JPH03121820U - - Google Patents
Info
- Publication number
- JPH03121820U JPH03121820U JP1990029095U JP2909590U JPH03121820U JP H03121820 U JPH03121820 U JP H03121820U JP 1990029095 U JP1990029095 U JP 1990029095U JP 2909590 U JP2909590 U JP 2909590U JP H03121820 U JPH03121820 U JP H03121820U
- Authority
- JP
- Japan
- Prior art keywords
- screw
- dewatering
- twin
- cylinder
- raw materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002994 raw material Substances 0.000 claims 2
- 102100027340 Slit homolog 2 protein Human genes 0.000 claims 1
- 101710133576 Slit homolog 2 protein Proteins 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
- B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
- B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
- B29C48/405—Intermeshing co-rotating screws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/50—Details of extruders
- B29C48/505—Screws
- B29C48/57—Screws provided with kneading disc-like elements, e.g. with oval-shaped elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/50—Details of extruders
- B29C48/505—Screws
- B29C48/575—Screws provided with elements of a generally circular cross-section for shearing the melt, i.e. shear-ring elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0856—Source regions
- H01L29/086—Impurity concentration or distribution
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Description
第1図から第4図迄は、本考案による二軸脱水
押出機を示すためのもので、第1図は要部を示す
断面図、第2図は他の実施例を示す断面図、第3
図は全体構成を示す概略構成図、第4図はスクリ
ユ軸回転時の樹脂圧力特性図、第5図は従来の二
軸脱水押出機を示す概略構成図、第6図は従来の
スクリユ軸回転時の樹脂圧力特性図である。 1……シリンダ、3……順ねじフライト、6…
…スクリユ軸、8……シールリング、8b……外
径である。
押出機を示すためのもので、第1図は要部を示す
断面図、第2図は他の実施例を示す断面図、第3
図は全体構成を示す概略構成図、第4図はスクリ
ユ軸回転時の樹脂圧力特性図、第5図は従来の二
軸脱水押出機を示す概略構成図、第6図は従来の
スクリユ軸回転時の樹脂圧力特性図である。 1……シリンダ、3……順ねじフライト、6…
…スクリユ軸、8……シールリング、8b……外
径である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) シリンダ1内に設けられた一対のスクリユ
軸6を用いて原料を混練して搬送し、前記原料の
水分を前記シリンダ1に設けた脱水部を介して排
出するようにした二軸脱水押出機において、 前記シリンダ1に設けた脱水スリツト2の下流
位置に対応する前記各スクリユ軸6上に互いに軸
方向において外径8bがかみ合うシールリング8
を備えたことを特徴とする二軸脱水押出機。 (2) 前記シールリング8は、前記各スクリユ軸
6に複数個設けられていることを特徴とする請求
項1記載の二軸脱水押出機。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990029095U JPH065865Y2 (ja) | 1990-03-23 | 1990-03-23 | 二軸脱水押出機 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990029095U JPH065865Y2 (ja) | 1990-03-23 | 1990-03-23 | 二軸脱水押出機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03121820U true JPH03121820U (ja) | 1991-12-12 |
JPH065865Y2 JPH065865Y2 (ja) | 1994-02-16 |
Family
ID=31531874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990029095U Expired - Lifetime JPH065865Y2 (ja) | 1990-03-23 | 1990-03-23 | 二軸脱水押出機 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH065865Y2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000127162A (ja) * | 1998-10-28 | 2000-05-09 | Bridgestone Corp | 加硫ゴムの再生処理方法 |
EP2243610A1 (en) * | 2009-04-20 | 2010-10-27 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for low shear mixing of shear sensitive materials |
JP2013139124A (ja) * | 2012-01-05 | 2013-07-18 | Bridgestone Corp | 多軸混練押出機、ウエットマスターバッチの製造方法、タイヤ用材料および、タイヤ |
JP2013535358A (ja) * | 2010-07-23 | 2013-09-12 | ランクセス・ドイチュランド・ゲーエムベーハー | ダイプレートが一体化された押出機およびポリマー混合物を脱気するための方法 |
JP2014180765A (ja) * | 2013-03-18 | 2014-09-29 | Tokyo Printing Ink Mfg Co Ltd | 二軸スクリュ押出機における脱水装置 |
-
1990
- 1990-03-23 JP JP1990029095U patent/JPH065865Y2/ja not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000127162A (ja) * | 1998-10-28 | 2000-05-09 | Bridgestone Corp | 加硫ゴムの再生処理方法 |
EP2243610A1 (en) * | 2009-04-20 | 2010-10-27 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for low shear mixing of shear sensitive materials |
JP2013535358A (ja) * | 2010-07-23 | 2013-09-12 | ランクセス・ドイチュランド・ゲーエムベーハー | ダイプレートが一体化された押出機およびポリマー混合物を脱気するための方法 |
JP2013139124A (ja) * | 2012-01-05 | 2013-07-18 | Bridgestone Corp | 多軸混練押出機、ウエットマスターバッチの製造方法、タイヤ用材料および、タイヤ |
JP2014180765A (ja) * | 2013-03-18 | 2014-09-29 | Tokyo Printing Ink Mfg Co Ltd | 二軸スクリュ押出機における脱水装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH065865Y2 (ja) | 1994-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |