JPH03145192A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH03145192A JPH03145192A JP28350889A JP28350889A JPH03145192A JP H03145192 A JPH03145192 A JP H03145192A JP 28350889 A JP28350889 A JP 28350889A JP 28350889 A JP28350889 A JP 28350889A JP H03145192 A JPH03145192 A JP H03145192A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- laser beam
- oxidizing gas
- irradiated
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 claims abstract description 36
- 230000001590 oxidative effect Effects 0.000 claims abstract description 34
- 239000007789 gas Substances 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 238000002347 injection Methods 0.000 claims description 26
- 239000007924 injection Substances 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 2
- 239000002341 toxic gas Substances 0.000 claims description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 12
- 230000004907 flux Effects 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 abstract description 10
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 8
- 235000011187 glycerol Nutrition 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 241000933095 Neotragus moschatus Species 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔概要〕
レーザ光を照射することで半田の溶融を行うように形成
された半田付装置に関し、
半田付は後の洗浄工程を不要にすることで長期の安定し
た品質が得られるようにすることを目的とし、
プリント基板を収納し、非酸化性ガスの供給が行われる
チャンバと、該チャンバに内設され、還元液の噴射を行
うノズルとを具備し、該チャンバの窓を透過することで
レーザ光を照射させ、非酸化性ガスの雰囲気中に於いて
半田の溶融が行われるようにするか、または、レーザ光
の照射が行われる照射路と、該照射路に非酸化性ガスを
噴射させる第１の噴射口と、該第１の噴射口から噴射さ
れる非酸化性ガスより圧力の低い非酸化性ガスおよび還
元液のそれぞれを該第１の噴射口の外周に噴射させる第
２と第３の噴射口とが設けられたヘッドを備え、該ヘッ
ドをプリント基板の所定個所に対向することで配設し、
該照射路を通して該レーザ光を照射させ、非酸化性ガス
の雰囲気中に於いて半田の溶融が行われるように構成す
る。[Detailed Description of the Invention] [Summary] Regarding a soldering device formed to melt solder by irradiating it with laser light, soldering can achieve stable quality over a long period of time by eliminating the need for a subsequent cleaning process. The chamber is equipped with a chamber that accommodates a printed circuit board and is supplied with a non-oxidizing gas, and a nozzle that is installed inside the chamber and that sprays a reducing solution. The laser beam is irradiated by passing through the window of the window, and the solder is melted in an atmosphere of non-oxidizing gas, or the irradiation path where the laser beam is irradiated and the irradiation path are a first injection port that injects a non-oxidizing gas into the first injection port, and a non-oxidizing gas and a reducing liquid each having a pressure lower than that of the non-oxidizing gas injected from the first injection port. A head is provided with second and third injection ports for ejecting the liquid on the outer periphery, and the head is disposed so as to face a predetermined location on a printed circuit board,
The laser beam is irradiated through the irradiation path, and the solder is melted in a non-oxidizing gas atmosphere.
（産業上の利用分野〕
本発明はレーザ光を照射することで半田の溶融を行うよ
うに形成された半田付装置に関する。(Industrial Application Field) The present invention relates to a soldering device configured to melt solder by irradiating it with laser light.
電子機器の構成に広く用いられているプリント基板には
、半導体素子などの電子部品が半田付けされることで実
装が行われている。2. Description of the Related Art Electronic components such as semiconductor elements are mounted on printed circuit boards that are widely used in the construction of electronic devices by soldering them.
このような半田付けに際しては、一般的に、レーザ光を
照射させ、半田を溶融させる、一方、溶融された半田の
濡れ性を得るため、フラックスが使用されている。In such soldering, a laser beam is generally irradiated to melt the solder, while a flux is used to improve the wettability of the molten solder.
しかし、このようなフラックスには塩素などの腐食性の
高い元素が含まれているため、長期の安定した品質を得
るには、半田付は後、このようなフラックスを除去する
ことが必要となる。However, such fluxes contain highly corrosive elements such as chlorine, so in order to obtain stable quality over the long term, it is necessary to remove such fluxes after soldering. .
従来は第５図の従来の説明図に示すように行われていた
。第５図の（ａ） （ｂ）は側面図である。Conventionally, this was done as shown in the conventional explanatory diagram of FIG. FIGS. 5(a) and 5(b) are side views.
第５図の（ａ）に示すように、プリント基板２の予備半
田５Ａが施されたパッド２Ａに実装すべき電子部品３の
リード端子３Ａを重ね合わせ、パッド２Ａに重ね合わせ
られたリード端子３Ａを光源２０から出力されるレーザ
光６を光学系２１によって集束して、照射することで予
備半田５Ａを溶融させ、リード端子３Ａをパッド２Ａに
半田付けすることが行われていた。As shown in FIG. 5(a), the lead terminal 3A of the electronic component 3 to be mounted is overlapped with the pad 2A on which the preliminary solder 5A of the printed circuit board 2 has been applied, and the lead terminal 3A is overlapped with the pad 2A. The laser beam 6 output from the light source 20 is focused by the optical system 21 and irradiated to melt the preliminary solder 5A and solder the lead terminal 3A to the pad 2A.
したがって、（ｂ）に示すように溶融された半田Ｓによ
ってリード端子３Ａとパッド２Ａとが固着され、プリン
ト基板２に対して電子部品３の実装が行われていた。Therefore, as shown in (b), the lead terminals 3A and the pads 2A are fixed by the melted solder S, and the electronic component 3 is mounted on the printed circuit board 2.
また、このようなレーザ光６によって予備半田ＳＡを溶
融させることでリード端子３＾とパッド２＾とを固着さ
せる構成では、実際には、リード端子３Ａまたはパッド
２Ａの表面に酸化膜が形成されていたり、或いは、油分
などが付着されていることがあり、溶融された半田５が
リード端子３Ａまたはパッド２Ａに溶着されなことが生
じる。Furthermore, in the configuration in which the lead terminal 3^ and the pad 2^ are fixed by melting the preliminary solder SA with the laser beam 6, an oxide film is actually formed on the surface of the lead terminal 3A or the pad 2A. The solder 5 may not be welded to the lead terminal 3A or the pad 2A because the solder 5 may not be welded to the lead terminal 3A or the pad 2A.
そこで、リード端子３Ａまたはパッド２Ａに対する半田
５の濡れ性を良くし、リード端子３Ａとパッド２Ａとの
固着が確実になるよう、通常、フラックスが塗布されて
いる。Therefore, flux is usually applied to improve the wettability of the solder 5 to the lead terminal 3A or the pad 2A and to ensure that the lead terminal 3A and the pad 2A are firmly fixed.
しかし、このようなフラックスは、塩素などの腐食性の
元素が含まれているため、半田付は後は、腐食性が生じ
ることのないようフラックスを除去するための洗浄が行
われていた。However, since such flux contains corrosive elements such as chlorine, after soldering, cleaning is performed to remove the flux to prevent corrosive properties.
このような洗浄には、−Ｓ的に、フロン液、クロロセン
液による洗浄が行われているが、有害であるため、水に
よる洗浄が行われるようになった。For such cleaning, cleaning with chlorofluorocarbon liquid and chlorocene liquid has been carried out, but since it is harmful, cleaning with water has come to be carried out.
しかし、水洗による場合は、吸湿性による問題が生じる
。However, when washing with water, problems arise due to hygroscopicity.
したがって、水洗後は乾燥工程によって乾燥させること
が必要となり、工数が増加する一方、水洗では、フラッ
クスを完全に除去することが困難で、腐食が発生する問
題を有していた。Therefore, after washing with water, it is necessary to perform a drying process, which increases the number of man-hours, while washing with water has the problem that it is difficult to completely remove the flux and corrosion occurs.
そこで、本発明では、半田付は後の洗浄工程を不要にす
ることで長期の安定した品質が得られるようにすること
を目的とする。Therefore, an object of the present invention is to make it possible to obtain stable quality over a long period of time by eliminating the need for a cleaning process after soldering.
第１図は水筒１の発明の原理説明図、第２図は水筒２の
発明の原理説明図である。FIG. 1 is an explanatory diagram of the principle of the invention of the water bottle 1, and FIG. 2 is an explanatory diagram of the principle of the invention of the water bottle 2.
第１図および第２図に示すように、プリント基板２を収
納し、非酸化性ガス７の供給が行われるチャンバ１と、
該チャンバ１に内設され、還元液８の噴射を行うノズル
４とを具備し、該チャンバ１の窓を透過することでレー
ザ光６を照射させ、非酸化性ガス７の雰囲気中に於いて
半田５の溶融が行われるように構成するか、または、レ
ーザ光６の照射が行われる照射路と、該照射路１１に非
酸化性ガス７を噴射させる第１の噴射口１２と、該第１
の噴射口１２から噴射される非酸化性ガス７より圧力の
低い非酸化性ガス７Ａおよび還元液８のそれぞれを該第
１の噴射口１２の外周に噴射させる第２と第３の噴射口
１３．１４とが設けられたヘッド１０を備え、該ヘッド
１０をプリント基板２０所定個所に対向することで配設
し、該照射路１１を通して該レーザ光６を照射させ、非
酸化性ガス７．７Ａ の雰囲気中に於いて半田５の溶
融が行われるように構成する。As shown in FIGS. 1 and 2, a chamber 1 houses a printed circuit board 2 and is supplied with a non-oxidizing gas 7;
The chamber 1 is equipped with a nozzle 4 for injecting a reducing liquid 8, and a laser beam 6 is irradiated by passing through the window of the chamber 1 in an atmosphere of a non-oxidizing gas 7. The configuration is such that the solder 5 is melted, or the irradiation path through which the laser beam 6 is irradiated, the first injection port 12 through which the non-oxidizing gas 7 is injected into the irradiation path 11, and the first 1
second and third injection ports 13 for injecting non-oxidizing gas 7A and reducing liquid 8, each of which has a lower pressure than the non-oxidizing gas 7 injected from the injection port 12, onto the outer periphery of the first injection port 12; The head 10 is disposed to face a predetermined location of the printed circuit board 20, and the laser beam 6 is irradiated through the irradiation path 11, and the non-oxidizing gas 7.7 A is provided. The structure is such that the solder 5 is melted in this atmosphere.
このように構成することによって前述の課題は解決され
る。With this configuration, the above-mentioned problem is solved.
〔作用］
即ち、非酸化性ガス７が充満されたチャンバ１にプリン
ト基板２を収納し、半田付けすべき個所に対して還元液
８を噴射させ、レーザ光６を照射することで、非酸化性
ガス７の雰囲気中において半田５の溶融が行われるよう
にするか、または、レーザ光６を照射らせる照射路１１
と、非酸化性ガス７を噴射させる第１の噴射口１２と、
該第１の噴射口１２から噴射される非酸化性ガス７より
圧力の低い非酸化性ガス７＾および還元液８のそれぞれ
を噴射させる第２と第３の噴射口１３．１４を備えたヘ
ッド１０をプリント基板２の半田付けすべき所定個所に
配設し、照射路１１を通してレーザ光６を照射し、非酸
化性ガス７．７八 の雰囲気中に於いて半田５の溶融
が行わるようにしたもので娶る。[Operation] That is, the printed circuit board 2 is stored in the chamber 1 filled with the non-oxidizing gas 7, and the reducing liquid 8 is injected onto the parts to be soldered, and the laser beam 6 is irradiated to remove the non-oxidizing gas. An irradiation path 11 for melting the solder 5 in an atmosphere of a toxic gas 7 or for irradiating the laser beam 6
and a first injection port 12 for injecting the non-oxidizing gas 7;
A head equipped with second and third injection ports 13 and 14 for injecting non-oxidizing gas 7^ and reducing liquid 8, each having a lower pressure than the non-oxidizing gas 7 injected from the first injection port 12. 10 is placed at a predetermined location on the printed circuit board 2 to be soldered, and the laser beam 6 is irradiated through the irradiation path 11 so that the solder 5 is melted in an atmosphere of non-oxidizing gas 7.78. Marry what you have.
そこで、レーザ光６の照射によって半田５が溶融される
時、酸化されることがなく、しかも半田付は後、還元液
８が気化され、残留することがないようにすることがで
きる。Therefore, when the solder 5 is melted by irradiation with the laser beam 6, it is not oxidized, and furthermore, the reducing liquid 8 is not vaporized and remains after soldering.
したがって、従来のような半田付は後のフラックスを除
去する洗浄工程が不要となり、工数の削減が図れる。Therefore, conventional soldering does not require a subsequent cleaning process to remove flux, and the number of man-hours can be reduced.
以下本発明を第３図および第４図を参考に詳細に説明す
る。第３図は水筒１の発明による一実施例の側面断面図
、第４図は水筒２の発明による一実施例の側面断面図で
ある。企図を通じて、同一符号は同一対象物を示す。The present invention will be explained in detail below with reference to FIGS. 3 and 4. FIG. 3 is a side sectional view of an embodiment of the water bottle 1 according to the invention, and FIG. 4 is a side sectional view of an embodiment of the water bottle 2 according to the invention. Like numbers refer to like objects throughout the design.
第３図に示すように、電子部品３のリード端子３Ａが所
定の半田付けすべきバッド２Ａに位置決めされたプリン
ト基板２をチャンバ１に収納し、チャンバ１の供給口Ｉ
Ｃからは窒素ガスＮ２などの非酸化ガス７を供給する一
方、窓１Ａに張架された透明材より戒るカバーＩＢを透
過することで光源２ｏから出力されたレーザ光６が光学
系２１によって集束されるように構成したものである。As shown in FIG. 3, the printed circuit board 2 with the lead terminals 3A of the electronic component 3 positioned on the predetermined soldering pads 2A is housed in the chamber 1, and the supply port I of the chamber 1 is placed in the chamber 1.
While a non-oxidizing gas 7 such as nitrogen gas N2 is supplied from C, the laser beam 6 output from the light source 2o is transmitted through the transparent cover IB stretched over the window 1A by the optical system 21. It is configured to be focused.
また、チャンバ１にはタンク２２に貯溜されたグリセリ
ン、アルコールなどの還元液８を噴射させるノズル４が
内設されている。Further, the chamber 1 is provided with a nozzle 4 for injecting a reducing liquid 8 such as glycerin or alcohol stored in a tank 22.
そこで、ホース２３Ａを介して供給口ＩＣからは窒素ガ
スＮ２を矢印Ａのようにチャンバ１の内部に供給し、タ
ンク２２からホース２３Ｂを介してグリセリンまたはア
ルコール液をノズル４によって矢印Ｃのように噴射させ
、レーザ光６を照射させることで半田５の溶融を行い、
リード端子３Ａをバッド２Ａに半田付けすることが行わ
れる。Therefore, nitrogen gas N2 is supplied from the supply port IC through the hose 23A to the inside of the chamber 1 as shown by arrow A, and glycerin or alcohol liquid is supplied from the tank 22 through the hose 23B through the nozzle 4 as shown by arrow C. The solder 5 is melted by spraying and irradiating the laser beam 6,
The lead terminal 3A is soldered to the pad 2A.
また、チャンバ１には排気口ＩＤが設けられ、供給口１
Ｃから供給された窒素ガスＮ２と、グリセリンまたはア
ルコール液の気化されたガスの排気を矢印Ｂのように排
出するように形成されている。Further, the chamber 1 is provided with an exhaust port ID, and a supply port 1
The nitrogen gas N2 supplied from C and the vaporized gas of glycerin or alcohol are discharged as shown by arrow B.
このように非酸化ガス７の雰囲気中にレーザ光６を照射
させ、半田５の溶融を行うと、酸化されることなく、か
つ、グリセリンまたはアルコール液の噴射によって半田
５の濡れ性が良く、しかも、半田付は後は、グリセリン
またはアルコール液が気化することで塩素などの残渣を
なくすことができる。When the laser beam 6 is irradiated into the atmosphere of the non-oxidizing gas 7 to melt the solder 5, the solder 5 is not oxidized and the wettability of the solder 5 is good due to the injection of glycerin or alcohol solution. After soldering, residues such as chlorine can be eliminated by vaporizing the glycerin or alcohol solution.
したがって、従来のような半田付は後、残渣されたフラ
ックスを除去する水洗などの洗浄工程は、不要となる。Therefore, the conventional cleaning process such as washing with water to remove residual flux after soldering becomes unnecessary.
また、第４図の場合は、光源２０から出力され、光学系
２１によって集束されるように形成されたレーザ光６を
透過させる透明板１５が設けられた照射路１１と、照射
路１１に窒素ガスＮ！などの非酸化ガス７を噴射させる
第１の噴射口１２と、１の噴射口１２から噴射される窒
素ガスＮ！より圧力の低い窒素ガスＮ２の非酸化ガス７
＾を噴射させる第２の噴射口１３と、グリセリンまたは
アルコール液などの還元液８を噴射させる第３の噴射口
１４とが備えられたヘッド１０によって半田５の溶融を
行うように構成したものである。In the case of FIG. 4, there is an irradiation path 11 provided with a transparent plate 15 that transmits the laser beam 6 output from the light source 20 and formed to be focused by the optical system 21, and a nitrogen irradiation path 11. Gas N! A first injection port 12 that injects a non-oxidizing gas 7 such as nitrogen gas N! Lower pressure nitrogen gas N2 non-oxidizing gas 7
The solder 5 is melted by a head 10 equipped with a second injection port 13 for ejecting ^ and a third injection port 14 for ejecting a reducing liquid 8 such as glycerin or alcohol solution. be.
そこで、タンク２０からホース２３Ｃを介してグリセリ
ンまたはアルコール液を第３の噴射口１４から噴射させ
ると同時にホース２３を介して圧力の高い窒素ガスＮ２
を第１の噴射口１２から、圧力の低い窒素ガスＮ！を第
２の噴射口１２からそれぞれ噴射させ、非酸化ガスの雰
囲気中にレーザ光６を照射し、半田５を溶融させ、リー
ド端子３＾がバッド２Ａに半田付けが行われる。Therefore, glycerin or alcohol liquid is injected from the third injection port 14 from the tank 20 via the hose 23C, and at the same time, high pressure nitrogen gas N2 is injected via the hose 23.
From the first injection port 12, low pressure nitrogen gas N! are injected from the second injection port 12, and the laser beam 6 is irradiated into the non-oxidizing gas atmosphere to melt the solder 5 and solder the lead terminal 3^ to the pad 2A.
この場合は、圧力の高い窒素ガスＮ２が噴射された外周
に圧力の低い窒素ガスＮ２を噴射させることで非酸化ガ
スの雰囲気を形成することが行われることになり、第３
図の構成ようなチャンバ１を設けることなく、構成の簡
素化が図れ、半田付は後は塩素などの残渣が生じること
のないよう前述と同様の効果を得ることができる利点が
ある。In this case, a non-oxidizing gas atmosphere is created by injecting low-pressure nitrogen gas N2 onto the outer circumference where high-pressure nitrogen gas N2 has been injected.
There is an advantage that the structure can be simplified without providing the chamber 1 as shown in the structure, and the same effect as described above can be obtained since no residue such as chlorine is generated after soldering.
以上説明したように、本発明によれば、非酸化ガスの雰
囲気中に、更に、還元液を噴射させることにより半田の
溶融を行うことで、半田付けに際して、半田が酸化する
ことなく半田の濡れ性が良く、しかも、フラックスの残
渣が生じることのないようにすることができる。As explained above, according to the present invention, the solder is melted by further injecting the reducing liquid into the non-oxidizing gas atmosphere, thereby preventing the solder from oxidizing during soldering. It has good properties and can be made free of flux residue.
したがって、従来のような半田付は後のフラックスを除
去する洗浄工程が不要となり、工数の削減および品質の
向上が図れ、実用的効果は大である。Therefore, conventional soldering does not require a subsequent cleaning process to remove flux, reducing man-hours and improving quality, which has great practical effects.
第１図は木筆１の発明の原理説明図。
第２図は木筆２の発明の原理説明図。
第３図は木筆１の発明による一実施例の側面断面図。
第４図は木筆２の発明による一実施例の側面断面図。
第５図は従来の説明図で、（ａ）（ｂ）は側面図を示す
。
図において、
１はチャンバ、 ２はプリント基板。
３は電子部品、 ４はノズル。
５は半田、 ６はレーザ光。
７．７Ａは非酸化性ガス、 ８は還元液１０はヘッド
。
１２は第１の噴射口。
１４は第３の噴射口。
１１は照射路。
１３は第２の噴射口。
３＾はリード端子を示す。
暑
１
図
不冨２０発朗／）原理説明口
第 ２ 口
２１ノ譚１２．０発Ｓ月１＝よる一実う缶づ）すｎイ卵
１ｉｆｆ勾′連わｅコ冨 ４ 口FIG. 1 is an explanatory diagram of the principle of the invention of wood brush 1. FIG. 2 is an explanatory diagram of the principle of the invention of wood brush 2. FIG. 3 is a side sectional view of one embodiment of the invention of the wood brush 1. FIG. 4 is a side sectional view of one embodiment of the invention of the wood brush 2. FIG. 5 is an explanatory diagram of the conventional device, and (a) and (b) show side views. In the figure, 1 is a chamber, and 2 is a printed circuit board. 3 is an electronic component, 4 is a nozzle. 5 is solder, 6 is laser light. 7.7A is a non-oxidizing gas, 8 is a reducing liquid 10 is a head. 12 is the first injection port. 14 is the third injection port. 11 is the irradiation path. 13 is the second injection port. 3^ indicates a lead terminal. Heat 1 Figure Futomi 20 episodes /) Principle explanation part 2 21 stories 12.0 episodes S month 1 = Yoruichi fruit canzu) Suni egg 1iff gradient' continuation ekofu 4 mouths
Claims (1)
子（３Ａ）を位置決めしたプリント基板（２）と、位置
決めされた該リード端子（３Ａ）を照射するレーザ光（
６）とを備え、該レーザ光（６）の照射により半田（５
）を溶融し、該リード端子（３Ａ）を該プリント基板（
２）の所定個所に半田付けを行う半田付装置であって、 前記プリント基板（２）を収納し、非酸化性ガス（７）
の供給が行われるチャンバ（１）と、該チャンバ（１）
に内設され、還元液（８）の噴射を行うノズル（４）と
を具備し、該チャンバ（１）の窓（１Ａ）を透過するこ
とで前記レーザ光（６）を照射させ、非酸化性ガスの雰
囲気中に於いて前記半田（５）の溶融が行われることを
特徴とする半田付装置。 〔２〕所定個所に実装すべき電子部品（３）のリード端
子（３Ａ）を位置決めしたプリント基板（２）と、位置
決めされた該リード端子（３Ａ）を照射するレーザ光（
６）とを備え、該レーザ光（６）の照射により半田（５
）を溶融し、該リード端子（３Ａ）を該プリント基板（
２）の所定個所に半田付けを行う半田付装置であって、 前記レーザ光（６）の照射が行われる照射路（１１）と
、該照射路（１１）に非酸化性ガス（７）を噴射させる
第１の噴射口（１２）と、該第１の噴射口（１２）から
噴射される非酸化性ガス（７）より圧力の低い非酸化性
ガス（７Ａ）および還元液（８）のそれぞれを該第１の
噴射口（１２）の外周に噴射させる第２と第３の噴射口
（１３，１４）とが設けられたヘッド（１０）を備え、
該ヘッド（１０）を前記プリント基板（２）の所定個所
に対向することで配設し、該照射路（１１）を通して該
レーザ光（６）を照射させ、非酸化性ガスの雰囲気中に
於いて前記半田（５）の溶融が行われることを特徴とす
る半田付装置。[Scope of Claims] [1] A printed circuit board (2) on which a lead terminal (3A) of an electronic component (3) to be mounted at a predetermined location is positioned, and a laser beam that irradiates the positioned lead terminal (3A). (
6), and the solder (5) is irradiated with the laser beam (6).
) and connect the lead terminal (3A) to the printed circuit board (
2) is a soldering device for soldering to a predetermined location of the printed circuit board (2), the soldering device houses the printed circuit board (2), and is equipped with a non-oxidizing gas (7).
a chamber (1) in which the supply of
It is equipped with a nozzle (4) installed inside the chamber and for injecting the reducing liquid (8), and the laser beam (6) is irradiated by passing through the window (1A) of the chamber (1), and the non-oxidizing liquid is A soldering device characterized in that the solder (5) is melted in an atmosphere of a toxic gas. [2] A printed circuit board (2) on which lead terminals (3A) of an electronic component (3) to be mounted at a predetermined location are positioned, and a laser beam (
6), and the solder (5) is irradiated with the laser beam (6).
) and connect the lead terminal (3A) to the printed circuit board (
2) is a soldering device that performs soldering at a predetermined location, which comprises an irradiation path (11) in which the laser beam (6) is irradiated, and a non-oxidizing gas (7) in the irradiation path (11). A first injection port (12) to be injected, a non-oxidizing gas (7A) whose pressure is lower than that of the non-oxidizing gas (7) injected from the first injection port (12), and a reducing liquid (8). A head (10) is provided with second and third injection ports (13, 14) that each spray the first injection port (12) onto the outer periphery of the first injection port (12),
The head (10) is arranged to face a predetermined location of the printed circuit board (2), the laser beam (6) is irradiated through the irradiation path (11), and the head (10) is placed in a non-oxidizing gas atmosphere. A soldering device characterized in that the solder (5) is melted by the soldering device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28350889A JPH03145192A (en) | 1989-10-31 | 1989-10-31 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28350889A JPH03145192A (en) | 1989-10-31 | 1989-10-31 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03145192A true JPH03145192A (en) | 1991-06-20 |
Family
ID=17666450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28350889A Pending JPH03145192A (en) | 1989-10-31 | 1989-10-31 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03145192A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0884936A4 (en) * | 1996-02-28 | 2001-01-31 | Hitachi Ltd | Method for manufacturing electronic circuit device |
| KR20190085382A (en) * | 2018-01-10 | 2019-07-18 | 삼성전자주식회사 | LASER bonding apparatus, method of bonding semiconductor device, and method of fabricating semiconductor package |
-
1989
- 1989-10-31 JP JP28350889A patent/JPH03145192A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0884936A4 (en) * | 1996-02-28 | 2001-01-31 | Hitachi Ltd | Method for manufacturing electronic circuit device |
| KR20190085382A (en) * | 2018-01-10 | 2019-07-18 | 삼성전자주식회사 | LASER bonding apparatus, method of bonding semiconductor device, and method of fabricating semiconductor package |
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