JPH03140111A - Display device of electric hot-water heater - Google Patents
Display device of electric hot-water heaterInfo
- Publication number
- JPH03140111A JPH03140111A JP28050889A JP28050889A JPH03140111A JP H03140111 A JPH03140111 A JP H03140111A JP 28050889 A JP28050889 A JP 28050889A JP 28050889 A JP28050889 A JP 28050889A JP H03140111 A JPH03140111 A JP H03140111A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- light emitting
- emitting diode
- light emission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 210000000078 claw Anatomy 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Cookers (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は一般家庭で使用する電気湯沸し器の表示装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a display device for an electric water heater for general household use.
従来の技術
従来この種の電気湯沸し器の表示装置は第４図に示すよ
うに発光ダイオード６ｏはその脚５１を途中で曲げて段
部５２を形成し、基板６３の配線穴５４にそう入し、段
部６２を基板５３に当てて構成していた。2. Description of the Related Art Conventionally, as shown in FIG. 4, in a display device for an electric water heater of this kind, a light emitting diode 6o has its legs 51 bent in the middle to form a stepped portion 52, and is inserted into a wiring hole 54 of a substrate 63. , the stepped portion 62 was placed against the substrate 53.
発明が解決しようとする課題
このような従来の構成では、構成が簡単で安価ではある
が、反面、発光ダイオードの方向性を各種変化させたも
のへの適応性に欠け、電気湯沸し器を種々のフォルムに
対応させる自由度が無かった。Problems to be Solved by the Invention Although such a conventional configuration is simple and inexpensive, it lacks adaptability to various changes in the directionality of the light emitting diode, making it difficult to use electric water heaters in various ways. There was no freedom to adapt it to the form.
即ち、第４図の如き発光ダイオードの係上手段では脚の
そう入方向の高さ寸法は安定しているが左右方向等には
倒れ易く、従って従来の構成では電気湯沸し器として第
５図に示すような、表示カバー６５の表示面６６と略平
行に基板５３を設ける如き形態となった。That is, with the light emitting diode locking means as shown in Fig. 4, the height dimension in the insertion direction of the legs is stable, but it is easy to fall down in the left and right directions. As shown, the substrate 53 is provided substantially parallel to the display surface 66 of the display cover 65.
この場合、基板５３にすべての制御用電子回路部品を設
けることが不可能なので、いきおい制御用電子回路を載
置した別体の基板５８を用意し容器５７の下部空間へ配
置するという複雑さを余儀なくされていた。In this case, it is impossible to provide all the control electronic circuit components on the board 53, so the complexity of preparing a separate board 58 on which the control electronic circuit is mounted and placing it in the space below the container 57 is avoided. I was forced to do it.
本発明は、上記従来の課題を解決するもので、基板に対
する発光ダイオードの取付方向性や角度を任意にできる
ようにすることを目的とする。The present invention is intended to solve the above-mentioned conventional problems, and an object of the present invention is to enable the mounting direction and angle of a light emitting diode to a substrate to be made arbitrary.
課題を解決するための手段
上記目的を達成するために本発明は、発光ダイオードを
基板と平行にし、且つ脚を基板方向へ略直角に曲げ、発
光ダイオードの胴を基板に固定したＬＩＣＤホルダーの
爪に係止し、前記脚を前記型とは略直角方向にＬＩＣＤ
ホルダーへ設けた先細の円錐穴を介して基板の配線穴へ
そう人したものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a claw of an LICD holder in which the light emitting diode is made parallel to the substrate, the legs are bent at approximately right angles toward the substrate, and the body of the light emitting diode is fixed to the substrate. , and the legs are held in the LICD in a direction substantially perpendicular to the mold.
It was inserted into the wiring hole of the board through the tapered conical hole provided in the holder.
作用
このような構成によシ、基板に対する発光ダイオードの
取付方向が任意に選べ色々の電気湯沸し器の形態に対応
できる上、取付方向性の限定が無くなったので、発光ダ
イオード用の基板と制御用電子回路用の基板との一体化
ができた。Function: With this structure, the mounting direction of the light emitting diode on the board can be selected arbitrarily, and it can be applied to various types of electric water heaters.In addition, there is no restriction on the mounting direction, so the mounting direction of the light emitting diode and the control board can be easily selected. It was possible to integrate it with the electronic circuit board.
実施例
以下、本発明の一実施例について図面に基づいて説明す
る。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings.
第１図から第３図において、ステンレスなどの薄板で形
成した円筒状の容器１は同じく円筒状の器体２内に垂下
支持しである。In FIGS. 1 to 3, a cylindrical container 1 made of a thin plate of stainless steel or the like is suspended and supported within a similarly cylindrical container body 2. As shown in FIGS.
容器１の底面は同心の多段丘状に形成し、その中間部に
ドーナツ状の偏平なヒータ３を押え金具３ａで保持し、
この押え金具３２Ｌの外周近傍の容器１の底部外面にコ
字状容器支持板４を複数個適宜取付けている。前記器体
２の下端部の開口部を覆う皿状の下カバー６をねじ等に
よシ前記容器支持、板４へ固着し、容器１を下方へ引張
り込んで固定している。前記下カバー６と容器１の底と
のほぼ中央の空間９へ湯温制御装置１ｏを配設している
。湯温制御装置１０は、下カバー５に係止した箱状の配
線カバー６とこの配線カバー６内の下部に設けた基板７
とよりなっている。基板７の一方には直流の数Ｖで動作
する弱電部品の湯温制御用のマイコン８や、操作用のス
イッチ１１及び湯温の状況を点灯で示す発光ダイオード
１２などが設けられている。又、他方には交流１００Ｖ
で動作するリレー２６等の強電部品が設けられている。The bottom surface of the container 1 is formed into a concentric multi-tiered shape, and a flat donut-shaped heater 3 is held in the middle part with a presser metal fitting 3a.
A plurality of U-shaped container support plates 4 are appropriately attached to the outer surface of the bottom of the container 1 near the outer periphery of the presser metal fitting 32L. A dish-shaped lower cover 6 covering the opening at the lower end of the container body 2 is fixed to the container support plate 4 with screws or the like, and the container 1 is pulled downward and fixed. A hot water temperature control device 1o is disposed in a space 9 approximately in the center between the lower cover 6 and the bottom of the container 1. The hot water temperature control device 10 includes a box-shaped wiring cover 6 fixed to a lower cover 5 and a board 7 provided at the lower part of the wiring cover 6.
It is becoming more and more. One side of the board 7 is provided with a microcomputer 8 for controlling the hot water temperature of light electrical components that operates on a few volts of direct current, a switch 11 for operation, and a light emitting diode 12 that lights up to indicate the status of the hot water temperature. Also, AC 100V on the other side.
Powerful electrical components such as a relay 26 that operates on
基板子で下カバー６の内面に近い側にはＶ字状の溝１３
が設けられ、この溝１３は下カバー５の内面から基板ア
方向へ垂直にし突起１５の７字状溝１４へ嵌装している
。There is a V-shaped groove 13 on the side of the board near the inner surface of the lower cover 6.
The groove 13 is perpendicular to the substrate A direction from the inner surface of the lower cover 5, and is fitted into the figure-7 groove 14 of the projection 15.
尚、この状態で更に、配線カバー６の内面から下方に突
き出した突起１９へねじ２０で基板７は配線カバーｅに
固定される。In this state, the board 7 is further fixed to the wiring cover e by screws 20 onto the protrusions 19 protruding downward from the inner surface of the wiring cover 6.
ここで、下カバー６から上方へ出した且つ前記配線カバ
ー６の両側内面と基板７とに接した壁２６の先に設けた
ビン１６が基板７を貫通し、配線カバー６の穴１７に嵌
合し、このビン１６で配線カバー６を下カバー５の内周
面に押圧する。又、都合によりビン１６は基板７の穴に
嵌合することで基板７を下カバー６の内周面方向へ押圧
してもよい。Here, the bottle 16 provided at the end of the wall 26 that extends upward from the lower cover 6 and is in contact with both inner surfaces of the wiring cover 6 and the board 7 penetrates the board 7 and is fitted into the hole 17 of the wiring cover 6. Then, the pin 16 presses the wiring cover 6 against the inner peripheral surface of the lower cover 5. Furthermore, depending on the circumstances, the bottle 16 may be fitted into a hole in the substrate 7 to press the substrate 7 toward the inner circumferential surface of the lower cover 6.
前記スイッチ１１や発光ダイオード１２は前記溝１３に
隣接して設けられ、スイッチ１１は下カバー６に設けた
スイッチ片へ接しており、発光ダイオード１２は下刃づ
−６の側面の表示穴２２へ嵌装し、外部から操作が行え
ると共に外部へその操作結果と湯温の状況が発光ダイオ
ード１２の点灯、消灯で表示できるようになっている。The switch 11 and the light emitting diode 12 are provided adjacent to the groove 13, the switch 11 is in contact with the switch piece provided on the lower cover 6, and the light emitting diode 12 is provided in the display hole 22 on the side of the lower blade 6. It can be fitted and operated from the outside, and the results of the operation and the status of the water temperature can be displayed externally by turning on and off the light emitting diode 12.
一般に基板７に設けるスイ７ ｆ １１１ｄ ＯＮ、
ＯＦＦの動作ストロークが非常に少く、スイッチ片とス
イッチ１１との位置関係は極めて微少な間隔を要するが
、スイッチ１１の近辺の前記Ｖ溝１３が同じく下カバー
６のＶ溝１４へ隙間なくビン１６あるいは、ねじ２０で
支持されるので極めて精度よく保たれる。Generally, the switch 7 f 111d ON provided on the board 7,
The OFF operation stroke is very small, and the positional relationship between the switch piece and the switch 11 requires an extremely small distance, but the V-groove 13 near the switch 11 also connects to the V-groove 14 of the lower cover 6 without a gap in the bottle 16. Alternatively, since it is supported by the screw 20, extremely high precision can be maintained.
同様に発光ダイオード１２にも穴２２にズレなく支持さ
れる。Similarly, the light emitting diode 12 is also supported by the hole 22 without shifting.
下カバー６と配線カバー６は別体の外一体でもよく要は
スイッチ１１をスイッチ片に精度よく所定の間隔に保て
ばよい。The lower cover 6 and the wiring cover 6 may be separate and integral parts, and the key is to maintain the switch 11 at a predetermined interval with precision as a switch piece.
又、２４は下カバー５下部の溝に係止し回転自在なリン
グ状の回転用の受台である。Further, 24 is a ring-shaped rotating pedestal that is engaged in a groove at the bottom of the lower cover 5 and is rotatable.
前記壁２６はマイコン８等の弱電回路部を下カバー５や
配線カバー６と共に覆い外部からの水の侵入等を防ぐ働
きをする。The wall 26 serves to cover the weak electric circuit section such as the microcomputer 8 together with the lower cover 5 and the wiring cover 6 and prevent water from entering from outside.
前記発光ダイオード１２は、前記基板７と平行にし、且
つ脚２６を基板７方向へ略直角に曲げ、発光ダイオード
１２の胴２了を基板７の穴２９ヘビン３ｏをそう入し、
穴２８ヘフック３１で係止したＩ４Ｄホルダー３２の円
弧状の爪３３と受台３６とで固定し、前記脚２６を前記
爪３３とは略直角方向にＬＥＤホルダー３２へ設けた先
細の円錐穴３４を介して基板７の配線穴３５へそう人し
て、基板７に対する発光ダイオードの取付を容易にする
と共に、前後、左右、上下方向の取付けを確実なものに
している。The light emitting diode 12 is made parallel to the substrate 7, the legs 26 are bent at a substantially right angle toward the substrate 7, and the body 2 of the light emitting diode 12 is inserted into the hole 29 of the substrate 7,
A tapered conical hole 34 is provided in the LED holder 32 so that the leg 26 is fixed to the hole 28 by the arc-shaped claw 33 of the I4D holder 32, which is locked with the hook 31, and the pedestal 36, and the leg 26 is provided in the LED holder 32 in a direction substantially perpendicular to the claw 33. This makes it easy to attach the light emitting diode to the substrate 7 by inserting the light emitting diode into the wiring hole 35 of the substrate 7 through the wiring hole 35 of the substrate 7, and also ensures the attachment in the front-back, left-right, and up-down directions.
爪３３と受台３６等の方向を任意の方向に製造すること
により、基板７に対する発光ダイオード１２の方向を、
前後、左右、上下のいずれにも設定できるものとなる。By manufacturing the claws 33, pedestal 36, etc. in any direction, the direction of the light emitting diode 12 with respect to the substrate 7 can be adjusted.
It can be set front and rear, left and right, and up and down.
発明の効果
以上のように本発明はＬＥＤホルダーを基板と発光ダイ
オードとの間に介在させたので、発光ダイオードの方向
性が任意の方向に決まシ、発光ダイオードの変形がなく
なυ組立が容易となった。Effects of the Invention As described above, in the present invention, since the LED holder is interposed between the substrate and the light emitting diode, the directionality of the light emitting diode can be determined in any direction, and the light emitting diode is not deformed, making it easy to assemble. It became.
又、基板も１枚又は１カ所に集中でき合理化も図られた
。In addition, the number of boards can be concentrated on one board or in one place, and rationalization has been achieved.
その上、発光ダイオードの脚は、ＬＥＤホルダーの円錐
穴を利用し基板へそう入しているので、この脚が若干変
形していてもさそい込まれて組立てやすくなった。Furthermore, the legs of the light emitting diode are inserted into the board using the conical holes of the LED holder, so even if the legs are slightly deformed, they can be inserted and assembled easily.
第１図は本発明の電気湯沸し器の一実施例を示す要部分
解斜視図、第２図は同平面図、第３図は同断面図、第４
図は従来例の要部分解斜視図、第５図は断面図である。
１・・・・・・容器、２・・・・・・器体、３・・・・
・・ヒータ、５・・・・・・下カバー、６・・・・・・
配線カバー、ア・・・・・・基板、９・・・・・・空間
、１２・・・・・・発光ダイオード、２６・・・・・・
脚、２７・・・・・・胴、３２・・・・・・ＬＥＤホル
ダー、３３・・・・・・爪、３４・・・・・・円錐穴、
３６・・・・・・配線穴、２２・・・・・・表示穴。FIG. 1 is an exploded perspective view of essential parts showing an embodiment of the electric water heater of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a sectional view of the same, and FIG.
The figure is an exploded perspective view of essential parts of a conventional example, and FIG. 5 is a sectional view. 1...container, 2...vessel body, 3...
...Heater, 5...Lower cover, 6...
Wiring cover, A... Board, 9... Space, 12... Light emitting diode, 26...
Legs, 27... Body, 32... LED holder, 33... Claw, 34... Conical hole,
36... Wiring hole, 22... Display hole.
Claims (1)
子部品固着用の基板を内蔵した配線カバーを設け、これ
らを覆う皿状下カバーを器体下端へ固定し、発光ダイオ
ードを前記基板と平行にし、且つ脚を基板方向へ略直角
に曲げ、発光ダイオードの胴を基板に固定したＬＥＤホ
ルダーの爪に係止し、前記脚を前記爪とは略直角方向に
ＬＥＤホルダー設けた先細の円錐穴を介して基板の配線
穴へそう入し、発光ダイオードを下カバーの側面に設け
た表示穴へ臨ませた電気湯沸し器の表示装置。A wiring cover containing a board for fixing electronic components is provided in the space under the heater-equipped container supported in the cylindrical container, a dish-shaped lower cover covering these is fixed to the lower end of the container, and a light emitting diode is connected to the board. A tapered cone with parallel legs bent at a substantially right angle toward the substrate, the body of the light emitting diode being locked to the claws of an LED holder fixed to the substrate, and the legs provided on the LED holder in a direction substantially perpendicular to the claws. A display device for an electric water heater in which a light emitting diode is inserted through a hole into a wiring hole on a circuit board and exposed to a display hole provided on the side of a lower cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28050889A JP2817272B2 (en) | 1989-10-26 | 1989-10-26 | Display of electric water heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28050889A JP2817272B2 (en) | 1989-10-26 | 1989-10-26 | Display of electric water heater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03140111A true JPH03140111A (en) | 1991-06-14 |
| JP2817272B2 JP2817272B2 (en) | 1998-10-30 |
Family
ID=17626074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28050889A Expired - Fee Related JP2817272B2 (en) | 1989-10-26 | 1989-10-26 | Display of electric water heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2817272B2 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003141652A (en) * | 2001-10-31 | 2003-05-16 | Nohmi Bosai Ltd | Photoelectric smoke sensor |
| GB2367999B (en) * | 2000-10-20 | 2004-02-18 | Pulse Home Products Ltd | Liquid heating vessel |
| US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
| US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
| US11164955B2 (en) | 2017-07-18 | 2021-11-02 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
| US11168395B2 (en) | 2018-06-29 | 2021-11-09 | Asm Ip Holding B.V. | Temperature-controlled flange and reactor system including same |
| US11171025B2 (en) | 2019-01-22 | 2021-11-09 | Asm Ip Holding B.V. | Substrate processing device |
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| US11205585B2 (en) | 2016-07-28 | 2021-12-21 | Asm Ip Holding B.V. | Substrate processing apparatus and method of operating the same |
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| US11227789B2 (en) | 2019-02-20 | 2022-01-18 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
| US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
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| US11233133B2 (en) | 2015-10-21 | 2022-01-25 | Asm Ip Holding B.V. | NbMC layers |
-
1989
- 1989-10-26 JP JP28050889A patent/JP2817272B2/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2367999B (en) * | 2000-10-20 | 2004-02-18 | Pulse Home Products Ltd | Liquid heating vessel |
| JP2003141652A (en) * | 2001-10-31 | 2003-05-16 | Nohmi Bosai Ltd | Photoelectric smoke sensor |
| US11233133B2 (en) | 2015-10-21 | 2022-01-25 | Asm Ip Holding B.V. | NbMC layers |
| US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
| US11205585B2 (en) | 2016-07-28 | 2021-12-21 | Asm Ip Holding B.V. | Substrate processing apparatus and method of operating the same |
| US11222772B2 (en) | 2016-12-14 | 2022-01-11 | Asm Ip Holding B.V. | Substrate processing apparatus |
| US11164955B2 (en) | 2017-07-18 | 2021-11-02 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
| US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| US11168395B2 (en) | 2018-06-29 | 2021-11-09 | Asm Ip Holding B.V. | Temperature-controlled flange and reactor system including same |
| US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
| US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
| US11171025B2 (en) | 2019-01-22 | 2021-11-09 | Asm Ip Holding B.V. | Substrate processing device |
| US11227789B2 (en) | 2019-02-20 | 2022-01-18 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
| USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
| US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2817272B2 (en) | 1998-10-30 |
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