JPH0313578A - Thin film forming device - Google Patents

Abstract

PURPOSE:To form a desired thin film on both sides of a substrate without turning off a vacuum by providing a substrate holder capable of holding a substrate with the two principal surfaces exposed with sufficient strength and stability and furnishing one film forming chamber or two adjacent chambers with the film forming mechanisms opposed to each other. CONSTITUTION:A retainer 2 provided to the main body 1 of the substrate holder is pushed up to set a substrate 3, the retainer 2 is then returned, and the substrate 3 is held with sufficient strength and stability with the most area of the two principal planes exposed. One chamber 5a in which two film forming mechanisms are opposed is used, or two adjacent chambers 5a and 5b in which the film forming mechanisms are opposed are used. Consequently, the same or different thin films can be formed on both sides simultaneously or one at a time without exposing the substrate 3 to the atmosphere and without detaching the substrate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film forming apparatus, and more particularly to a continuous, single-chamber thin film forming apparatus using a substrate holder.

[Conventional technology]

FIG. 2(a) is a cross-sectional view showing a substrate holder in a conventional thin film forming apparatus, where 1 is a substrate holder, 2 is a presser metal fitting fixed to this substrate holder 1 and fixes the substrate from the back side, 3 is a substrate, 4 is a terrace portion that fixes the position of the substrate 3 in the thickness direction.

The substrate 3 placed on the substrate holder 1 comes into contact with a terrace portion 4 that fixes the position of the substrate 3 in the thickness direction.

Next, the substrate is fixed to the substrate holder 1 by pressing it against the terrace portion 4 with the presser fitting 2 from the back side of the substrate.

FIG. 2(C) is a conceptual diagram of a conventional continuous wE thin film forming apparatus, in which 1 is a substrate holder, 5a and 5b are film forming chambers, 6 is a substrate heater, 7 is a counter electrode, and 8a.

8b and 8c are gate valves, 9 is a gas inlet, and 10 is a gas exhaust system.

The gate valve 8a is opened and the substrate holder 1 to which the substrate 3 is fixed is placed into the film forming chamber 5a.

Next, the substrate holder l is controlled to a constant temperature by the substrate heater 6, and is evacuated by the gas exhaust system 19. After reaching a predetermined degree of vacuum, film formation is started. After the film formation is completed, the gate pulp 8b between the adjacent film formation chamber 5b is opened and the substrate holder 1 is placed into the adjacent film formation chamber 5b. Further film formation is performed within the film formation chamber 5b.

[Problem to be solved by the invention]

Since the conventional board holder is configured as above,
If you cannot form a film on the back side of the substrate and want to form a film on the back side, -2 After forming a film on the surface of the substrate, remove it from the forming apparatus, remove the substrate from the substrate holder, set it again, and then start forming the film. There were problems such as low work efficiency and scratches on the thin film formed on the surface.

Further, conventional single-chamber and continuous thin film forming apparatuses grow a thin film only on one side of a substrate holder, so there is a problem that thin films cannot be continuously formed on both sides of a substrate.

This invention was made in order to solve the above-mentioned problems, and it has a substrate holder that allows the substrate to be easily attached and detached without removing the substrate (it has a substrate holder that can form a desired thin film on both sides of the substrate, and An object of the present invention is to obtain a thin film forming apparatus capable of forming a thin film on both sides of a substrate without breaking the vacuum.

[Means to solve the problem]

The thin film forming apparatus according to the present invention has a substrate holder that fixes the edge of the substrate with a metal fitting that moves to expand and contract, and a film forming chamber that includes:
One film forming chamber with two film forming mechanisms facing each other, or two film forming chambers with the film forming mechanisms of adjacent film forming chambers facing each other, can be used to coat both sides of the substrate simultaneously or on one side. This makes it possible to form thin films of the same or different types on different substrates without exposing the substrate to the atmosphere.

[Effect]

In the thin film forming apparatus according to the present invention, the substrate is fixed to the substrate holder by a metal fitting provided on the substrate holder that moves to expand and contract and covers only the edge of the substrate, and the film forming chamber has two film forming chambers facing each other in one vacuum chamber. Since the device has a film mechanism or is a continuous film forming device in which the film forming mechanisms in adjacent vacuum chambers are installed in opposing positions, there is no need to break the vacuum or remove the substrate from the substrate holder, turn it over, and reset it. Thin films can be formed on both sides of the substrate without requiring additional steps.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1(a) shows a substrate holder of a thin film forming apparatus according to an embodiment of the present invention, and FIGS. 1(b) and 1(C) show structural cross-sectional views of a presser fitting. In FIG. It is a board. 1 is a board holder main body, which covers most (90% or more) of each of the two main surfaces of the board 3 to be mounted.
It has an opening that exposes an area of .

Reference numeral 2 denotes a holding metal fitting that expands and contracts to fix the board 3; 11 is a spring built into the holding metal fitting to press the holding metal fitting 2 to the substrate 3; thereby, the holding metal fitting 2 holds the board with sufficient strength and stability. It functions as a holding mechanism.

The presser metal fitting 2 provided on the substrate holder main body 1 is shown in Fig. 1 (
a) Push up upward in the figure to fix the substrate 3 in the substrate holder.

FIGS. 1(d) and 1(e) are conceptual diagrams of a continuous thin film forming apparatus and a single chamber thin film forming apparatus according to the present invention, respectively,
1 is a substrate holder, 5a, 5b are film forming chambers, 6 is a substrate heater, 7 is a counter electrode, 8a, 8b.

8c is a gate valve, 9 is a gas inlet, and 10 is a gas exhaust system.

These devices have two opposing electrodes 7 in one chamber or in two adjacent chambers. Therefore, by using the substrate holder 1 that is fixed with both sides of the substrate 3 exposed, it is possible to simultaneously or only one side of the substrate 3 without breaking the vacuum, thus exposing the substrate to the atmosphere, and without removing the substrate 3. It is possible to form thin films of the same type or different types in each case.

〔Effect of the invention〕

As described above, according to the present invention, a substrate is held with both sides of the substrate exposed using a substrate holder having an expandable metal fitting, and two film-forming chambers or two adjoining chambers are used. Since two film forming mechanisms are installed facing each other, it is easy to attach and detach the substrate, and
This has the effect of allowing film formation on both sides of the substrate without removing the substrate and without breaking the vacuum.

[Brief explanation of the drawing]

FIG. 1(a) is a schematic diagram of a substrate holder according to an embodiment of the present invention, FIGS. 1(b) and 1(C) are structural sectional views of a holding fixture, and FIGS. Conceptual diagram of the forming device,
FIGS. 2(a) and 2(b) are a plan view and a sectional view showing a conventional substrate holder, and FIG. 2(C) is a conceptual diagram of a conventional continuous thin film forming apparatus. 1 is a substrate holder main body, 2 is a presser, 3 is a substrate, 4 is a terrace part, 5a, 5b are film forming chambers, 6 is a substrate heater, 7 is a counter electrode, 8a, 8b are gate valves, 9 is a gas introduction The port 10 is a gas exhaust system. Note that the same reference numerals in the figures indicate the same or equivalent parts. 10 near 7 right I reverse chart (0) (b) (C)

Claims (1)

[Claims] (1) In a thin film forming apparatus having a substrate holder for mounting a substrate on which a thin film is to be formed, the substrate holder is configured to hold the substrate in a state in which most areas of each of the two main surfaces of the substrate to be mounted are exposed. It has a mechanism to hold the film with sufficient strength and stability, and is equipped with two film-forming mechanisms facing each other as a film-forming chamber.
It is equipped with one film formation chamber or two film formation chambers in which the film formation mechanisms of adjacent film formation chambers are installed in opposing positions, and the same or different types of thin films can be applied to both sides of the substrate at the same time or on each side. A thin film forming apparatus characterized by being capable of forming a thin film without exposing it to the atmosphere.