JPH03138235A - Plate material separating device - Google Patents

Plate material separating device

Info

Publication number
JPH03138235A
JPH03138235A JP27657689A JP27657689A JPH03138235A JP H03138235 A JPH03138235 A JP H03138235A JP 27657689 A JP27657689 A JP 27657689A JP 27657689 A JP27657689 A JP 27657689A JP H03138235 A JPH03138235 A JP H03138235A
Authority
JP
Japan
Prior art keywords
lead frame
lowest
plate material
separator
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27657689A
Other languages
Japanese (ja)
Inventor
Kiyoshi Takaoka
高岡 清
Takeichi Yoshida
吉田 竹一
Yoshiaki Fujiwara
良昭 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP27657689A priority Critical patent/JPH03138235A/en
Publication of JPH03138235A publication Critical patent/JPH03138235A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To completely separate plate materials one by one without damaging their surfaces by making a supporting piece retract after inserting into the clearance at a separator to release supporting of the lowest plate material and release holding of a stopper member, and raising the stopper member to advance the supporting piece and retract the separator. CONSTITUTION:A clearance is formed between the lowest plate material and the second lowest plate material 11b by holding both the side surfaces of both the edges of the lowest plate material 11a supported by a supporting piece 6 by a stopper member 5 and lowering them. Next, a separator 7 is inserted into the clearance to release the contact between the lowest plate 11a and the second lowest plate 11b, and the lowest plate 11a is separated by retracting the supporting piece 6 to release supporting of the lowest plate 11a and holding of the stopper member 5.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、密着して積み重ねられているリードフレー
ム等の板材を一枚ずつ分離する板材分離装置に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a plate material separation device that separates plate materials such as lead frames that are closely stacked one by one.

〔従来の技術〕[Conventional technology]

従来、密着して積み重ねられている板材を一枚ずつ分離
するために、真空吸着を利用した真空吸着分離装置が用
いられている。
Conventionally, a vacuum adsorption separation device that utilizes vacuum adsorption has been used to separate plate materials that are closely stacked one by one.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら上記のような真空吸着を利用した装置では
、真空吸着した板材の表面に傷がついたり、板材を一枚
ずつ分離する動作が不確実で板材が2枚同時に次工程に
供給されるという問題を有していた。
However, with the above-mentioned equipment that uses vacuum suction, there are problems such as scratches on the surface of the vacuum-adsorbed plates, unreliable operation of separating the plates one by one, and two plates being fed to the next process at the same time. It had

この発明の目的は、板材の表面に傷を付けることなく、
−枚ずつの分離動作を確実に行うことのできる板材分離
装置を提供することである。
The purpose of this invention is to prevent damage to the surface of the board.
- It is an object of the present invention to provide a plate separation device that can reliably perform a separation operation one by one.

〔課題を解決するための手段〕[Means to solve the problem]

この発明の板材分離装置は、進退可能に設けらて前進状
態で最下位の板材の中央部を支持する支持片と、 進退・昇降可能に設けられて前進状態で前記最下位の板
材の両端部の両側面を把持するとともに下降して前記最
下位の板材と下から2番目の板材との間に隙間を形成す
る爪部材と、 進退可能に設けられて前記隙間に進入することにより前
記最下位の板材と下から2番目の板材とを分離するセパ
レータとを備え、 前記セパレータの前記隙間への進入後に前記支持片を後
退させて前記最下位の板材の支持を解除するとともに前
記爪部材の把持を解除し、その後前記爪部材を上界させ
前記支持片を前進させ前記セパレータを後退させるよう
にしたものである。
The plate separation device of the present invention includes a support piece that is movable in a forward and backward manner and supports the center portion of the lowest plate in the forward state; and a support piece that is movable in the forward and backward direction and supports the center portion of the lowest plate in the forward state. a claw member that grips both sides of the board and descends to form a gap between the lowest board member and the second board member from the bottom; and a separator that separates the second plate material from the bottom, and after the separator enters the gap, the support piece is moved back to release the support of the lowest plate material and the claw member is gripped. is released, and then the claw member is moved upward, the support piece is advanced, and the separator is retreated.

〔作用〕[Effect]

この発明の板材分離装置は、支持片により支持された最
下位の板材の両端部の両側面を爪部材により把持して下
降することにより下から2番目の板材との間に隙間を形
成することができ、この隙間にセパレータを進入させ最
下位と下から2番目の板材との接触を解放した後、支持
片を後退させて最下位の板材の支持の解除と爪部材の把
持を解除することにより、最下位の板材を分離すること
ができる。
The plate separation device of the present invention is capable of forming a gap between the lowest plate supported by the support piece and the second plate from the bottom by gripping both side surfaces of both ends with claw members and lowering the plate. After entering the separator into this gap and releasing the contact between the lowest plate material and the second plate material from the bottom, the support piece is moved back to release the support of the lowest plate material and the grip of the claw member. This allows the lowest plate material to be separated.

〔実施例] この発明の一実施例を第1図ないし第4図に基づいて説
明する。
[Embodiment] An embodiment of the present invention will be described based on FIGS. 1 to 4.

第1図および第2図において、板材であるリードフレー
ム11の積層体9を横方向の面から保持するガイド板1
,2が設けられている。このガイド板1の保持面にはベ
アリングローラ3が、ガイド板2の保持面には四部がそ
れぞれ設けられている。4i1N体9は、その最下位の
リードフレームllaの中央部を進退可能に設けられた
一対の支持片6により支持されている。また、リードフ
レームItの積層体9の両側面には、その最下位のリー
ドフレームllaの両端部の両側面を把持する二組の爪
部材5と、最下位のリードフレームllaと下から2番
目のリードフレームllbとの間を分離する一対のセパ
レータ7とが設けられている。なお、この二組の爪部材
5は最下位のリードフレームIlaを把持するために進
退・昇降が可能であり、一対のセパレータ7はリードフ
レーム1la11bを分離するために進退が可能である
。さらに、支持片6の下方には、分離したリードフレー
ムllaを一旦保持するレール12が設けられ、その側
方にはリードフレームllaの厚さを測定するレーザ光
検出器13が設けられている。なお、各動作部は装置下
方のモータ8とそれぞれの動作軸8′により動作する。
In FIGS. 1 and 2, a guide plate 1 that holds a laminate 9 of a lead frame 11, which is a plate material, from a lateral surface.
, 2 are provided. A bearing roller 3 is provided on the holding surface of the guide plate 1, and four parts are provided on the holding surface of the guide plate 2. The 4i1N body 9 is supported by a pair of support pieces 6 that are movably provided at the center of the lowest lead frame lla. Further, on both sides of the stacked body 9 of the lead frame It, there are two sets of claw members 5 for gripping both sides of both ends of the lowest lead frame lla, and two sets of claw members 5 for gripping both sides of both ends of the lowest lead frame lla and the second pair from the bottom. A pair of separators 7 are provided to separate the lead frame llb from the lead frame llb. The two sets of claw members 5 can move forward and backward and up and down in order to grip the lowest lead frame Ila, and the pair of separators 7 can move forward and backward in order to separate the lead frames 1la11b. Further, a rail 12 is provided below the support piece 6 to temporarily hold the separated lead frame lla, and a laser photodetector 13 is provided on the side thereof to measure the thickness of the lead frame lla. Note that each operating section is operated by a motor 8 located below the device and respective operating shafts 8'.

上記のような構成において、各部分の動作を第3図に基
づいて説明する。
In the above configuration, the operation of each part will be explained based on FIG. 3.

(1)密着したリードフレーム11の積層体9がガイド
板1.2との間を通過するときに、第2図に示すように
ヘアリングローラ3と凹部4により強制的にリードフレ
ーム11の眉間の密着状態が解消され、最下位のリード
フレームllaの下面で支持片6により積層体9が支持
される。(第3図(a)) (2)最下位のリードフレームllaの両端の両側面を
二組の爪部材5により把持する。(第3図■)) (3)  リードフレームllaを把持したまま爪部材
5を下降させ、このリードフレーム11aを支持片6を
支点として湾曲させて下から2番目のリードフレームl
lbとの間に隙間10を形成さゼる。(第3図(C)) (4)  リードフレームlla、llbの隙間10に
セパレータ7を進入させ、リードフレームllbの下面
からリードフレームIla以外のリードフレーム11の
積層体9をセパレータフにより支持する。(第3図(d
)) (5)セパレータ7を上昇させて最下位のリードフレー
ムllaと下から2番目のリードフレーム11bとの接
触を解放する。(第3図(e))(6)  リードフレ
ームllaの下面の一対の支持片6を後退させて支持を
解除し、二組の爪部材5による把持のみとする。(第3
図(「))(7)  リードフレームllaの二対の爪
部材5を後退させて把持を解除し、リードフレームll
aをレール12の上へ分離して落下させる。(第3図(
g)) つぎに、一対の支持片6を新たな積層体9の最下位とな
るリードフレームttbの下面に前進させた後、一対の
セパレータ7を後退させて支持片6により積層体9を支
持した第3図(a)に示す動作開始状態にもどる。
(1) When the laminate 9 of the lead frame 11 in close contact with each other passes between the guide plate 1.2, the hair ring roller 3 and the recess 4 force the lead frame 11 between the eyebrows as shown in FIG. The close contact between them is eliminated, and the laminate 9 is supported by the support piece 6 on the lower surface of the lowest lead frame lla. (FIG. 3(a)) (2) Grip both sides of both ends of the lowest lead frame lla with two sets of claw members 5. (Fig. 3 ■)) (3) Lower the claw member 5 while gripping the lead frame lla, bend this lead frame 11a about the support piece 6 as a fulcrum, and attach it to the second lead frame l from the bottom.
A gap 10 is formed between lb and lb. (Fig. 3 (C)) (4) The separator 7 is inserted into the gap 10 between the lead frames lla and llb, and the stacked body 9 of the lead frames 11 other than the lead frame Ila is supported by the separator tuff from the bottom surface of the lead frame llb. . (Figure 3(d)
)) (5) Raise the separator 7 to release the contact between the lowest lead frame lla and the second lead frame 11b from the bottom. (FIG. 3(e)) (6) The pair of support pieces 6 on the lower surface of the lead frame lla are moved back to release the support, so that only the two sets of claw members 5 can hold the lead frame lla. (3rd
Figure ('')) (7) Move back the two pairs of claw members 5 of lead frame lla to release the grip, and remove lead frame lla.
A is separated and dropped onto the rail 12. (Figure 3 (
g)) Next, after advancing the pair of support pieces 6 to the lower surface of the lowermost lead frame ttb of the new stacked body 9, the pair of separators 7 are moved back and the stacked body 9 is supported by the support pieces 6. The operation returns to the operation start state shown in FIG. 3(a).

上記動作の(2)の最下位のリードフレームllaの両
端の両側面を二組の爪部材5により把持する動作(第3
図(b))を第4図に基づいてさらに詳しく説明する。
In the above operation (2), the operation (third
(b)) will be explained in more detail based on FIG.

(2−1) 41を層化9の両端の両側面を把持する二
組の爪部材5が、積層体9の両端の斜下方の位置に配置
された状g(第4図(a))から、それぞれの爪部材5
を内側に前進させその水平片5bを積層体9の下方に配
置させる。(第4図(b))(2−2)それぞれの爪部
材5を上昇させて水平片5bを積層体9の下面に当接さ
せる。(第4図(C))(2−3)つぎに、水平片5b
が当接した爪部材5をさらに内側に前進させて爪5aで
最下位のリードフレーム1.1 aを両端の両側面より
把持する。
(2-1) Two sets of claw members 5 that grip both side surfaces of both ends of the layered body 9 are arranged at diagonally downward positions of both ends of the layered product 9 (FIG. 4(a)) , each claw member 5
is advanced inward and its horizontal piece 5b is placed below the laminate 9. (FIG. 4(b)) (2-2) Each claw member 5 is raised to bring the horizontal piece 5b into contact with the lower surface of the laminate 9. (Figure 4(C)) (2-3) Next, the horizontal piece 5b
The claw member 5 that has come into contact with the lead frame 1.1 is moved further inward, and the claw 5a grips the lowest lead frame 1.1a from both ends of the lead frame 1.1a.

(第4図(d)) 以上のよにして、積層体9の最下位のリードフレーl、
llaは両端の両側面を二組の爪部材5により確実に把
持される。
(FIG. 4(d)) As described above, the lowest lead frame l of the laminate 9,
lla is securely gripped by two sets of claw members 5 on both side surfaces of both ends.

なお、上記の動作で積層体9より分離されたリードフレ
ームllaは、レール12の上で一旦保持され、第1図
に示すレーザ光検出器13で厚さを測定して分離したリ
ードフレームllaが1枚であることを確認した後、搬
送装置(図示せず)により次工程に搬送される。また、
分離動作が行われずレール12の上にリードフレームl
laがない場合は新たな分離動作を連続して行い、リー
ドフレー1、lla、llbの2枚が密着した状態で積
層体9より2枚が同時に分離されている場合も、搬送装
置は動作せずにレール12が図中の矢印Aで示す外方向
に移動してレール12に一旦保持した分離不良のリード
フレームlla  llbを図中の矢印Bで示す下方に
落下させ、新たな分離動作を連続して行う。
The lead frame lla separated from the laminate 9 by the above operation is temporarily held on the rail 12, and the thickness of the separated lead frame lla is measured by the laser photodetector 13 shown in FIG. After confirming that there is only one sheet, the sheet is transported to the next process by a transport device (not shown). Also,
The lead frame l is placed on the rail 12 because the separation operation is not performed.
If there is no la, a new separation operation is performed continuously, and even if the two lead flakes 1, lla, and llb are in close contact and are simultaneously separated from the laminate 9, the conveying device does not operate. The rail 12 moves outward as shown by the arrow A in the figure, causing the poorly separated lead frame lla llb, which was once held on the rail 12, to drop downward as shown by the arrow B in the figure, and a new separation operation is continued. and do it.

このように、最下位のリードフレームllaの両端部の
両側面を爪部材5により把持して下降することにより下
から2番目のリードフレームllbとの間に隙間10を
形成し、この隙間10にセパレータ7を進入させリード
フレームlla、11bとの接触を解放した後、最下位
のリードフレーム11aの支持片6の解除と爪部材5の
把持を解除して最下位のリードフレームllaを分離す
ることができ、リードフレーム11の表面に傷を付ける
ことなく、−枚ずつの分離動作を確実に行うことができ
る。
In this way, by grasping both side surfaces of both ends of the lowest lead frame lla with the claw members 5 and lowering it, a gap 10 is formed between it and the second lead frame llb from the bottom. After the separator 7 is advanced and released from contact with the lead frames lla and 11b, the support piece 6 of the lowest lead frame 11a is released and the grip of the claw member 5 is released to separate the lowest lead frame lla. This makes it possible to reliably perform the separation operation one by one without damaging the surface of the lead frame 11.

〔発明の効果〕〔Effect of the invention〕

この発明の板材分離装置は、支持片により支持された最
下位の板材の両端部の両側面を爪部材により把持して下
降することにより下から2番目の板材との間に隙間を形
成することができ、この隙間にセパレータを進入させ最
下位と下から2番目の板材との接触を解放した後、支持
片を後退させて最下位の板材の支持片による支持の解除
と爪部材の把持を解除することにより、板材の表面に傷
を付けることなく、−枚ずつの分離動作を連続して確実
に行うことができる。
The plate separation device of the present invention is capable of forming a gap between the lowest plate supported by the support piece and the second plate from the bottom by gripping both side surfaces of both ends with claw members and lowering the plate. After entering the separator into this gap and releasing the contact between the lowest plate and the second plate from the bottom, the support piece is moved back to release the support of the lowest plate by the support piece and grip the claw member. By releasing the release, it is possible to continuously and reliably perform the separation operation one by one without damaging the surface of the plate material.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の板材分離装置の一実施例の正面図、
第2図はその要部の拡大断面図、第3図はその動作の説
明図、第4図はその爪部材の動作の説明図である。 5・・・爪部材、6・・・支持片、7川セパレータ、1
゜・・・隙間 ヒPv?引=#」 第 1 図 第 図
FIG. 1 is a front view of an embodiment of the plate separation device of the present invention;
FIG. 2 is an enlarged sectional view of the main part thereof, FIG. 3 is an explanatory diagram of its operation, and FIG. 4 is an explanatory diagram of the operation of the claw member. 5... Claw member, 6... Support piece, 7 River separator, 1
゜...Gap Hi Pv? Pull = #” Figure 1 Figure 1

Claims (1)

【特許請求の範囲】  進退可能に設けらて前進状態で最下位の板材の中央部
を支持する支持片と、 進退・昇降可能に設けられて前進状態で前記最下位の板
材の両端部の両側面を把持するとともに下降して前記最
下位の板材と下から2番目の板材との間に隙間を形成す
る爪部材と、 進退可能に設けられて前記隙間に進入することにより前
記最下位の板材と下から2番目の板材とを分離するセパ
レータとを備え、 前記セパレータの前記隙間への進入後に前記支持片を後
退させて前記最下位の板材の支持を解除するとともに前
記爪部材の把持を解除し、その後前記爪部材を上昇させ
前記支持片を前進させ前記セパレータを後退させるよう
にした板材分離装置。
[Scope of Claims] A support piece that is movably provided to support the center portion of the lowest plate material in the forward state; and a support piece that is movable to move forward and backward and supports the center portion of the lowest plate material in the forward state; a claw member that grips a surface and descends to form a gap between the lowest plate and the second plate from the bottom; and a separator that separates the second plate material from the bottom, and after the separator enters the gap, the support piece is moved back to release the support of the lowest plate material and release the grip of the claw member. After that, the claw member is raised, the support piece is advanced, and the separator is retreated.
JP27657689A 1989-10-23 1989-10-23 Plate material separating device Pending JPH03138235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27657689A JPH03138235A (en) 1989-10-23 1989-10-23 Plate material separating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27657689A JPH03138235A (en) 1989-10-23 1989-10-23 Plate material separating device

Publications (1)

Publication Number Publication Date
JPH03138235A true JPH03138235A (en) 1991-06-12

Family

ID=17571397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27657689A Pending JPH03138235A (en) 1989-10-23 1989-10-23 Plate material separating device

Country Status (1)

Country Link
JP (1) JPH03138235A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0853109A (en) * 1994-08-09 1996-02-27 General Packer Kk Magazine for packaging bag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0853109A (en) * 1994-08-09 1996-02-27 General Packer Kk Magazine for packaging bag

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