JPH0314227B2 - - Google Patents
Info
- Publication number
- JPH0314227B2 JPH0314227B2 JP1085A JP1085A JPH0314227B2 JP H0314227 B2 JPH0314227 B2 JP H0314227B2 JP 1085 A JP1085 A JP 1085A JP 1085 A JP1085 A JP 1085A JP H0314227 B2 JPH0314227 B2 JP H0314227B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- die
- carrier tape
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 46
- 238000004080 punching Methods 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 17
- 238000002788 crimping Methods 0.000 claims description 6
- 230000001174 ascending effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085A JPS61159742A (ja) | 1985-01-04 | 1985-01-04 | アウタ−リ−ドボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085A JPS61159742A (ja) | 1985-01-04 | 1985-01-04 | アウタ−リ−ドボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61159742A JPS61159742A (ja) | 1986-07-19 |
| JPH0314227B2 true JPH0314227B2 (enrdf_load_html_response) | 1991-02-26 |
Family
ID=11462483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1085A Granted JPS61159742A (ja) | 1985-01-04 | 1985-01-04 | アウタ−リ−ドボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61159742A (enrdf_load_html_response) |
-
1985
- 1985-01-04 JP JP1085A patent/JPS61159742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61159742A (ja) | 1986-07-19 |