JPH03126282A - Optical element retaining mechanism - Google Patents

Abstract

PURPOSE:To ease adjustment of optical axis when mounting a lens and improve mass- production capacity by constituting the title item with a stem for mounting an optical element, a substrate for fixing stem, and a stem socket and by positioning it with at least two positioning axes on the stem-supporting surface of the substrate and a press axis which is engaged to a cut-out part of the stem. CONSTITUTION:In a stem 1, a chip-mounting stand 3 is provided on the upper surface of a disc-shaped substrate 2. V-shaped positioning cut-out parts 4, 4 are provided at diagonal positions on the peripheral surface, and three electrical connection pins 5 are allowed to protrude on the lower surface. A circular pin insertion hole 16 is penetrated at the center of a stem-supporting surface 15 of a substrate 10 and at least two positioning axes 17 and 18 are provided corresponding to the position for fixing the stem 1. The lower edge part of a press axis 19 which is positioned on the normal bisector of a line connecting it should have a diameter so that it can be engaged to and disengaged from the cut-out part 4 of the stem 1 and the stem 1 is pushed onto the stem-supporting surface 15 by mutual operation of a plate spring 21 and a press axis 19. A stem socket 6 is provided with a pin connection hole into which an electrical connection pin is fitted and a current-conducting pin for soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an optical element holding mechanism used to hold an optical element such as a semiconductor laser.

<Prior Art> Conventional - As a holding mechanism for a semiconductor laser, there is a structure shown in FIG. 5, for example.

In the figure, l is a stem for mounting a semiconductor laser, and a chip mounting stand 3 is provided on the upper surface of a disk-shaped substrate 2. Cutouts 4.4 for positioning are provided at diagonal positions on the circumferential surface of the substrate 20, and three pins 5 for electrical connection are protruded from the lower surface of the substrate 2.

Reference numeral 6 denotes a stem socket for electrically and mechanically connecting the stem 1, and has three pin connection holes 7 on the top surface into which the three pins 5 are inserted, and the bottom surface has three pin connection holes 7 into which the three pins 5 are inserted. The three soldered pins that are electrically conductive have a protruding pin 8.

<Problems to be Solved by the Invention> The semiconductor laser holding mechanism having the above configuration does not include a mechanism for positioning the stem 1 with respect to the stem socket 6. Therefore, when the semiconductor laser is mounted on the stem 1,
The position of the light emitting point varies, and a complicated alignment mechanism is required when mounting optical components such as lenses. Moreover, it takes time to adjust the optical axis, making it unsuitable for mass production.

The present invention has been made in view of the above problem, and an object of the present invention is to provide a novel optical element holding mechanism that can simplify optical axis adjustment when mounting a lens by providing a m area that allows accurate positioning of the stem. With the goal.

Means for Solving the Problems> The optical element holding mechanism according to the present invention has a stem for mounting an optical element having a notch on the circumferential surface and an electrical connection bottle protruding from the lower surface, and a bottle insertion hole. A base for fixing a stem, which is provided with at least two positioning shafts corresponding to the fixed positions of the stem on a stem support surface, and a presser shaft that is removable from the notch and urges the stem in the direction of the positioning shaft. It is provided with a base and a stem socket having a bottle connection hole into which an electrical connection pin of the stem protruding from the bottle insertion hole is fitted.

Effect> Since the presser shaft engages with the notch of the stem on the stem support surface of the base and presses the stem against the stem support surface and the positioning shaft, the stem is always accurately positioned on the base.

<Embodiment> FIGS. 1 and 2 show a semiconductor laser holding mechanism according to an embodiment of the present invention, in which a stem 1 for mounting a semiconductor laser, a base 10 for fixing the stem, and a stem 1 for mounting a semiconductor laser, a base 10 for fixing the stem, and It is composed of a socket 6.

The stem 1 is provided with a chip mounting stand 3 for mounting a semiconductor laser on the upper surface of a disk-shaped substrate 2. The circumferential surface of the substrate 2 has a positioning notch 4 in the shape of a ■.
4 are provided at diagonal positions, and three electrical connection pins 5 project downward from the bottom surface of the substrate 2.

The base 2 has a shape that integrally includes vertical plates 13 and 14 at both ends of a horizontal base 12, and a stem support surface 15 for supporting and fixing the stem 1 on the upper surface of the horizontal base vi12.
That's what I'm saying. A circular bottle insertion hole 16 is formed through the center of the stem support surface 15, and when the stem 1 is supported on the stem support surface 15, the three electrical connection pins 5 are located below the horizontal board 12 from the bottle insertion hole 16. protrude to

At least two positioning shafts 17 and 18 are protruded from the stem support surface 15 in correspondence with the fixed positions of the stem 1.

Each of the positioning shafts 17, 18 has a cylindrical shape, and the peripheral surface of the stem 1 placed on the stem support surface 15 abuts against the shaft peripheral surface of each of the positioning shafts 17, 18.

The presser shaft 1 is placed on the perpendicular bisector of the line connecting the positioning shafts 17 and 18, that is, on the opposite position of the positioning shafts 17 and 18.
Position 9.

This presser shaft 19 has an inverted conical shape and is attached to a fixture 20 provided on the base 10. This fixture 2
0 is a plate spring 21 whose lower end is fixed to the vertical plate 13 of the base 10, and a mounting plate attached to the upper end of the plate spring 12 that protrudes onto the base 10 so as to protrude in the direction of the stem support surface 15. 22, and the presser shaft 1 is attached to the lower surface of this mounting plate 22.
9 is installed facing downward.

In this installed state, the lower end of the presser shaft 19 is attached to the stem support surface 15.
The outer shape of this lower end is that of stem 1.
The diameter is set such that it can be engaged with and detached from the notch 4 of. The opposing distance between the presser shaft 19 and the positioning shaft 17.18 is the stem 1.
This allows the stem 1 to be supported on the stem support surface 15 and the presser shaft 19 to be attached to the notch 4.
When engaged, the stem 1 is pressed diagonally downward and onto the stem support surface 15 due to the interaction between the spring pressure of the leaf spring 21 and the tapered surface of the presser shaft 19.

Next, the stem socket 6 is attached to the vertical plate 13.1 of the base 10.
Although not shown in the figure, there are three bottle connection holes into which the three electric connection pins 5 protruding downward from the bottle insertion holes 16 are fitted, and each bottle 5 and the electric It is the same as the conventional example (FIG. 5) in that it is provided with a soldering pin that conducts electrically.

FIGS. 3 and 4 show other embodiments of the fixing device 20 provided on the base 10, in which the attachment of the stem l to the stem support surface 15 is improved compared to the first embodiment described above. is even better.

The illustrated fixture 20 includes a column 23 fixed to an end position of a vertical plate 13, a temporary spring 24 whose one end is fixed to the upper end of the column 23 and positioned parallel to the stem support surface 15, and this plate. It consists of a mounting plate 25 attached to the other end of the spring 24 so as to protrude in the direction of the stem support surface 15.
5, the presser shaft 19 is attached downwardly.

In the semiconductor laser holding mechanism configured as described above, the base 10
When positioning and fixing the stem 1, the stem 1 is first placed on the stem support surface 15 so that the three electrical connection pins 5 fit into the pin insertion holes 16. In this case, the stem 1 is oriented so that one notch 4 is on the presser shaft 19 side, and then the notch 4 is engaged with the presser shaft 19, and the circumferential surface of the stem 1 on the opposite side is aligned with the positioning shaft 17. .18.

When the stem 1 is set on the stem support surface 15 in this way, the spring pressure of the temporary spring 21 or 24 interacts with the tapered surface of the presser shaft 19 to press the stem 1 diagonally downward, and the lower surface of the stem On the support surface 15, the circumferential surface of the stem 1 is pressed against the circumferential surfaces of two positioning shafts 17, 18, respectively, so that constant and precise positioning is always achieved. According to the inventor's experiments, when the positioning of stem 1 is repeated using this method, the positioning accuracy is 20±μ
It was within m.

After that, the stem socket 6 is positioned in the space between the vertical plates 13 and 14 of the base 1, and the three electrical connection pins 5 protruding downward from the pin insertion hole 16 are connected to the three pin connection holes of the stem socket 6. I will do it.

<Effects of the Invention> As described above, the present invention constitutes an optical element holding mechanism with a stem for mounting an optical element, a base for fixing the stem, and a stem socket, and a At least two positioning shafts and a presser shaft that engages with the notch of the stem are provided, and the stem is positioned by pressing against the stem support surface and the positioning shaft, so the position of the optical element does not vary and the position of the lens, etc. When mounting optical components, there is no need for a complicated alignment mechanism, and optical axis adjustment can be performed in a short time, greatly improving mass productivity.

Further, even when measuring the optical characteristics of an optical element, alignment can be simplified and measurement work can be made more efficient, achieving the remarkable effects of achieving the purpose of the invention.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the configuration of an optical element holding mechanism according to an embodiment of the present invention, FIG. 2 is a perspective view showing a stem holding state according to the embodiment of FIG. 1, and FIG. FIG. 4 is a perspective view showing the stem holding state according to the embodiment of FIG. 3, and FIG. 5 is a perspective view showing the configuration of a conventional example. ■・・・Stem 4・・・Notch 5・・・
Electrical connection pin 6... Stem socket 7... Pin connection hole 10... Base 15... Stem support surface 16... Pin insertion hole 17, 18... Positioning axis 19...presser shaft

Claims (1)

[Claims] A stem for mounting an optical element having a notch on its circumferential surface and an electrical connection pin protruding from its lower surface, and at least a stem supporting surface having a pin insertion hole corresponding to a fixing position of the stem. A base for fixing the stem, which is provided with two positioning shafts and a presser shaft that is removable in the notch and urges the stem in the direction of the positioning shaft, and an electrical connection of the stem protruding from the pin insertion hole. An optical element holding mechanism consisting of a stem socket with a pin connection hole into which a pin is inserted.