JPH03122510U - - Google Patents

Info

Publication number
JPH03122510U
JPH03122510U JP3262390U JP3262390U JPH03122510U JP H03122510 U JPH03122510 U JP H03122510U JP 3262390 U JP3262390 U JP 3262390U JP 3262390 U JP3262390 U JP 3262390U JP H03122510 U JPH03122510 U JP H03122510U
Authority
JP
Japan
Prior art keywords
resistance
temperature fuse
complex
circuit board
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3262390U
Other languages
English (en)
Other versions
JPH0751761Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990032623U priority Critical patent/JPH0751761Y2/ja
Publication of JPH03122510U publication Critical patent/JPH03122510U/ja
Application granted granted Critical
Publication of JPH0751761Y2 publication Critical patent/JPH0751761Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Fuses (AREA)

Description

【図面の簡単な説明】
第1図A並びに第3図Bはそれぞれ本考案の一
実施例を示す平面説明図並びに側面説明図、第2
図A並びに第2図Bはそれぞれ本考案の別実施例
を示す平面説明図並びに側面説明図、第3図A並
びに第3図Bはそれぞれ従来例を示す平面説明図
並びに側面説明図であ。 1…低融点可溶合金エレメント、2…抵抗エレ
メント、11,12…リード線、110,120
…ハンダ付け箇所、210,220…ハンダ付け
箇所。

Claims (1)

    【実用新案登録請求の範囲】
  1. 低融点可溶合金エレメントと抵抗エレメントと
    を備え、各エレメントの両端にリード線を接続し
    た抵抗・温度ヒユーズ複合体の各エレメントの両
    側リード線を回路基板にハンダ付けする抵抗・温
    度ヒユーズ複合体の取付構造において、抵抗エレ
    メントのリード線のハンダ付け箇所に至る長さを
    温度ヒユーズエレメントのリード線のハンダ付け
    箇所に至る長さよりも短くしたことを特徴とする
    抵抗・温度ヒユーズ複合体の回路基板への取付構
    造。
JP1990032623U 1990-03-27 1990-03-27 抵抗・温度ヒューズ複合体の回路基板への取付構造 Expired - Fee Related JPH0751761Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990032623U JPH0751761Y2 (ja) 1990-03-27 1990-03-27 抵抗・温度ヒューズ複合体の回路基板への取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990032623U JPH0751761Y2 (ja) 1990-03-27 1990-03-27 抵抗・温度ヒューズ複合体の回路基板への取付構造

Publications (2)

Publication Number Publication Date
JPH03122510U true JPH03122510U (ja) 1991-12-13
JPH0751761Y2 JPH0751761Y2 (ja) 1995-11-22

Family

ID=31535694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990032623U Expired - Fee Related JPH0751761Y2 (ja) 1990-03-27 1990-03-27 抵抗・温度ヒューズ複合体の回路基板への取付構造

Country Status (1)

Country Link
JP (1) JPH0751761Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008097943A (ja) * 2006-10-11 2008-04-24 Uchihashi Estec Co Ltd 温度ヒューズ内蔵抵抗器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275764U (ja) * 1975-12-05 1977-06-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275764U (ja) * 1975-12-05 1977-06-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008097943A (ja) * 2006-10-11 2008-04-24 Uchihashi Estec Co Ltd 温度ヒューズ内蔵抵抗器

Also Published As

Publication number Publication date
JPH0751761Y2 (ja) 1995-11-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees