the LED 51 is inserted into the hole 57 of the board 56, the spacer 54 may fall off, and the LE
The lead 52 of the D51 is hidden in the spacer hole, making it difficult to see and difficult to insert into the hole 57 of the board 56. Further, since the LED 51 is not held in a state where it is not removed, if the board 51 is moved or reversed after inserting the lead 52 into the hole 57 of the board 56 and before soldering, the LED 51 will be removed from the board. 56, and by reversing the board 56 during soldering, the LED 51 may fall off the board 56.
It may fall off or float up. Soldering using a dip also has a problem in that the LED 51 is soldered in a state that it is lifted off the board 56 due to vibrations when moving the dip tank.

本発明は、このような従来技術の課題を解決するもので
あり、LEDのリードを基板に対して容易に位置決めす
ることができ、しかも、LEDのリードを基板の穴に対
して容易に、かつ確実に挿入することができ、また、L
EDのリードを基板に半田付けする際等にLEDが基板
から脱落したり、浮き上がるのを防止することができる
ようにしたLEDの保持装置を提供することを目的とす
るものである。
The present invention solves the problems of the prior art, and it is possible to easily position the LED leads with respect to the board, and also to easily position the LED leads with respect to the holes in the board. It can be inserted securely, and the L
It is an object of the present invention to provide an LED holding device that can prevent the LED from falling off or floating up from the board when the leads of the ED are soldered to the board.

課題を解決するための手段 本発明は、上記目的を達成するために、LEDの本体部
に突設された突出部を受ける受け部、弾性変形可能に設
けられた保持片、この保持片に形成され、上記受け部と
協力して上記突出部を挾持する係合部、これら係合部お
よび受け部の後方で先端開放口側に至るに従い次第に狭
くなるテーパー状に形成され、上記LEDのリードを案
内して挿通させる案内穴を有する保持部と、この保持部
の外側で弾性変形可能に設けられ、基板に形成された取
り付け穴に挿通される取り付け足と、この取り付け足に
形成され、この取り付け足の弾性を利用して上記基板の
取り付け穴の縁部に係合され、この係合状態で上記基板
に形成されたリード挿通用穴に上記案内穴の先端開放口
を位置合わせする係合部を備えたものである。
Means for Solving the Problems In order to achieve the above object, the present invention provides a receiving part for receiving a protrusion protruding from the main body of an LED, a holding piece provided to be elastically deformable, and a holding piece formed on the holding piece. an engaging part that cooperates with the receiving part to clamp the protruding part, and a tapered shape that gradually becomes narrower toward the open end side behind these engaging parts and the receiving part, and the lead of the LED. a holding part having a guide hole for guiding and inserting; a mounting foot provided elastically deformable on the outside of the holding part and inserted into a mounting hole formed in the substrate; an engaging part that is engaged with the edge of the mounting hole of the board using the elasticity of the foot, and in this engaged state aligns the open end of the guide hole with the lead insertion hole formed in the board; It is equipped with the following.

作用 本発明は、上記のような構成により次のような作用を有
する。すなわち、LEDのリードを保持片および受け部
の内側を通って案内穴に挿通させると共に、LEDの本
体部を保持片の係合部に対して押圧することにより保持
片の弾性変形を利用して本体部の突出部を係合部の内方
へ強制的に挿入し、突出部を受け部と係合部により固定
状態に保持することができる。このようにLEDの突出
部を固定状態に保持した後、取り付け足をその弾性変形
を利用して基板の堆り付け穴に強性的に挿通させて係合
部を取り付け穴の縁部に係合する場合は勿論のこと、取
り付け足を上記のように基板の取り付け穴に取り付けた
後、上記のようにLEDの突出部を受け部と係合部によ
り固定状態に保持する場合にも、基板のリード挿通用穴
に上記案内穴の先端開放口を位置合わせすることができ
、リードをリード挿通用穴に簡単に、かつ確実に挿通さ
せることができる。
Effects The present invention has the following effects due to the above structure. That is, by inserting the LED lead into the guide hole through the inside of the holding piece and the receiving part, and pressing the main body of the LED against the engaging part of the holding piece, the elastic deformation of the holding piece is utilized. The protruding portion of the main body portion can be forcibly inserted into the engaging portion, and the protruding portion can be held in a fixed state by the receiving portion and the engaging portion. After holding the protruding part of the LED in a fixed state in this way, the mounting foot is forcefully inserted into the mounting hole of the board using its elastic deformation, and the engaging part is engaged with the edge of the mounting hole. Not only when the mounting feet are attached to the mounting holes of the board as described above, but also when the protrusion of the LED is held in a fixed state by the receiving part and the engaging part as described above. The open end of the guide hole can be aligned with the lead insertion hole, and the lead can be easily and reliably inserted into the lead insertion hole.

実施例 以下、本発明の実施例について図面を参照しながら説明
する。
EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

第1図および第2図は本発明の一実施例におけるLED
の保持装置を示し、第1図はLEDを保持する前の状態
の斜視図、第2図はLEDを保持した状態の断面図であ
る。
FIG. 1 and FIG. 2 show an LED in an embodiment of the present invention.
FIG. 1 is a perspective view of the holding device before holding the LED, and FIG. 2 is a sectional view of the holding device holding the LED.

第1図および第2図に示すようにLEDIは本体部2よ
りリード3が突出され、本体部2は図示例では、偏平な
角形に形成され、その幅広の面における基部側にそれぞ
れ突出部4が一体に設けられている。基板5には複数の
LEDlのリード3を挿通ずるリード挿通用穴6が形成
されると共に、一対の取り付け穴7が形成されている。
As shown in FIGS. 1 and 2, the LEDI has a lead 3 protruding from a main body 2. In the illustrated example, the main body 2 is formed into a flat rectangular shape, and protrusions 4 are formed on the base side of the wide surface thereof. are integrated. A lead insertion hole 6 through which the leads 3 of a plurality of LEDs are inserted is formed in the board 5, and a pair of attachment holes 7 are formed in the board 5.

LEDIは保持装置8により基板5に対して一定の高さ
となるように固定状態に保持される。保持装置8は合成
樹脂製で、図示例では3個0LEDIを保持し得るよう
に3個の保持部9が連結部10により一体に連結されて
いる。各保持部9は保持穴11の後方に案内穴12が形
成され、案内穴12は基部より先端開放口13側に至る
に従い次第に狭くなるテーパー状に形成され、LEDI
のり一ド3を容易に挿通し得るようになっている。保持
穴11における保持部9の連結方向の対向壁内面に上記
突出部4の下面を受ける受け部14が形成され、受け部
14を挾む対向壁の中央部には各一対の縦方向の細長い
溝15が形成され、溝15の間に弾性変形可能な保持片
16が形成され、各保持片16の先端部内側には上記突
出部4の上面に係合し得る係合部17が突設されている
。各係合部17はその上部側が上方に至るに従い次第に
低くなるような斜面に形成され、下部側も下方に至るに
従い次第に低くなるような斜面に形成されている。両側
の保持部9における保持部9の連結方向の外面にはそれ
ぞれ弾性変形可能な取り付け足18が一体に設けられ、
各取り付け足18には基板5の取り付け穴7の縁部に係
合し得る係合部19が突設されている。各係合部19は
下方に至るに従い次第に低くなるように傾斜されている
The LEDI is fixedly held at a constant height with respect to the substrate 5 by a holding device 8. The holding device 8 is made of synthetic resin, and in the illustrated example, three holding parts 9 are integrally connected by a connecting part 10 so as to be able to hold three 0LEDIs. Each holding portion 9 has a guide hole 12 formed behind the holding hole 11, and the guide hole 12 is formed in a tapered shape that gradually becomes narrower from the base toward the tip opening 13 side.
The glue 3 can be inserted easily. A receiving part 14 for receiving the lower surface of the protruding part 4 is formed on the inner surface of the opposing wall in the connecting direction of the holding part 9 in the holding hole 11, and a pair of longitudinally elongated holes are formed in the central part of the opposing wall sandwiching the receiving part 14. A groove 15 is formed, an elastically deformable holding piece 16 is formed between the grooves 15, and an engaging part 17 that can engage with the upper surface of the protruding part 4 is provided protruding inside the tip of each holding piece 16. has been done. The upper side of each engaging portion 17 is formed into a slope that gradually becomes lower as it goes upward, and the lower side is also formed as a slope that gradually becomes lower as it goes downward. Elastically deformable attachment legs 18 are integrally provided on the outer surfaces of the holding parts 9 on both sides in the connection direction of the holding parts 9, respectively.
Each mounting leg 18 is provided with a protruding engaging portion 19 that can engage with the edge of the mounting hole 7 of the board 5. Each engaging portion 19 is inclined so as to become gradually lower toward the bottom.

上記取り付け足18、取り付け穴7、案内穴12の先゛
端開放口13およびリード挿通用穴6は、取り付け足1
8を取り付け穴7に取り付けた状態で案内穴12の先端
開放ロエ3がリード挿通用穴6に位置合わせされるよう
に設定されている。
The mounting foot 18, the mounting hole 7, the open end opening 13 of the guide hole 12, and the lead insertion hole 6 are connected to the mounting foot 1.
8 is attached to the attachment hole 7, the open end loop 3 of the guide hole 12 is set to be aligned with the lead insertion hole 6.

次に上記実施例によるLEDlの保持動作について説明
する。
Next, the holding operation of the LED1 according to the above embodiment will be explained.

まず、LEDIのリード3を保持装置8の保持穴11、
すなわち、保持片16および受け部14の内側を通って
案内穴12に挿通させると共に、LEDIの本体部2を
保持片16の係合部17に対して押圧することにより、
保持片16の弾性変形を利用して本体部2の突出部4を
係合部17の内方へ強制的に挿入することができ、これ
により、突出部4の下面と上面を受け部14と係合部1
7により挾持して固定状態に保持することができる。こ
のとき、LEDlの本体部2は係合部17の斜面を利用
してその内方へ容易に挿入することができる。次に、保
持装置8の取り付け足18をその弾性変形の利用により
基盤5の取り付け穴7に強制的に挿通させると共に、L
EDIのり一ド3を基板5のリード挿通用穴6に挿通さ
せ、係合部工9を基板5の裏面において取り付け穴7の
縁部に係合することにより、保持装置8、すなわちLE
DIを基板5に対して一定高さで固定状態に保持するこ
とができる。このとき、取り付け足18は係合部19の
傾斜部を利用して取り付け穴7に容易に挿入することが
でき、また、保持装置8の案内穴12の先端開放口13
を基板5のリード挿通穴6に位置合わせすることができ
るので、リード3をリード挿通用穴6に簡単に、かつ確
実に挿通させることができる。
First, attach the LEDI lead 3 to the holding hole 11 of the holding device 8,
That is, by passing through the inside of the holding piece 16 and the receiving part 14 and inserting it into the guide hole 12, and pressing the main body part 2 of the LEDI against the engaging part 17 of the holding piece 16,
The protruding part 4 of the main body part 2 can be forcibly inserted into the engaging part 17 by utilizing the elastic deformation of the holding piece 16, whereby the lower surface and the upper surface of the protruding part 4 are connected to the receiving part 14. Engagement part 1
7 to hold it in a fixed state. At this time, the main body part 2 of the LED 1 can be easily inserted into the engaging part 17 by using the slope thereof. Next, the mounting foot 18 of the holding device 8 is forcibly inserted into the mounting hole 7 of the base plate 5 by utilizing its elastic deformation, and the L
By inserting the EDI glue 3 into the lead insertion hole 6 of the board 5 and engaging the engaging part 9 with the edge of the mounting hole 7 on the back side of the board 5, the holding device 8, that is, the LE
The DI can be held fixed at a constant height relative to the substrate 5. At this time, the mounting foot 18 can be easily inserted into the mounting hole 7 by using the inclined part of the engaging part 19, and the opening 13 at the tip of the guide hole 12 of the holding device 8 can be easily inserted into the mounting hole 7.
Since the leads 3 can be aligned with the lead insertion holes 6 of the substrate 5, the leads 3 can be easily and reliably inserted into the lead insertion holes 6.

なお、上記実施例では、LEDIを保持装置8に固定状
態に保持させた後、保持装置8を基板5に取り付けるよ
うにしているが、あらかじめ、保持装置8を基板5に取
り付けた後、保持装置8にLEDIを固定状態に保持さ
せると共に、LEDlのリード3を基板5のリード挿通
用穴6に挿通させるようにしてもよく、この場合、LE
Dlのリード3は保持装置8のテーパー状の案内穴12
により案内され、しかも、基板5のリード挿通用穴6に
案内穴12の先端開放口13が位置合わせされているの
で、LEDlのり−ド3をリード挿通用穴6に簡単に、
かつ確実に挿通させることができる。
In the above embodiment, the holding device 8 is attached to the board 5 after the LEDI is held in a fixed state by the holding device 8. However, after the holding device 8 is attached to the board 5 in advance, the holding device 8 is The LED 8 may be held in a fixed state, and the lead 3 of the LED 1 may be inserted into the lead insertion hole 6 of the board 5. In this case, the LED
The lead 3 of Dl is connected to the tapered guide hole 12 of the holding device 8.
Moreover, since the open end 13 of the guide hole 12 is aligned with the lead insertion hole 6 of the board 5, the LED board 3 can be easily inserted into the lead insertion hole 6.
And it can be inserted reliably.

発明の効果 以上述べたように本発明によれば、保持装置の取り付け
足を基板の取り付け穴に取り付けることにより保持装置
の案内穴の先端開放口を基板のり一ド挿通穴に位置合わ
せすることができるので、保持装置にLEDを先に保持
させる場合は勿論のこと、後から保持させる場合にも、
LEDのリードが基板のリード挿通用穴に確実に位置合
わせされ、LEDを曲がることなく、容易に、かつ確実
に取り付けることができ、外観を向上させることができ
る。また、LEDを保持装置、すなわち基板に固定状態
に保持することができるので、半田付け前の移動、作業
中におけるLEDの脱落を防止することができ、また、
半田付け時に基板を反転させても、LEDの脱落、基板
からの浮き上がりを防止することができ、また、デイツ
プ時に槽を移動する際に発生する振動によるLEDが基
板から浮き上がるのを防止することができる。
Effects of the Invention As described above, according to the present invention, by attaching the mounting feet of the holding device to the mounting holes of the board, it is possible to align the open end of the guide hole of the holding device with the glue insertion hole of the board. Therefore, not only can the holding device hold the LED first, but also when the holding device holds the LED later.
The LED leads are reliably aligned with the lead insertion holes of the board, the LED can be easily and reliably attached without bending, and the appearance can be improved. In addition, since the LED can be held in a fixed state on the holding device, that is, the board, it is possible to prevent the LED from moving before soldering or falling off during the soldering process.
Even if the board is turned over during soldering, it can prevent the LED from falling off or rising from the board, and it can also prevent the LED from lifting from the board due to vibrations that occur when moving the bath during soldering. can.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本発明の一実施例におけるLED
の保持装置を示し、第1図はLEDを保持する前の状態
の斜視図、第2図はLEDを保持した状態の断面図、第
3図および第4図は従来のLEDの保持装置を示し、第
3図はLEDを保持する前の状態の斜視図、第4図はL
EDを保持した状態の断面図である。 1・・・LED、2・・・本体部、3・・・リード、4
・・・突出部、5・・・基板、6・・・リード挿通用穴
、7・・・取り付け穴、8・・・保持装置、9・・・保
持部、12・・・案内穴、13・・・先端開放口、14
・・・受け部、16・・・保持片、17・・・係合部、
18・・・取り付け足、工9・・・係合部。 第 図
FIG. 1 and FIG. 2 show an LED in an embodiment of the present invention.
Fig. 1 is a perspective view of a state before holding an LED, Fig. 2 is a sectional view of a state in which an LED is held, and Figs. 3 and 4 show a conventional holding device for an LED. , Figure 3 is a perspective view of the state before holding the LED, Figure 4 is the L
It is a sectional view of a state where ED is held. 1... LED, 2... Main body, 3... Lead, 4
...Protruding part, 5... Board, 6... Lead insertion hole, 7... Mounting hole, 8... Holding device, 9... Holding part, 12... Guide hole, 13 ...Tip opening, 14
...Receiving part, 16... Holding piece, 17... Engaging part,
18... Attachment foot, work 9... Engagement part. Diagram

Claims (1)

【特許請求の範囲】[Claims] LEDの本体部に突設された突出部を受ける受け部、弾
性変形可能に設けられた保持片、この保持片に形成され
、上記受け部と協力して上記突出部を挾持する係合部、
これら係合部および受け部の後方で先端開口側に至るに
従い次第に狭くなるテーパー状に形成され、上記LED
のリードを案内して挿通させる案内穴を有する保持部と
、この保持部の外側で弾性変形可能に設けられ、基板に
形成された取り付け穴に挿通される取り付け足と、この
取り付け足に形成され、この取り付け足の弾性を利用し
て上記基板の取り付け穴の縁部に係合され、この係合状
態で上記基板に形成されたリード挿通用穴に上記案内穴
の先端開放口を位置合わせする係合部を備えたLEDの
保持装置。
a receiving part for receiving a protrusion protruding from the main body of the LED; a holding piece provided to be elastically deformable; an engaging part formed on the holding piece and cooperating with the receiving part to clamp the protruding part;
It is formed in a tapered shape that gradually becomes narrower as it reaches the tip opening side behind these engaging parts and receiving parts, and the above-mentioned LED
a holding part having a guide hole through which the lead is guided and inserted; a mounting foot provided on the outside of the holding part so as to be elastically deformable and inserted into a mounting hole formed in a substrate; The elasticity of the mounting foot is used to engage the edge of the mounting hole of the board, and in this engaged state, the open end of the guide hole is aligned with the lead insertion hole formed in the board. An LED holding device including an engaging part.
JP1004315A 1989-01-11 1989-01-11 Led holding device Pending JPH02184084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1004315A JPH02184084A (en) 1989-01-11 1989-01-11 Led holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1004315A JPH02184084A (en) 1989-01-11 1989-01-11 Led holding device

Publications (1)

Publication Number Publication Date
JPH02184084A true JPH02184084A (en) 1990-07-18

Family

ID=11581043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1004315A Pending JPH02184084A (en) 1989-01-11 1989-01-11 Led holding device

Country Status (1)

Country Link
JP (1) JPH02184084A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100495103B1 (en) * 2002-02-23 2005-06-14 주식회사 대한전광 A LED lamp for surface-mouting and a manufacturing method thereof
KR101066199B1 (en) * 2009-04-09 2011-09-21 주식회사 한국나노텍 Support stand for led

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831583B2 (en) * 1975-02-07 1983-07-07 日本電信電話株式会社 color display system
JPS6320461B2 (en) * 1982-02-25 1988-04-27 Japan Atomic Energy Res Inst

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831583B2 (en) * 1975-02-07 1983-07-07 日本電信電話株式会社 color display system
JPS6320461B2 (en) * 1982-02-25 1988-04-27 Japan Atomic Energy Res Inst

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100495103B1 (en) * 2002-02-23 2005-06-14 주식회사 대한전광 A LED lamp for surface-mouting and a manufacturing method thereof
KR101066199B1 (en) * 2009-04-09 2011-09-21 주식회사 한국나노텍 Support stand for led

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