JPH03122557U - - Google Patents
Info
- Publication number
- JPH03122557U JPH03122557U JP3217490U JP3217490U JPH03122557U JP H03122557 U JPH03122557 U JP H03122557U JP 3217490 U JP3217490 U JP 3217490U JP 3217490 U JP3217490 U JP 3217490U JP H03122557 U JPH03122557 U JP H03122557U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- bent
- lead
- board thickness
- depth equal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3217490U JP2522678Y2 (ja) | 1990-03-28 | 1990-03-28 | 半導体装置のリードフレーム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3217490U JP2522678Y2 (ja) | 1990-03-28 | 1990-03-28 | 半導体装置のリードフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03122557U true JPH03122557U (uk) | 1991-12-13 |
JP2522678Y2 JP2522678Y2 (ja) | 1997-01-16 |
Family
ID=31535093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3217490U Expired - Lifetime JP2522678Y2 (ja) | 1990-03-28 | 1990-03-28 | 半導体装置のリードフレーム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2522678Y2 (uk) |
-
1990
- 1990-03-28 JP JP3217490U patent/JP2522678Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2522678Y2 (ja) | 1997-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |