JPH0312492U - - Google Patents
Info
- Publication number
- JPH0312492U JPH0312492U JP7390089U JP7390089U JPH0312492U JP H0312492 U JPH0312492 U JP H0312492U JP 7390089 U JP7390089 U JP 7390089U JP 7390089 U JP7390089 U JP 7390089U JP H0312492 U JPH0312492 U JP H0312492U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat dissipation
- heat
- lead wire
- metal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 3
- 239000007769 metal material Substances 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7390089U JPH079434Y2 (ja) | 1989-06-23 | 1989-06-23 | 電気部品の放熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7390089U JPH079434Y2 (ja) | 1989-06-23 | 1989-06-23 | 電気部品の放熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0312492U true JPH0312492U (US06346242-20020212-C00066.png) | 1991-02-07 |
JPH079434Y2 JPH079434Y2 (ja) | 1995-03-06 |
Family
ID=31613115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7390089U Expired - Fee Related JPH079434Y2 (ja) | 1989-06-23 | 1989-06-23 | 電気部品の放熱装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH079434Y2 (US06346242-20020212-C00066.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002301420A (ja) * | 2001-04-05 | 2002-10-15 | Ohtsuka Brush Manufacturing Co Ltd | 自在塗布具 |
-
1989
- 1989-06-23 JP JP7390089U patent/JPH079434Y2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002301420A (ja) * | 2001-04-05 | 2002-10-15 | Ohtsuka Brush Manufacturing Co Ltd | 自在塗布具 |
JP4618926B2 (ja) * | 2001-04-05 | 2011-01-26 | 株式会社マルテー大塚 | 自在塗布具 |
Also Published As
Publication number | Publication date |
---|---|
JPH079434Y2 (ja) | 1995-03-06 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |