JPH03122165A - Electroconductive resin composition - Google Patents
Electroconductive resin compositionInfo
- Publication number
- JPH03122165A JPH03122165A JP1260140A JP26014089A JPH03122165A JP H03122165 A JPH03122165 A JP H03122165A JP 1260140 A JP1260140 A JP 1260140A JP 26014089 A JP26014089 A JP 26014089A JP H03122165 A JPH03122165 A JP H03122165A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- metal salt
- resin composition
- alkali metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 15
- -1 alkali metal salt Chemical class 0.000 claims abstract description 17
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims abstract description 14
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920001400 block copolymer Polymers 0.000 claims abstract description 11
- 229920000570 polyether Polymers 0.000 claims abstract description 11
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 10
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 7
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 229920001225 polyester resin Polymers 0.000 claims abstract description 7
- 239000004645 polyester resin Substances 0.000 claims abstract description 7
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims abstract description 5
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 5
- 150000001450 anions Chemical class 0.000 claims abstract description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 4
- 229920001577 copolymer Polymers 0.000 claims description 9
- 229920006037 cross link polymer Polymers 0.000 claims description 4
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 claims 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims 1
- 229910052740 iodine Inorganic materials 0.000 claims 1
- 239000011630 iodine Substances 0.000 claims 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 abstract 1
- DTQVDTLACAAQTR-UHFFFAOYSA-M Trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-M 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 9
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- JZVUAOCDNFNSGQ-UHFFFAOYSA-N 7-methoxy-2-phenyl-1h-quinolin-4-one Chemical compound N=1C2=CC(OC)=CC=C2C(O)=CC=1C1=CC=CC=C1 JZVUAOCDNFNSGQ-UHFFFAOYSA-N 0.000 description 2
- SPBDXSGPUHCETR-JFUDTMANSA-N 8883yp2r6d Chemical compound O1[C@@H](C)[C@H](O)[C@@H](OC)C[C@@H]1O[C@@H]1[C@@H](OC)C[C@H](O[C@@H]2C(=C/C[C@@H]3C[C@@H](C[C@@]4(O[C@@H]([C@@H](C)CC4)C(C)C)O3)OC(=O)[C@@H]3C=C(C)[C@@H](O)[C@H]4OC\C([C@@]34O)=C/C=C/[C@@H]2C)/C)O[C@H]1C.C1C[C@H](C)[C@@H]([C@@H](C)CC)O[C@@]21O[C@H](C\C=C(C)\[C@@H](O[C@@H]1O[C@@H](C)[C@H](O[C@@H]3O[C@@H](C)[C@H](O)[C@@H](OC)C3)[C@@H](OC)C1)[C@@H](C)\C=C\C=C/1[C@]3([C@H](C(=O)O4)C=C(C)[C@@H](O)[C@H]3OC\1)O)C[C@H]4C2 SPBDXSGPUHCETR-JFUDTMANSA-N 0.000 description 2
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- ZJZXSOKJEJFHCP-UHFFFAOYSA-M lithium;thiocyanate Chemical compound [Li+].[S-]C#N ZJZXSOKJEJFHCP-UHFFFAOYSA-M 0.000 description 2
- LLYCMZGLHLKPPU-UHFFFAOYSA-M perbromate Chemical compound [O-]Br(=O)(=O)=O LLYCMZGLHLKPPU-UHFFFAOYSA-M 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 2
- 229940116357 potassium thiocyanate Drugs 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- CJYDNDLQIIGSTH-UHFFFAOYSA-N 1-(3,5,7-trinitro-1,3,5,7-tetrazocan-1-yl)ethanone Chemical compound CC(=O)N1CN([N+]([O-])=O)CN([N+]([O-])=O)CN([N+]([O-])=O)C1 CJYDNDLQIIGSTH-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Inorganic materials [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 description 1
- 229940005991 chloric acid Drugs 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001496 lithium tetrafluoroborate Inorganic materials 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、帯電防止効果をもった導電性樹脂組成物に関
する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a conductive resin composition having an antistatic effect.
(従来の技術)
近年、プラスチック成型技術の進歩にともなって、各種
筐体、包装材料の多くが、プラスチック製となり、更に
は、歯車などのエンジニアリング部品の分野でもプラス
チ・ツク製品が進出しても)る。(Conventional technology) In recent years, with the advancement of plastic molding technology, many of the various housings and packaging materials have become made of plastic, and plastic products have also entered the field of engineering parts such as gears. ).
これらの用途に用いられるプラスチ・ツクは、特別な処
理をしない限り絶縁体であり、その表面に静電荷を集め
る傾向を有することは良く知られている。It is well known that the plastics used in these applications are insulators unless specially treated and have a tendency to collect static charges on their surfaces.
一方、各種電気機器に用いられているICやLSIのよ
うな集積回路においては、その集積度が高くなるにつれ
て静電気による故障が増えてきており、これらの部品を
搬送する際や、これらの部品を使用した電子機器の使用
時において静電気防止が強く望まれている。On the other hand, as the degree of integration of integrated circuits such as ICs and LSIs used in various electrical devices increases, failures due to static electricity are increasing. It is strongly desired to prevent static electricity when using electronic equipment.
このような要望に応えるために、プラスチ、ソク製品に
無機系の導電性フィラーや、有機系の界面活性剤を練り
こんだり、バインダーとともに塗布するなどの方法が開
発されている。In order to meet these demands, methods have been developed such as incorporating inorganic conductive fillers and organic surfactants into plasti and soku products, or coating them with binders.
無機系の導電性フィラーを用いた帯電防止処理は、導電
性は優れているものの透明な高分子材料に用いた場合、
その透明性を損なうという欠点があった。Antistatic treatment using inorganic conductive fillers has excellent conductivity, but when used on transparent polymer materials,
This had the disadvantage of impairing its transparency.
また、有機系の帯電防止処理としては、各種の界面活性
剤が上市されているが、このような帯電防止処理では空
気中の水分を利用して導電性を発現させるためその効果
は湿度に大きく依存する欠点を有していた。一方、有機
系の導電性組成物としては、ポリエチレンオキサイド(
以下PEOと言う)や、ポリプロピレンオキサイド(以
下PPOと言う)のようにその分子構造中に極性基を佇
する高分子を有機溶媒に溶解した後、流延法によって薄
膜を形成し、この薄膜をアルカリ金属塩をを機溶媒に溶
解した溶液に浸せき後乾燥して得られる高分子−アルカ
リ金属塩の複合体が知られている[例えば、Br、 P
olymer J 、 + 1 +319 (19
75) ; F ast I on T ran
sferIn Ionlcs−5−、685(198
1)コ。この複合体は室温で比較的高いイオン伝導性を
有している。In addition, various surfactants are on the market as organic antistatic treatments, but these antistatic treatments use moisture in the air to develop conductivity, so their effectiveness is greatly affected by humidity. It had some disadvantages. On the other hand, as an organic conductive composition, polyethylene oxide (
After dissolving a polymer having a polar group in its molecular structure, such as PEO (hereinafter referred to as PEO) or polypropylene oxide (hereinafter referred to as PPO), in an organic solvent, a thin film is formed by a casting method. A polymer-alkali metal salt complex obtained by immersing an alkali metal salt in a solution of a solvent and then drying is known [for example, Br, P
olymer J, + 1 +319 (19
75) ; Fast I on Tran
sferIn Ionlcs-5-, 685 (198
1) Ko. This complex has relatively high ionic conductivity at room temperature.
しかし、PEOあるいはPPO単独にアルカリ金属塩を
溶解した複合体を用いてプラスチックの帯電防止処理を
行う場合、PEO単独ではポリウレタン樹脂やエポキシ
樹脂以外の樹脂とは相溶性が悪く充分な性能が得られな
い。また、水への溶解性も大きいために帯電防止剤とし
てプラスチックに混入しても水に溶解してしまうので水
抽出され徐々に帯電防止効果が減少する。また、PPO
単独ではウレタン樹脂やエポキシ樹脂以外にもアクリル
樹脂やポリエステル樹脂との相溶性も良いものの、アル
カリ金属塩の溶解度が小さく低い導電性のものしか得ら
れない。However, when performing antistatic treatment on plastics using a composite of PEO or PPO alone in which an alkali metal salt is dissolved, sufficient performance cannot be obtained because PEO alone is not compatible with resins other than polyurethane resins and epoxy resins. do not have. In addition, it has a high solubility in water, so even if it is mixed into plastic as an antistatic agent, it will dissolve in water and will be extracted with water, gradually reducing its antistatic effect. Also, PPO
When used alone, it has good compatibility with acrylic resins and polyester resins in addition to urethane resins and epoxy resins, but the solubility of alkali metal salts is low and only low conductivity can be obtained.
(発明が解決しようとする問題点)
本発明は上記の事情に鑑みてなされたものであり、その
目的は良好な帯電防止性をもった導電性樹脂組成物を提
供することであり、また、樹脂本来の色調を損なうこと
なく湿度依存性の低い導電性樹脂組成物を提供すること
である。(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and its purpose is to provide a conductive resin composition with good antistatic properties, and An object of the present invention is to provide a conductive resin composition with low humidity dependence without impairing the original color tone of the resin.
(問題点を解決するための手段)
本発明者らは鋭意研究の結果、上記目的を達成すること
のできる導電性樹脂組成物を完成するに至った。(Means for Solving the Problems) As a result of intensive research, the present inventors have completed a conductive resin composition that can achieve the above object.
すなわち、ポリウレタン樹脂、エポキシ樹脂、エチレン
−酢酸ビニル共重合体樹脂、アクリル樹脂またはポリエ
ステル樹脂から選ばれた樹脂に、アルカリ金属塩および
ポリエーテル系高分子体を含有せしめたことを特徴とす
る導電性樹脂組成物である。That is, the conductive material is characterized by containing an alkali metal salt and a polyether polymer in a resin selected from polyurethane resin, epoxy resin, ethylene-vinyl acetate copolymer resin, acrylic resin, or polyester resin. It is a resin composition.
本発明で使用するアルカリ金属塩としては、特に限定さ
れないが、たとえば陰イオンが、ヘキサフロロリン、ヘ
キサフロロリン、テトラフロロホウ素などのハロゲン化
物アニオン、ヨウ素、臭素、塩素などのハロゲンアニオ
ン、ヨウ素酸、塩素酸、臭素酸などのハロゲン酸アニオ
ン、過ヨウ素酸、過塩素酸、過臭素酸などの過ハロゲン
酸アニオン、ンゼンスルホン酸、アルキルベンゼンスル
ホンルキルを有する有機酸アニオン、チオシアン酸など
であり、陽イオンはリチウム、ナトリウム、カリウム、
ルビジウム、セシウムである。イオン伝導性の点からは
、フロロホウ素リチウム、ヨウ化リチウム、過塩素酸リ
チウム、トリフロロ酢酸リチウム、チオシアン酸カリウ
ム、チオシアン酸リチウムが好ましい。The alkali metal salt used in the present invention is not particularly limited; , halogen acid anions such as chloric acid and bromate; perhalogen acid anions such as periodic acid, perchloric acid, and perbromate; organic acid anions having alkylbenzenesulfonic acid and alkylbenzenesulfonic acid; and thiocyanic acid. The ions are lithium, sodium, potassium,
Rubidium and cesium. From the viewpoint of ionic conductivity, lithium fluoroborate, lithium iodide, lithium perchlorate, lithium trifluoroacetate, potassium thiocyanate, and lithium thiocyanate are preferred.
アルカリ金属塩の樹脂への添加量は0.01重量%以上
、20重量%以下であり、0.01重量%未溝の添加で
は充分な帯電防止効果を与えないし、20重量%より多
く添加してもこれ以上導電性を向上させない。また、ポ
リエーテル系高分子体の添加量は0.5重量%以上、6
0重量%以下である。ポリエーテル系高分子体の添加量
が0゜5重量%より少ないと、良好な導電性を与えない
し、60重量%より多いと、得られる導電性樹脂組成物
の強度等の物性が低下する。The amount of alkali metal salt added to the resin is 0.01% by weight or more and 20% by weight or less, and adding 0.01% by weight without grooves will not provide a sufficient antistatic effect, and adding more than 20% by weight will not provide a sufficient antistatic effect. However, the conductivity will not be improved any further. In addition, the amount of polyether polymer added is 0.5% by weight or more, 6% by weight or more.
It is 0% by weight or less. If the amount of the polyether polymer added is less than 0.5% by weight, good conductivity will not be provided, and if it is more than 60% by weight, the physical properties such as strength of the resulting conductive resin composition will deteriorate.
本発明のポリエーテル系高分子体中におけるポリエチレ
ンオキサイド鎖の含有量は特に限定されないが、10%
以上90%以下が好ましい。10%より少ないと、導電
性が不安定となるので、アルカリ金属塩およびポリエー
テル系高分子体の添加量を多くしなければならない。ま
た90%より多いとアクリル樹脂やポリエステル樹脂に
対する相溶性が低下し、これらの高分子材料の外観を損
いやすくなる。The content of polyethylene oxide chains in the polyether polymer of the present invention is not particularly limited, but is 10%
It is preferably 90% or less. If it is less than 10%, the conductivity becomes unstable, so the amounts of the alkali metal salt and polyether polymer must be increased. Moreover, if it exceeds 90%, the compatibility with acrylic resins and polyester resins decreases, and the appearance of these polymeric materials tends to be impaired.
また、本発明のポリエーテル系高分子体として、ポリエ
チレンオキサイドとポリプロピレンオキサイドからなる
共重合体または末端水酸基の一部または全部をエステル
化した誘導体、更に架橋重合体としたものを用いること
ができる。Further, as the polyether polymer of the present invention, a copolymer consisting of polyethylene oxide and polypropylene oxide, a derivative obtained by esterifying some or all of the terminal hydroxyl groups, and further a crosslinked polymer can be used.
このような架橋重合体としては、ポリエチレンオキサイ
ドとポリプロピレンオキサイドからなる共重合体の末端
水酸基の一部または全部をアクリル酸やメタクリル酸の
エステルとした後、重合したもの、ポリイソシアナート
を架橋剤として用い末端水酸基と反応させて架橋重合体
としたものなどが挙げられる。Such crosslinked polymers include those obtained by converting some or all of the terminal hydroxyl groups of a copolymer of polyethylene oxide and polypropylene oxide into esters of acrylic acid or methacrylic acid and then polymerizing them, and those obtained by using polyisocyanate as a crosslinking agent. Examples include those made into crosslinked polymers by reacting with terminal hydroxyl groups.
このようにして得られた本発明のホリウレタン樹脂、エ
ポキシ樹脂、エチレン−酸ビ共重合体樹脂・アクリル樹
脂、ポリエステル樹脂の導電性樹脂組成物は透明で耐水
性に優れるとともに、良好な帯電防止効果を発揮するた
め、フィルムシート)各種ケーシング材料に使用するこ
とができる。また静電防止塗料や静電性接着剤、低周波
治療器機や心電図測定時のプローブ電極などの用に供す
ることができる。The electrically conductive resin composition of polyurethane resin, epoxy resin, ethylene-vinyl acid copolymer resin/acrylic resin, and polyester resin of the present invention thus obtained is transparent, has excellent water resistance, and has good antistatic property. Due to its effectiveness, it can be used in various casing materials (film sheet). It can also be used for antistatic paints, electrostatic adhesives, low-frequency treatment equipment, probe electrodes for electrocardiogram measurements, and the like.
(実 施 例)
以下、実施例および比較例により本発明の詳細な説明す
る。(Examples) Hereinafter, the present invention will be explained in detail with reference to Examples and Comparative Examples.
実施例1
市販のポリプロピレンオキサイドの分子量が2000、
共重合体分子中のエチレンオキサイド鎖の含有率が10
%であるポリエチレンオキサイドとポリプロピレンオキ
サイドのブロック共重合体(第一工業製薬(株)製、エ
パン710)を使用した。Example 1 Commercially available polypropylene oxide has a molecular weight of 2000,
The content of ethylene oxide chains in the copolymer molecule is 10
% of polyethylene oxide and polypropylene oxide (manufactured by Daiichi Kogyo Seiyaku Co., Ltd., Epan 710) was used.
この重合体5重量部を90°Cに加熱し、過塩素酸リチ
ウム(無水)を0.1重量部添加し、過塩素酸リチウム
およびブロック共重合体からなる乳白色ろう状の組成物
を得た。5 parts by weight of this polymer was heated to 90°C and 0.1 part by weight of lithium perchlorate (anhydrous) was added to obtain a milky white waxy composition consisting of lithium perchlorate and the block copolymer. .
この組成物を熱可塑性ポリウレタン樹脂(大日本インキ
化学工業製パンデックス)の99.49部に対して0.
51部添加して混合後、シート状に成型してその表面抵
抗率を測定した。測定結果を第1表に示す。なお熱可塑
性ポリウレタン樹脂単独の表面抵抗値も参考値として示
す。This composition was added to 99.49 parts of thermoplastic polyurethane resin (Pandex, manufactured by Dainippon Ink Chemical Industries, Ltd.) at 0.00 parts.
After adding 51 parts and mixing, it was molded into a sheet and its surface resistivity was measured. The measurement results are shown in Table 1. Note that the surface resistance value of the thermoplastic polyurethane resin alone is also shown as a reference value.
実施例2〜5
実施例1においてブロック共重合体および過塩素酸リチ
ウムの含量を第1表に示す組成に変えた以外は実施例1
に準じて導電性を有するポリウレタンシートを得た。こ
のシートの表面抵抗率の測定結果を第1表に示す。Examples 2 to 5 Example 1 except that the contents of the block copolymer and lithium perchlorate in Example 1 were changed to the compositions shown in Table 1.
A polyurethane sheet having electrical conductivity was obtained according to the method. Table 1 shows the measurement results of the surface resistivity of this sheet.
実施例6〜7
共重合体分子中のエチレンオキサイド鎖の含有率が50
%(実施例6)、90%(実施例7)である以外は実施
例3に準じて導電性を有するポリウレタンシートを得た
。このシートの表面抵抗率の測定結果を第1表に示す。Examples 6-7 The content of ethylene oxide chains in the copolymer molecule is 50
% (Example 6) and 90% (Example 7), a conductive polyurethane sheet was obtained according to Example 3. Table 1 shows the measurement results of the surface resistivity of this sheet.
比較例1〜2
過塩素酸リチウムの添加量を0.005%(比較例1)
、および30%(比較例2)に変えた以外は実施例4に
準じた。得られた樹脂の表面抵抗箋の測定結果を第1表
に示す。Comparative Examples 1-2 The amount of lithium perchlorate added was 0.005% (Comparative Example 1)
, and 30% (Comparative Example 2). Table 1 shows the results of measuring the surface resistance of the resin obtained.
過塩素酸リチウムの添加量が0.005%では表面抵抗
率があまり低下せず、帯電防止の効果が期待できない。When the amount of lithium perchlorate added is 0.005%, the surface resistivity does not decrease much and no antistatic effect can be expected.
従って、ポリエーテル系ブロック共重合体単独では効果
が期待できず、0.01%以上のアルカリ金属塩との存
在が必要である。Therefore, no effect can be expected from the polyether block copolymer alone, and the presence of an alkali metal salt of 0.01% or more is required.
また過塩素酸リチウムの添加■が30%では、20%の
ときとほとんど変化がない。Furthermore, when the amount of lithium perchlorate added (2) is 30%, there is almost no difference from when it is 20%.
実施例8〜11
熱可塑性ポリウレタン樹脂の代わりにエチレン−酢ビ共
重合体樹脂(日本合成化学工業(株)製、ソアレックス
)(実施例8)、アクリル樹脂(住人化学(株)製、ス
ミペックス)(実施例9)、ポリエステル樹脂(東しく
株)製、ケミット)(実施例10)、エポキシ樹脂(油
化シェルエポキシ(株)製、エピコート)(実施例11
)用いた以外は実施例3に準じた。得られた導電性樹脂
組成物の表面抵抗率の測定結果を第2表に示す。Examples 8 to 11 Instead of thermoplastic polyurethane resin, ethylene-vinyl acetate copolymer resin (Solex, manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd.) (Example 8), acrylic resin (manufactured by Sumitomo Chemical Co., Ltd., Sumipex) ) (Example 9), polyester resin (manufactured by Toshiku Co., Ltd., Chemit) (Example 10), epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat) (Example 11)
) was used in the same manner as in Example 3. Table 2 shows the measurement results of the surface resistivity of the obtained conductive resin composition.
なお、いずれの樹脂も単独での表面抵抗率は1014Ω
/口以上であった。The surface resistivity of each resin alone is 1014Ω.
/ It was more than a mouthful.
実施例12
市販のポリプロピレンオキサイドの分子量が2000、
共重合体分子中のエチレンオキサイド鎖の含有率が10
%であるブロック共重合体(第一工業製薬(株)製、エ
パン710)222部にメチルメタアクリレ−)10部
を加え、エステル変換反応によってブロック共重合体分
子中の2個の水酸基のうち1個がメタアクリル酸エステ
ルとなっている重合体を得た。Example 12 Commercially available polypropylene oxide has a molecular weight of 2000,
The content of ethylene oxide chains in the copolymer molecule is 10
% of a block copolymer (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., Epan 710), 10 parts of methyl methacrylate was added, and the two hydroxyl groups in the block copolymer molecule were converted by an ester conversion reaction. A polymer in which one of the polymers was a methacrylic ester was obtained.
この重合体100重量部をトルエンに溶解し、過酸化ベ
ンゾイル0.01重量部を加えて溶液重合し、架橋した
ポリエチレンオキサイドとポリプロピレンオキサイドの
ブロック共重合体を得た。100 parts by weight of this polymer was dissolved in toluene, and 0.01 part by weight of benzoyl peroxide was added for solution polymerization to obtain a crosslinked block copolymer of polyethylene oxide and polypropylene oxide.
該共重合体を90 ’Cに加熱し、過塩素酸リチウムを
10重量%添加して混合し、過塩素酸リチウムおよび架
橋したブロック共重合体からなる透明な組成物を得た。The copolymer was heated to 90'C and 10% by weight of lithium perchlorate was added and mixed to obtain a transparent composition consisting of lithium perchlorate and crosslinked block copolymer.
該組成物5重量%を熱可塑性ポリウレタン樹脂(大日木
インキ化学工業(株)製パンデックス)に添加して混合
後シート状に成型して表面抵抗率を測定した。その結果
を第3表に示す。5% by weight of the composition was added to a thermoplastic polyurethane resin (Pandex, manufactured by Dainichi Ink & Chemicals Co., Ltd.) and mixed, then molded into a sheet and its surface resistivity was measured. The results are shown in Table 3.
実施例13
架橋したブロック共重合体として、ポリプロピレンオキ
サイドの分子量が1200.共重合体のポリエチレンオ
キサイド鎖の含有率が40%の共重合体に、ポリイソシ
アネート(日本ポリウレタン(株)製造、コロネート)
を加えてウレタン架橋したブロック共重合体を用いた以
外は、実施例12に桑じた。Example 13 As a crosslinked block copolymer, the molecular weight of polypropylene oxide was 1200. Polyisocyanate (manufactured by Nippon Polyurethane Co., Ltd., Coronate) is added to a copolymer with a polyethylene oxide chain content of 40%.
Example 12 was repeated except that a block copolymer crosslinked with urethane was used.
得られたポリウレタンシートの表面抵抗率の測定結果を
第3表に示す。Table 3 shows the measurement results of the surface resistivity of the obtained polyurethane sheet.
実施例14〜18
添加するアルカリ金属塩をテトラフロロホウ素リチウム
(実施例14)、ヨウ化リチウム(実施例15)、トリ
フロロ酢酸リチウム(実施例16)チオシアン酸カリウ
ム(実施例17)またはチオシアン酸リチウム(実施例
18)とした以外は実施例3に準じた。得られたポリウ
レタンシートの表面抵抗率の測定結果を第3表に示す。Examples 14 to 18 The alkali metal salts to be added are lithium tetrafluoroborate (Example 14), lithium iodide (Example 15), lithium trifluoroacetate (Example 16), potassium thiocyanate (Example 17), or lithium thiocyanate. The procedure of Example 3 was followed except that (Example 18). Table 3 shows the measurement results of the surface resistivity of the obtained polyurethane sheet.
第4表
実施例19
実施例3で作成した導電性を有する熱可塑性ポリウレタ
ン樹脂製シートの25°C13%RH160%RHおよ
び80%RHにおける表面抵抗率を測定した。その結果
を第4表に示す。Table 4 Example 19 The surface resistivity of the conductive thermoplastic polyurethane resin sheet prepared in Example 3 was measured at 25° C., 13% RH, 160% RH, and 80% RH. The results are shown in Table 4.
比較例3
実施例3において、共重合体の含量を0%とした他は実
施例3に準じて作成した樹脂組成物をシートに成型した
。このシートの25℃、3%RH160%RHおよび8
0%RHにおける表面抵抗率の測定結果を第4表に示す
。Comparative Example 3 A resin composition prepared according to Example 3 except that the content of the copolymer was changed to 0% was molded into a sheet. 25℃, 3%RH160%RH and 8
Table 4 shows the measurement results of surface resistivity at 0% RH.
(発明の効果)
本発明の導電性樹脂組成物は何ら特別な混合方法を用い
ずに製造することができ、優れた帯電防止性を発揮する
。(Effects of the Invention) The conductive resin composition of the present invention can be produced without using any special mixing method, and exhibits excellent antistatic properties.
また、透明であるために、色調の鮮かな静電防止床材や
、プラスチック製防曇窓など、透明性や着色性が良好で
あることが要求される分野に使用することができる。In addition, because it is transparent, it can be used in fields that require good transparency and colorability, such as brightly colored anti-static flooring materials and anti-fog plastic windows.
更に、耐水性に優れ、湿度依存性も低いため、特性が経
時変化せず信顆性が高い。Furthermore, it has excellent water resistance and low humidity dependence, so its properties do not change over time and are highly reliable.
Claims (1)
ビニル共重合体樹脂、アクリル樹脂またはポリエステル
樹脂から選ばれた樹脂に、アルカリ金属塩を0.01重
量%以上20重量%以下およびポリエーテル系高分子体
を0.5重量%以上60重量%以下含有せしめたことを
特徴とする導電性樹脂組成物。 2、ポリエーテル系高分子体がポリエチレンオキサイド
とポリプロピレンオキサイドのブロック共重合体、また
は前記共重合体の架橋重合体であることを特徴とする請
求項1記載の導電性樹脂組成物。 3、アルカリ金属塩の陰イオンが、テトラフロロホウ素
、過塩素酸、トリフロロ酢酸、チオシアン酸またはヨウ
素から選ばれた一つであることを特徴とする請求項1記
載の導電性樹脂組成物。[Scope of Claims] 1. A resin selected from polyurethane resin, epoxy resin, ethylene-vinyl acetate copolymer resin, acrylic resin, or polyester resin, containing 0.01% by weight or more and 20% by weight or less of an alkali metal salt, and 1. A conductive resin composition containing 0.5% by weight or more and 60% by weight or less of a polyether polymer. 2. The conductive resin composition according to claim 1, wherein the polyether polymer is a block copolymer of polyethylene oxide and polypropylene oxide, or a crosslinked polymer of the copolymer. 3. The conductive resin composition according to claim 1, wherein the anion of the alkali metal salt is one selected from tetrafluoroboron, perchloric acid, trifluoroacetic acid, thiocyanic acid, or iodine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1260140A JPH03122165A (en) | 1989-10-06 | 1989-10-06 | Electroconductive resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1260140A JPH03122165A (en) | 1989-10-06 | 1989-10-06 | Electroconductive resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03122165A true JPH03122165A (en) | 1991-05-24 |
Family
ID=17343861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1260140A Pending JPH03122165A (en) | 1989-10-06 | 1989-10-06 | Electroconductive resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03122165A (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03247687A (en) * | 1990-02-26 | 1991-11-05 | Tajima Inc | Antistatic resin composition |
JPH0488057A (en) * | 1990-08-01 | 1992-03-19 | Tajima Inc | Electrically conductive polyurethane composition and method for imparting conductivity to substrate |
GB2257151A (en) * | 1991-06-24 | 1993-01-06 | Clinic Aid Ltd | Skin-contacting device containing conductive adhesive |
JPH055094A (en) * | 1991-04-19 | 1993-01-14 | Fukoku Co Ltd | Electrostatic material |
JPH07247413A (en) * | 1992-01-29 | 1995-09-26 | Monsanto Co | Antistatic agent for thermoplastic polymer |
US5758688A (en) * | 1993-12-20 | 1998-06-02 | Toto Ltd. | Automatic faucet |
JP2003020418A (en) * | 2001-07-09 | 2003-01-24 | Showa Denko Kk | Fine graphite powder, method for producing the same and use thereof |
JP2006199873A (en) * | 2005-01-21 | 2006-08-03 | Soken Chem & Eng Co Ltd | Adhesive sheet |
JP2007002223A (en) * | 2005-05-27 | 2007-01-11 | Daicel Chem Ind Ltd | Dispersion and modified organic solid particle |
JP2008519888A (en) * | 2004-11-10 | 2008-06-12 | ダウ グローバル テクノロジーズ インコーポレイティド | Epoxy resin toughened by amphiphilic block copolymer |
WO2009130872A1 (en) * | 2008-04-21 | 2009-10-29 | 日本カーリット株式会社 | Electrical conductivity-imparting agent, and composition and molded article each comprising the same |
US7887914B2 (en) | 2004-09-16 | 2011-02-15 | Nitto Denko Corporation | Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films |
JP2011084749A (en) * | 2011-01-18 | 2011-04-28 | Riken Technos Corp | Antistatic polyurethane resin composition |
US8092907B2 (en) | 2004-09-16 | 2012-01-10 | Nitto Denko Corporation | Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films |
US8153251B2 (en) | 2004-04-30 | 2012-04-10 | Nitto Denko Corporation | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets |
WO2013035681A1 (en) | 2011-09-06 | 2013-03-14 | 学校法人久留米大学 | Embedding resin composition for electron microscope, and method for observing sample on electron microscope using said composition |
JP2013231205A (en) * | 2007-12-27 | 2013-11-14 | Jsp Corp | Polyolefin-based resin foaming particle |
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-
1989
- 1989-10-06 JP JP1260140A patent/JPH03122165A/en active Pending
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03247687A (en) * | 1990-02-26 | 1991-11-05 | Tajima Inc | Antistatic resin composition |
JPH0488057A (en) * | 1990-08-01 | 1992-03-19 | Tajima Inc | Electrically conductive polyurethane composition and method for imparting conductivity to substrate |
JPH055094A (en) * | 1991-04-19 | 1993-01-14 | Fukoku Co Ltd | Electrostatic material |
GB2257151A (en) * | 1991-06-24 | 1993-01-06 | Clinic Aid Ltd | Skin-contacting device containing conductive adhesive |
JPH07247413A (en) * | 1992-01-29 | 1995-09-26 | Monsanto Co | Antistatic agent for thermoplastic polymer |
US5758688A (en) * | 1993-12-20 | 1998-06-02 | Toto Ltd. | Automatic faucet |
US5918855A (en) * | 1993-12-20 | 1999-07-06 | Toto Ltd. | Automatic faucet |
JP2003020418A (en) * | 2001-07-09 | 2003-01-24 | Showa Denko Kk | Fine graphite powder, method for producing the same and use thereof |
US8153251B2 (en) | 2004-04-30 | 2012-04-10 | Nitto Denko Corporation | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets |
US7887914B2 (en) | 2004-09-16 | 2011-02-15 | Nitto Denko Corporation | Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films |
US8092907B2 (en) | 2004-09-16 | 2012-01-10 | Nitto Denko Corporation | Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films |
JP2008519888A (en) * | 2004-11-10 | 2008-06-12 | ダウ グローバル テクノロジーズ インコーポレイティド | Epoxy resin toughened by amphiphilic block copolymer |
JP4682296B2 (en) * | 2005-01-21 | 2011-05-11 | 綜研化学株式会社 | Adhesive sheet |
JP2006199873A (en) * | 2005-01-21 | 2006-08-03 | Soken Chem & Eng Co Ltd | Adhesive sheet |
JP2007002223A (en) * | 2005-05-27 | 2007-01-11 | Daicel Chem Ind Ltd | Dispersion and modified organic solid particle |
JP2013231205A (en) * | 2007-12-27 | 2013-11-14 | Jsp Corp | Polyolefin-based resin foaming particle |
WO2009130872A1 (en) * | 2008-04-21 | 2009-10-29 | 日本カーリット株式会社 | Electrical conductivity-imparting agent, and composition and molded article each comprising the same |
JPWO2009130872A1 (en) * | 2008-04-21 | 2011-08-11 | 日本カーリット株式会社 | Conductivity imparting agent, and composition and molded body containing the same |
US9328264B2 (en) | 2009-02-27 | 2016-05-03 | Nitto Denko Corporation | Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet |
JP2011084749A (en) * | 2011-01-18 | 2011-04-28 | Riken Technos Corp | Antistatic polyurethane resin composition |
WO2013035681A1 (en) | 2011-09-06 | 2013-03-14 | 学校法人久留米大学 | Embedding resin composition for electron microscope, and method for observing sample on electron microscope using said composition |
US9870894B2 (en) | 2011-09-06 | 2018-01-16 | Kurume University | Embedding resin composition for electron microscopey and method for observing sample with electron microscope using the same |
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