JPH03136374A - Surge protective device - Google Patents

Surge protective device

Info

Publication number
JPH03136374A
JPH03136374A JP27384489A JP27384489A JPH03136374A JP H03136374 A JPH03136374 A JP H03136374A JP 27384489 A JP27384489 A JP 27384489A JP 27384489 A JP27384489 A JP 27384489A JP H03136374 A JPH03136374 A JP H03136374A
Authority
JP
Japan
Prior art keywords
same
electrodes
type
layers
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27384489A
Other languages
Japanese (ja)
Other versions
JPH0682835B2 (en
Inventor
Koichi Ota
太田 鋼一
Hiroyuki Ono
博之 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1273844A priority Critical patent/JPH0682835B2/en
Publication of JPH03136374A publication Critical patent/JPH03136374A/en
Publication of JPH0682835B2 publication Critical patent/JPH0682835B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Thyristors (AREA)

Abstract

PURPOSE:To surely perform surge protection by constituting an electrode of an N type base and P type emitter, part of which is short-circuited with the base, and two pieces of such electrodes are provided on each surface of a common P type semiconductor substrate so that the two pieces of electrodes on one surface can face nother two pieces of electrodes on the other surface. CONSTITUTION:By using a P type semiconductor substrate as a common substrate, layers N1, N2, N3 and N4 having the same shape, the same impurity concentration distribution, the same thickness, etc., are formed on both surfaces of the substrate by the same forming process under the same left-right positional relation and layers P1, P2, P3 and P4 having the same shape, the same impurity concentration distribution, the same thickness, etc., are respectively formed in the layers N1, N2, N3, and N4 under the same positional relation. Then, metallic electrodes T1, T2, T3, and T4 are respectively formed between the layers N1 and P1, N2 and P2, N3 and P3, and N4 and P4. In such a way, one electrode is constituted of one N type base and P type emitter, part of which is short-circuited with the base, and two pieces of such electrode are provided on one surface of the common substrate, with nother two piece being provided on the other surface, so that the electrodes can face each other and can be connected by junction.

Description

【発明の詳細な説明】 (産業上の利用分野)     、 本発明は通信回線などのサージ防護にすぐれた機能を有
するPNPNP (またはNPNPN)型サージ防護デ
バイ、スに関するもΦ、!ある。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a PNPNP (or NPNPN) type surge protection device, which has excellent surge protection functions for communication lines, etc. be.

(従来技術とその解決すべき問題点) 第1図(a)のようにPNPNPの5層からなり第1図
(ハ)の等価回路をもつ双方向性2端子サイリスタは、
小型安価であって過電流耐量が大きく、しかも2端子素
子であるので使用が簡単であるなどの理由から、通信回
線その他における雷サージなどの防護用として幅広く使
用され始めている。
(Prior art and its problems to be solved) A bidirectional two-terminal thyristor consisting of five layers of PNPNP as shown in Fig. 1(a) and having an equivalent circuit as shown in Fig. 1(c) is as follows:
Because they are small and inexpensive, have a high overcurrent resistance, and are easy to use because they are two-terminal devices, they have begun to be widely used as protection against lightning surges in communication lines and other areas.

ところで従来においては防護に当たって例えば第2図の
ように、線路L11L!と接坤E間に入る正負サージに
対する防護素子、所謂縦サージ用防護素子(1)(2)
と、線路り、Lx間に入るサージに対する防護素子、所
謂機サージ素子(3)の3箇の双方向性2端子サイリス
タを用いることが行われている。
By the way, in the past, for example, as shown in Figure 2, when protecting the line L11L! Protective elements against positive and negative surges that enter between and contact E, so-called vertical surge protective elements (1) (2)
The use of three bidirectional two-terminal thyristors is a so-called mechanical surge element (3), which is a protection element against surges that enter between the line, line, and Lx.

しかし上記のように複数筒の双方向性2端子サイリスタ
を用いる防御回路では、例えば線路り。
However, as mentioned above, in a protection circuit using a bidirectional two-terminal thyristor with multiple tubes, for example,

と接地8問および線路L2と接地E間に同時に縦サージ
が侵入したとき、素子(1)(2)が同時に作動せず、
i方例え&キ章、子(1)のみが作動した場合には、線
p、L1.Lz間にサージ電圧(横サージ)が印加・さ
れ牽、このため線jlL、、i間に接続された素子(3
]ψ作動が素子(υのそれより遅れた場合には、サージ
電流が線14 L、i 、L z間に接続された被保護
電子回路Gに侵入して、その破損を招くおそれがある。
When a vertical surge simultaneously enters between line L2 and ground E, elements (1) and (2) do not operate at the same time,
If only child (1) is activated, line p, L1. A surge voltage (lateral surge) is applied between Lz and the element (3) connected between lines jlL, , i.
] If the operation of ψ is delayed than that of the element (υ), there is a risk that the surge current will enter the protected electronic circuit G connected between the lines 14 L, i, and Lz, causing its damage.

従ってこのような事態から逃れるためには、動作の遅れ
を生じないように各サージ防護素子の特性のばらつきを
極めて低く抑えることが重要である。
Therefore, in order to avoid such a situation, it is important to suppress variations in the characteristics of each surge protection element to an extremely low level so as not to cause a delay in operation.

しかしその特性は第1図(a)のPNPNP層の不純物
濃度分布やそのライフタイム、厚さ、相互位置関係に関
係し各デバイスにおいてこれらを同一に形成することに
は大きな困難があり、またこれは拡散法などの製造プロ
セス中において変化するので、更に困難は大となる。ま
た製造されたものの中から特性の極めて少ない素子を選
別するにしても、多くの手数を要するばかりか一般に合
致したものを見出すことは難しい。
However, its characteristics are related to the impurity concentration distribution of the PNPNP layer shown in Figure 1 (a), its lifetime, thickness, and mutual positional relationship, and it is very difficult to form these in the same way in each device. The difficulty becomes even greater because the amount changes during manufacturing processes such as diffusion methods. Moreover, even if it were to select elements with very few characteristics from among the manufactured ones, not only would it take a lot of effort, but it would also be difficult to find elements that generally match.

(発明の目的) 本発明は上記の如き問題を解決しうるサージ防護デバイ
スの提供を目的としてなされたものである。
(Object of the Invention) The present invention has been made for the purpose of providing a surge protection device that can solve the above problems.

(課題を解決するための本発明の手段)前記第2図に示
した従来のサージ防護回路において、素子(1)と(2
)の特性が同一であって、縦サージに対して同時にオン
となれば縦サージのみでなく線路り、L2間に印加され
る横サージに対しても防護を行うことができ、デバイス
(1) (2)のみでサージ防護回路を形成できる。
(Means of the present invention for solving the problem) In the conventional surge protection circuit shown in FIG.
) have the same characteristics and are turned on at the same time against vertical surges, protection can be provided not only against vertical surges but also against horizontal surges applied across the line and L2, and device (1) A surge protection circuit can be formed using only (2).

本発明は以上から素子(1)(2)を例えばP型半導体
基板を共通基板として複合した構成とすれば、素子(1
)を形成するPNPNP層と素子(2)を形成するPN
PNP層の同一作成プロセスの採用によって各層が要求
する不純物濃度分布や厚み、相互位置関係などを同一に
形成でき、また製造プロセス中における変化があっても
これらは同一に変化する。
From the above, if the present invention has a structure in which elements (1) and (2) are combined using a P-type semiconductor substrate as a common substrate, element (1)
) and the PN layer forming element (2).
By adopting the same manufacturing process for the PNP layers, it is possible to form the impurity concentration distribution, thickness, mutual positional relationship, etc. required for each layer to be the same, and even if there are changes during the manufacturing process, these will change in the same way.

従って同一の特性をもった従来の素子(1)(2)の複
合されたデバイスを得ることができ、これにより第2図
によって前記したサージ電圧の印加の場合にもデバイス
(1)(2)を同時にオンさせることができ、デバイス
(1)(2)(3)による回路と実質的に同一のサージ
防護作用を得ることができる。
Therefore, it is possible to obtain a composite device of the conventional elements (1) and (2) having the same characteristics, and as a result, even when the surge voltage described above is applied as shown in FIG. can be turned on at the same time, and substantially the same surge protection effect as the circuits using devices (1), (2), and (3) can be obtained.

本発明は以上の着想にもとづいてなされたちので次に本
発明を実施例によって説明する。
Since the present invention has been made based on the above idea, the present invention will now be described with reference to examples.

第3図(a)(b)(C)は本発明の実施例を示す上面
図(電極の図示を省略)、断面図、および下面図(電極
の図示を省略)であって、その特徴とするところは、P
型半導体基板を共通基板として同一作成プロセスにより
その両面の左右の同一位置関係のもとに同一不純物濃度
分布、同一厚みなどをもった同一形状のN、、N、、N
3.N、を形成し、また二〇NINg N3 N4層中
には同一位置関係のもとに同一不純物濃度分布、同一厚
みなどをもつ同一形状のP I+ P !+ P 3t
 P aを形成する。そしてN1PI、N! Pgおよ
びN3 P3.N4 Paにそれぞれ跨がって電極金属
T + 、T 2およびT3.T4を設けた構成にした
点にある。そしてこれによってN型ベースとその一部が
短絡されたP型エミッタを一つの電極とし、これを2個
宛前記共通基板を挟んでそれぞれ対向するように接合に
より分離して設けて、各層の電極内にそれぞれ第1図(
b)に示した5層双方向性2端子サイリスクの特性を有
するデバイスA、 Bが形成されるようにしたものであ
る。
3(a), (b), and (C) are a top view (the electrodes are not shown), a sectional view, and a bottom view (the electrodes are not shown) showing the embodiment of the present invention, and their characteristics are The place to do it is P
N, N, N, N of the same shape with the same impurity concentration distribution, the same thickness, etc. based on the same positional relationship on the left and right sides of both sides by the same manufacturing process using a type semiconductor substrate as a common substrate.
3. In addition, in the 20 NINg N3 N4 layer, there are P I+ P ! of the same shape with the same impurity concentration distribution, the same thickness, etc. based on the same positional relationship. +P 3t
Form P a. And N1PI, N! Pg and N3 P3. Electrode metals T + , T 2 and T 3 . respectively span N4 Pa. The point is that the configuration includes T4. As a result, the N-type base and the P-type emitter, which is partially short-circuited, are used as one electrode, and two of these are separated by bonding so as to face each other with the common substrate in between, and the electrodes of each layer are Figure 1 (
Devices A and B having the characteristics of the 5-layer bidirectional 2-terminal silicon risk shown in b) are formed.

従って第4図のように本発明デバイスCの電極T1を線
路り、に、T2を接地Eに接続し、また電極T、を線路
L2に、T、を接地Eに接続すれば、例えば線路り、、
L、と接地E間にそれぞれ縦サージが印加された場合、
従来周知の双方向性2端子サイリスタと同一原理のもと
に、電極T 1T 2問およびTsTa間は同時にオン
するので線路LIL2間にサージ電圧が横サージとして
印加されることがなく、1箇の複合素子により素子(1
)(2)(3)によるものと同等のサージ防護作用を果
たすことになる。また本発明は2箇のデバイスが複合さ
れたものであるので小型であり、しかも経済的である。
Therefore, if the electrode T1 of the device C of the present invention is connected to the line L2 and the electrode T2 is connected to the ground E, and the electrode T is connected to the line L2 and T is connected to the ground E as shown in FIG. ,,
When a vertical surge is applied between L and ground E,
Based on the same principle as the conventionally well-known bidirectional two-terminal thyristor, the two electrodes T1T and TsTa are turned on at the same time, so the surge voltage is not applied as a lateral surge across the line LIL2, and one The element (1
)(2) This results in the same surge protection effect as that provided by (3). Furthermore, since the present invention is a combination of two devices, it is compact and economical.

以上本発明を一実施例により説明したが、N1Nt N
s、Na、P+ P ! P z P4層などの形状は
同一であれば各種の変形例が考えられる。また以上説明
とは逆の導電型構造とすることもできる。また更に本発
明はシリコンなど所望の半導体材料を用いて構成できる
The present invention has been explained above using one embodiment, but N1Nt N
s, Na, P+ P! Various modifications can be considered as long as the shapes of the P z P4 layer and the like are the same. Further, a conductivity type structure opposite to that described above may be used. Still further, the present invention can be constructed using any desired semiconductor material, such as silicon.

また実際のデバイスでは従来のものと同様に耐圧や信頼
度の確保などのため、第5図に示すようにP+層を設け
てチャンネルストッパ構造の適用表面保護膜の設置など
の配慮が行われる。
Further, in an actual device, in order to ensure voltage resistance and reliability, as in the conventional device, consideration is given to providing a P+ layer and installing a surface protection film to which a channel stopper structure is applied, as shown in FIG.

また実際的には第4図に示すように接地已に接続される
電極T、T、を樹脂成型などされたデバイス内部で接続
し、1本の接続リードを引き出す構造がとられる。
Practically, as shown in FIG. 4, a structure is used in which the electrodes T, T connected to the grounding wire are connected inside a device made of resin molding or the like, and one connection lead is pulled out.

(発明の効果) 以上から明らかなように本発明によれば、従来回路のよ
うに素子の特性不揃いにもとづく問題を生ずることなく
確実な防護を行いうるデバイスを提供できるもので通信
線路などのサージ防護に用いてその効果は大きい。
(Effects of the Invention) As is clear from the above, according to the present invention, it is possible to provide a device that can provide reliable protection without causing problems due to uneven characteristics of elements as in conventional circuits. It is highly effective when used for protection.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は双方向性2端子サイリスタの説明
図および従来のサージ防護回路図、第3図は本発明の一
実施例図、第4図は本発明によるサージ防護回路図、第
5図は他の実施例図である。 第3図 第1図 第2図 第4図 第5図
1 and 2 are an explanatory diagram of a bidirectional two-terminal thyristor and a conventional surge protection circuit diagram, FIG. 3 is a diagram of an embodiment of the present invention, and FIG. 4 is a surge protection circuit diagram according to the present invention. FIG. 5 is a diagram of another embodiment. Figure 3 Figure 1 Figure 2 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims]  N型(P型)ベースとその一部を短絡されたP型(N
型)エミッタを一つの電極とし、これを2箇宛P型(N
型)半導体共通基板を挟んで対向するように設けたこと
を特徴とするサージ防護デバイス。
N-type (P-type) base and P-type (N
A P-type (N type) emitter is used as one electrode, and this is connected to two P-type (N
type) A surge protection device characterized by being provided facing each other across a common semiconductor substrate.
JP1273844A 1989-10-23 1989-10-23 Surge protection device Expired - Fee Related JPH0682835B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1273844A JPH0682835B2 (en) 1989-10-23 1989-10-23 Surge protection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1273844A JPH0682835B2 (en) 1989-10-23 1989-10-23 Surge protection device

Publications (2)

Publication Number Publication Date
JPH03136374A true JPH03136374A (en) 1991-06-11
JPH0682835B2 JPH0682835B2 (en) 1994-10-19

Family

ID=17533335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1273844A Expired - Fee Related JPH0682835B2 (en) 1989-10-23 1989-10-23 Surge protection device

Country Status (1)

Country Link
JP (1) JPH0682835B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326937A (en) * 1992-05-14 1993-12-10 Nippon Telegr & Teleph Corp <Ntt> Semiconductor lightning surge protection element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02174265A (en) * 1988-12-27 1990-07-05 Hakusan Seisakusho:Kk Multipolar bidirectional semiconductor control element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02174265A (en) * 1988-12-27 1990-07-05 Hakusan Seisakusho:Kk Multipolar bidirectional semiconductor control element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326937A (en) * 1992-05-14 1993-12-10 Nippon Telegr & Teleph Corp <Ntt> Semiconductor lightning surge protection element

Also Published As

Publication number Publication date
JPH0682835B2 (en) 1994-10-19

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