JPH03125510U - - Google Patents
Info
- Publication number
- JPH03125510U JPH03125510U JP3365590U JP3365590U JPH03125510U JP H03125510 U JPH03125510 U JP H03125510U JP 3365590 U JP3365590 U JP 3365590U JP 3365590 U JP3365590 U JP 3365590U JP H03125510 U JPH03125510 U JP H03125510U
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- insulating plate
- active element
- insulating
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Description
第１図は本考案のマイクロストリツプアンテナ
の一実施例の一部断面を示す斜視図である。
１……積層絶縁板、１１，１２，〜，１５……
絶縁板、２……アンテナエレメント、３……接栓
、４……スルーホール、５……分配導波パターン
、６……スルーホール、７……増幅器、８……導
波路、９……スルーホール、１０……移相器、１
１……電源配線パターン、１２……制御配線パタ
ーン、１３……スルーホール、１４……接地パタ
ーン。
FIG. 1 is a perspective view showing a partial cross section of an embodiment of the microstrip antenna of the present invention. 1...Laminated insulating board, 1 1 , 1 2 , ~, 1 5 ...
Insulating plate, 2... antenna element, 3... plug, 4... through hole, 5... distributed waveguide pattern, 6... through hole, 7... amplifier, 8... waveguide, 9... through Hall, 10... Phase shifter, 1
1... Power wiring pattern, 12... Control wiring pattern, 13... Through hole, 14... Ground pattern.
Claims (1)
メントを複数配置し電磁波の送受をおこなうマイ
クロストリツプアンテナにおいて、 前記絶縁板の下に積層された他の絶縁板と、 絶縁板間に前記各アンテナエレメントに対向す
るように配置された接地金属板と、 前記各アンテナエレメントに対応して、それぞ
れ接地金属薄板の下に配置され、各アンテナエレ
メントと授受する信号の位相を指定されたように
移相する電子制御型移相器を含む能動素子と、 各能動素子を駆動するための配線と、 各絶縁板を貫通するスルホールパターンにより
接続され対応する各アンテナエレメントと各能動
素子間および各能動素子とアンテナ用の入出力端
子間をそれぞれ接続する第１、第２の導波路とを
有することを特徴とするマイクロストリツプアン
テナ。[Scope of Claim for Utility Model Registration] A microstrip antenna that transmits and receives electromagnetic waves by arranging a plurality of antenna elements made of thin metal plates on the upper surface of an insulating plate, comprising: another insulating plate laminated under the insulating plate; A grounded metal plate disposed between the insulating plates to face each antenna element; An active element including an electronically controlled phase shifter that shifts the phase as specified, wiring for driving each active element, and a corresponding antenna element connected to each active element by a through-hole pattern passing through each insulating plate. A microstrip antenna characterized by having first and second waveguides that connect between the elements and between each active element and an input/output terminal for the antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3365590U JPH03125510U (en) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3365590U JPH03125510U (en) | 1990-03-30 | 1990-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03125510U true JPH03125510U (en) | 1991-12-18 |
Family
ID=31537491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3365590U Pending JPH03125510U (en) | 1990-03-30 | 1990-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03125510U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001004985A1 (en) * | 1999-07-09 | 2001-01-18 | Nec Corporation | High-frequency device and method of manufacture thereof |
| JP2001267842A (en) * | 2000-03-15 | 2001-09-28 | Mitsubishi Electric Corp | Microwave module |
| WO2006098390A1 (en) * | 2005-03-15 | 2006-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
| JP2018182449A (en) * | 2017-04-07 | 2018-11-15 | 株式会社東芝 | Antenna module |
| WO2020115979A1 (en) * | 2018-12-04 | 2020-06-11 | 株式会社フジクラ | Antenna array |
-
1990
- 1990-03-30 JP JP3365590U patent/JPH03125510U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001004985A1 (en) * | 1999-07-09 | 2001-01-18 | Nec Corporation | High-frequency device and method of manufacture thereof |
| JP2001267842A (en) * | 2000-03-15 | 2001-09-28 | Mitsubishi Electric Corp | Microwave module |
| WO2006098390A1 (en) * | 2005-03-15 | 2006-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
| JP2018182449A (en) * | 2017-04-07 | 2018-11-15 | 株式会社東芝 | Antenna module |
| WO2020115979A1 (en) * | 2018-12-04 | 2020-06-11 | 株式会社フジクラ | Antenna array |