JPH0314221A - Developing device for semiconductor - Google Patents

Abstract

PURPOSE:To make possible a reduction in a developing time, the annihilation of the tailing of a pattern due to an undeveloped residue and underdevelopment and the like by a method wherein a developing device is formed into a device provided with a vibrating plate, which is mounted to a means for mounting a wafer and at the same time, applies ultrasonic vibration to the wafer. CONSTITUTION:In a developing device, by which a developing solution is applied on the surface of a wafer 3 and a developing is performed in a process for forming a pattern in a semiconductor manufacturing process, the device is formed so as to have a vibrating plate 8, which is mounted to a means 5 for mounting the wafer 3 and at the same time, applies ultrasonic vibration to the wafer 3. For example, ultrasonic vibrators 9 and an ultrasonic vibrating plate 8 are mounted to the lower part of a developing solution cup 5 for housing and mounting a wafer 3. The wafer 3 is housed in the cup 5 to use the cup 5 as a container with its sealed bottom. In that state, a developing solution is discharged through a plurality of developing solution discharge nozzles 6 mounted on the side surfaces of the cup 5 to fill the cap 5 with the developing solution and in a state that the developing solution is applied on the whole wafer 3, proper vibration is applied to the plate 8 from the oscillators 9 to perform a developing.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor developing device used in a photolithography process in a semiconductor manufacturing process.

[Conventional technology]

FIGS. 3(a) and 3(b) are cross-sectional views showing an example of a conventional semiconductor developing device.

Conventionally, this type of apparatus has a mounting table on which a wafer is mounted, as shown in FIG. 3(a) or (b).

Here, the developing device shown in FIG. 3(a) is different from a dip-type developing device, and the developing device shown in FIG. ζ(b) is called a paddle-type developing device. be.

In the dip type developing apparatus shown in FIG. 3(a), 1 is a cup as an envelope, 2 is a wafer spin chuck located at the center thereof, and 3 is a wafer.

4 is a pure water discharge nozzle, 5 is a developer cup, 6 is a developer discharge nozzle, and 7 is a back side cleaning cup.

This dip-type developing device is a container with a sealed bottom by housing the wafer 3 in a developer cup 5.
In this state, the developer is discharged from a plurality of developer discharge nozzles 6 attached to the side surface of the developer cup 5 to fill the developer cup 5 with the developer and perform development. Development is on wafer 3
This is done by rotating the wafer 3 together with the developer cup 5 for a predetermined period of time, either stationary or at a low speed (for example, 2 Orpm) with the developer fully filled, and then the developer cup 5 is lowered and the wafer 3 is then rotated. Then, pure water is discharged from the pure water discharge nozzle 4 and the backside cleaning cup 7, and the wafer 3 is cleaned.

The paddle type developing device shown in FIG. 3(b) has a cup 1. Wafer spin chuck 2. Wafer 3. Pure water discharge nozzle 4. It is composed of a sweeping developer discharge nozzle 6a and a backside cleaning cup 7.

In the paddle type developing device, after the wafer 3 is placed on the wafer spin chuck 2, it is operated at a low speed (for example, 30 rpm).
Without rotating the wafer 3, the developer is discharged while sweeping the developer discharge nozzle 6, and the wafer 3 is moved at a low speed (
For example, the image is developed by rotating at a rotation speed of 20 rpm. After this,
The wafer 3 is rotated at, for example, 300 rpm, and pure water is discharged from the pure water discharge nozzle 4 and the back surface cleaning cup 7 to clean the wafer 3.

[Problems to be Solved by the Invention] The conventional semiconductor developing apparatus described above does not perform coating on a wafer.
The chemical reaction between the exposed photosensitive organic film and the developer, that is, development, occurs when the wafer is stationary or at a low speed (for example, 20 r
]:l m ) and is rotated, so there are drawbacks that are not shown below.

(1) Development time is required to be longer than a certain period of time.

(2) Development is not completed completely, resulting in unreacted substances remaining on the bottom surface of the surface where the pattern is to be formed, and the pattern being trailed due to insufficient development.

An object of the present invention is to provide a semiconductor developing device that solves this problem.

[Means to solve the problem]

The semiconductor developing device of the present invention is a developing device that performs development by applying a developer to the wafer surface in a pattern forming process in a semiconductor manufacturing process, and is attached to a means for mounting the wafer, and is attached to a means for mounting the wafer, and ultrasonic waves are applied to the wafer. It has a diaphragm that gives vibration.

〔Example〕

Next, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view of a semiconductor developing device showing an embodiment of the present invention. This semiconductor developing apparatus has an ultrasonic vibrator 9 and an ultrasonic diaphragm 8 attached to the lower part of a developer cup 5 in which a wafer 3 is housed and mounted. Other than that, it is the same as the conventional example.

Further, in this semiconductor developing device, the wafer 3 is housed in the developer cup 5 to form a container with a sealed bottom, and in this state, a plurality of developer discharge nozzles attached to the side surface of the developer cup 5 are installed. The developer is discharged from the oscillator 9, the developer cup 5 is filled with the developer, and the oscillator 9 sends an appropriate vibration to the oscillation plate 8 (for example, vibration with an oscillation frequency of 850 KHz) while the developer is filled over the entire wafer 3. is applied to develop the image.

In this apparatus, the developing cup 5 is used while the wafer 3 is being developed.
The developer cup 5 is not limited to a static developing type in which the entire developer cup 5 is not rotated or a rotary developing type in which the entire developer cup 5 can be rotated at a low speed (for example, 2 rpm).

FIG. 2 is a sectional view of a semiconductor developing device showing another embodiment of the present invention. In this embodiment, an ultrasonic vibrator 9 and an ultrasonic diaphragm 8 are provided in a paddle type developing device. When the wafer spin chuck 2 of this device rotates at low speed (100 rpm), a rotatable ultrasonic oscillator plate 8 and an ultrasonic oscillator 9 contact the bottom of the wafer spin chuck 2.
The wafer is developed while applying ultrasonic vibrations to the wafer.

〔Effect of the invention〕

As explained above, by performing development with the developing device of the present invention, (1) shortening of development time (promotion of development reaction), (2) reduction of pattern skirts due to residual unreacted materials (so-called scum) and insufficient development. It has an effect that can do things like eliminate pull.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a semiconductor developing device showing one embodiment of the present invention, FIG. 2 is a sectional view of a semiconductor developing device showing another embodiment of the present invention, and FIG. 3 is a conventional semiconductor developing device. FIG. 2 is a cross-sectional view showing an example of a developing device. Tokatsubu, 2... Wafer spin chuck, 3... Wafer, 4... Pure water discharge nozzle, 5... Developer cup, 6... Developer discharge nozzle, 7... Back side cleaning cup,
8... Ultrasonic diaphragm, 9... Ultrasonic oscillator.

Claims (1)

[Claims] A developing device that performs development by applying a developer to the surface of a wafer in a pattern forming process in a semiconductor manufacturing process includes a diaphragm attached to a means for mounting the wafer and applying ultrasonic vibration to the wafer. Features of semiconductor development equipment.