JPH0312149B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention relates to a surface treatment method for wire materials, and particularly to a displacement plating method suitable for displacement copper plating of wire materials such as welding wires and bead wires. (Prior Art) Generally, wire materials, particularly welding wires, include a plating step during their manufacturing process, and electroplating, displacement plating, etc. have been conventionally employed in this plating step. All of these methods involve moving and immersing the filament in the treatment liquid, or immersing the coiled filament in the treatment liquid. For example, in the case of welding wire, the surface of the steel wire is plated with copper to improve conductivity, wear resistance of the power supply chip, feedability, rust resistance, etc., as is well known. Copper content is considered harmful in terms of welding quality as it can cause cracks in the welded area, and it is desirable to keep the amount as small as possible as long as the above conditions are met. Conventionally, cyanide bath electroplating has been generally used as a plating method for this purpose, but in recent years, copper sulfate bath substitution plating has also been used due to cost considerations including pollution control. (Problems to be Solved by the Invention) The steps of these plating methods are as shown in Fig. 12 (electroplating) and Fig.
As illustrated in Fig. 3 (replacement plating), the wire 1 wound around the bobbin 2 is pulled out by a payout device, and the surface is pickled in a pickling tank 3 and a water washing tank 4 to remove scale, etc. After activating the surface of the wire, the wire is generally plated by being immersed in a plating bath 5 filled with a plating solution, washed with water in a washing bath 6, dried, and then wound up. However, the former method requires a long processing tank because it is necessary to ensure the immersion energization time, and on the other hand, it makes it difficult to increase the wire running speed, making it impossible to improve productivity. Naturally, with electric plating, the rectifier 7 and other electrical control systems are unavoidably complicated and large, and the latter type of immersion displacement plating does not require a rectifier, but the required plating thickness (approximately 0.2 to 1.0μ)
A large treatment tank is essential to ensure the time required to complete the replacement. Furthermore, since a large amount of processing liquid is required, a large amount of cost is required for the equipment and environmental protection equipment, and in terms of plating quality, adhesion and
It is easy to cause unevenness in plating film thickness, etc., and requires careful management. One of the reasons for this is that in such a plating method, unless the plating liquid in the tank is stirred, the plating liquid 8 in the tank does not move as shown in FIG. Since a high concentration of iron ions remains, the adhesion of copper to the continuously fed wire is extremely reduced and the adhesion of the plating quality is impaired. However, in reality, this replacement progresses because the liquid around the wire is replaced to some extent by vibrations of the running wire and convection due to heat, but the difference is shown in Figure 14 to a greater or lesser extent. A cylindrical region 9 (within the dotted line) where the reaction rate is slow occurs or tends to occur around the wire. In any case, similar problems occur not only in welding wire but also in the above-mentioned plating method for other wire materials. In order to solve these problems, the present applicant previously proposed a displacement plating method in which a predetermined displacement plating liquid is injected from a nozzle onto a running wire material (Japanese Patent Application No. 284925/1982). According to this method,
Displacement plating is carried out instantly on the entire surface using the high-speed jet of plating liquid sprayed onto the moving wire material or the pressure of the jet, so plating with excellent adhesion and a uniform thickness can be obtained in a short time, which is better than conventional methods. This method eliminates the need for lengthy equipment such as immersion plating, does not use more plating solution than is necessary, and has advantages such as being faster and more economical. In particular, the above method has a remarkable effect not only when forming a thin film, but also when forming a relatively thick film such as 0.2 μm or more. An object of the present invention is to provide a surface treatment method for a wire material that can more efficiently and reliably exhibit various excellent effects in the displacement copper plating method proposed above. (Means for Solving the Problems) In order to achieve the above object, the inventor of the present invention has repeatedly researched various process conditions in the above-mentioned displacement copper plating method, and as a result, has developed a method for displacing plating liquid to be injected onto the wire material. We have discovered that it is possible to improve this by adding other components in addition to copper sulfate, and have accomplished the present invention. That is, in the wire material surface treatment method according to the present invention, when performing surface treatment of the wire material by injecting a predetermined displacement plating liquid from a nozzle onto the traveling wire material, CuSO ₄ is used as the displacement plating liquid.・_5H2O
≧5g/, _H2SO4 :5~400g/ _{, FeSO4}・
It is characterized in that it contains 7H ₂ O: 5 to 400 g/, and if necessary, further contains Cl ⁻ : 0.01 to 100 g/. The present invention will be explained in more detail below. As mentioned above, in the case of a surface treatment method in which a predetermined displacement plating liquid is injected from a nozzle onto a moving wire material, a high-pressure pump, etc. The plating liquid supplied under pressure is sprayed continuously through the nozzle at high speed.As a result, the liquid that has completed the substitution reaction is not stagnated around the wire, but is blown away by a high-speed jet or jet jet, and moreover, the plating liquid is sprayed away from the wire surface. Cleaning and replacement is carried out with shockingly fresh plating liquid even deep into the recesses. Its cleaning and replacement effect is very large, and plating with good adhesion is completed instantly. In this regard, in the conventional immersion-type displacement plating method, for example, in the case of relatively inexpensive copper sulfate bath displacement plating applied to welding wire, the precipitated plating layer tends to have relatively coarse crystal grains, and the adhesion of the plating becomes difficult. There were problems in practical use because of the inferior quality. For this reason, attempts have been made for a long time to add various organic substances such as gelatin, thiourea, phenols, and amino acids to make the precipitate particles denser, but concentration control is complicated and no definitive solution has been found. I wasn't getting it. On the other hand, in the above method, by bringing the displacement plating liquid into contact with the wire at high speed and impact, it is possible to make the precipitate particles denser and improve the adhesion of the plating. Furthermore, when performing displacement plating, it is desirable that the plating solution concentration is higher because the plating efficiency improves, but it is known that the higher the concentration, the more the adhesion tends to deteriorate. Taking copper substitution plating as an example, since the reduction rate of Cu ²⁺ is extremely high, the rate of elution of iron at the same time is also extremely high, and the resulting high concentration of Fe ²⁺ is diffused into the solution. The precipitate (FeSO ₄ ,
This is because plating containing such precipitates has _a very rough structure, cannot form a strong bond with the underlying iron, and easily peels off ( "Metal surface technology"
(See Vol. 26, No. 12 (1975), p. 595). However, according to the above method, such a tendency is alleviated, so that the applicable concentration range can be expanded compared to the conventional method, and the plating efficiency is also improved. As described above, in the case of displacement copper plating using the above method, superior effects can be obtained compared to the conventional method, but for this purpose, it is preferable to carry out the process under the following process conditions including the displacement plating solution. First, the displacement plating solution is basically a copper sulfate plating bath, which mainly contains CuSO ₄ .5H ₂ O, but also contains a predetermined amount of H ₂ SO ₄ and FeSO ₄ .7H ₂ O. It is of a specific composition. That is, the concentration of copper sulfate CuSO ₄ 5H ₂ O is 5
If it is less than 5 g/g, the plating precipitation rate will be too slow, which is inappropriate, so it is necessary to set it to 5 g/or more. Sulfuric acid H ₂ SO ₄ is a component that has the effect of improving adhesion, and its concentration is in the range of 5 to 400 g/. If it is less than 5g/, it will not have the effect of improving adhesion, and if it exceeds 400g/, adhesion will be good, but the rate of copper deposition will be extremely slow, making it impossible to efficiently obtain the required amount, and it will be difficult to obtain the required amount. In order to obtain this, the number of turns is increased, which requires excessive equipment, and furthermore, a large amount of neutralizing agent is required for wastewater treatment, which is uneconomical. Like sulfuric acid, ferrous sulfate FeSO ₄ 7H ₂ O has the effect of improving adhesion, and its concentration is between 5 and 7H 2 O.
The range is 400g/. Less than 5g/and 40
If it exceeds g/g, the same disadvantages as in the case of sulfuric acid will occur, so it is not preferable. In addition, in the substitution plating bath, as the bath temperature becomes higher, the amount of plating Cu increases, but the adhesion deteriorates. However, by adding an appropriate amount of chlorine (Cl ^- ), it is possible to prevent the adhesion from decreasing even at high temperatures. If added, the concentration should be in the range of 0.01 to 100 g/, but if it is less than 0.01 g/, there will be no such effect, and if it exceeds 100 g/, it will cause copper precipitation as in the case of sulfuric acid and ferrous sulfate. As the speed becomes extremely slow, adhesion deteriorates, and further disadvantages arise, such as poor rust resistance of the wire. Chlorine (Cl ^- ) includes NaCl, KCl, CaCl ₂ , MgCl ₂ ,
HCl etc. can be used. Next, other process conditions will be explained. FIG. 1 shows an example of a displacement plating device used in the method of the present invention, in which 1 is a wire running at an appropriate speed, 10
is a nozzle that injects a displacement plating liquid having the above composition onto this wire, and this nozzle
One or more of them are arranged in the running direction, and one or more of them are arranged at a predetermined angle in the radial direction. 1
1 indicates that the displacement plating liquid is injected from the nozzle 10.
It is a pump that supplies displacement plating liquid at high pressure (e.g., 0.5 Kg/cm ² or more) through pipe 11' so that it impinges on the wire surface with a necessary impact pressure such as 0.05 Kg/cm ² or more, and is usually The plating liquid 8 is circulated in the lower part of the processing tank 5. Note that 12 is a washing or cleaning nozzle placed in the washing tank 6, and uses a pump 13 to spray water onto the wire 1 immediately after plating. The direction of injection from the nozzle 10 is that of the running wire 1
Various aspects are possible depending on the running direction of the
The angle θ of the injection direction with respect to the wire running direction is 0°≦
It can be arbitrarily determined at θ≦180° (Fig. 2),
When 90°<θ≦180°, it can be said to be forward direction (same direction nozzle method), and when 0°≦θ<90°, it can be said to be reverse direction (counterflow nozzle method). It can be said that times are intersecting directions. In order to apply an effective impact force to the wire surface with the plating liquid, it is best to use the perpendicular direction (θ = 90°), and the relative speed can be increased by using a counterflow nozzle method that sprays the plating liquid in the opposite direction to the wire running direction. Therefore, the angle θ may be appropriately selected depending on the wire properties, feeding method, etc. It goes without saying that in the forward direction, the fuel is injected with a relative speed difference from the wire traveling speed. In addition, the nozzle is set at 1° in the wire running direction depending on the plating conditions such as the wire running speed and the predetermined plating thickness.
One or two or more can be appropriately selected and arranged in the wire radial direction. When arranging a plurality of nozzles in the radial direction of the wire, the nozzles can be selected in various directions such as two or three directions relative to the wire diameter, taking into consideration the cross-sectional shape of the wire. When there are two nozzles, the angle δ formed by each direction is approximately δ = 180° (the third
(Figure 4), when there are three pieces, approximately δ ₁ , δ ₂ , δ ₃ = 120° (Figure 4)
It is desirable to arrange the wires so that they form the same or substantially the same angle as shown in FIG. 4, so that the plating liquid can efficiently hit the entire surface of the wire as shown in FIG. In addition, regarding the wire running method, the above example shows a case where the wire runs straight, but the seventh
As shown in Figures a and b, in the case of a method in which a plurality of turn rollers 14 are arranged in the plating tank 5 to change the direction of the wire 1 multiple times, the plating liquid is sprayed onto the front and back surfaces of the wire. Multiple nozzles 1
In this case, the length of the plating tank 5 can be reduced. Furthermore, as shown in FIG. 8, it is also possible to run the wire 1 in a spiral pattern and inject the plating liquid from the nozzle 10 at the top, bottom, etc. of the spiral trajectory. The processing length in the direction of movement can be reduced. Note that the nozzle shown in the above nozzle arrangement is an example in which the nozzle is arranged on the outside of the running wire, and can be called a jet nozzle system. method is also possible. That is, as shown in FIG. 5, a pipe-shaped nozzle 10'
By passing the wire 1 through the center of the wire and increasing the relative speed by injecting the plating liquid 8 in the opposite direction (counterflow) to the running direction of the wire, it is possible to prevent the accumulation of iron ions and to always maintain a fresh plating liquid. This is a supply method. In addition, if one or more nozzles are provided so that the plating liquid is sprayed in the same direction as the wire running direction (forward flow), the spraying direction will be in the forward direction, so there will be a difference in speed relative to the wire running speed. It is best to inject it. In the case of such a forward nozzle arrangement with the nozzle center wire traveling direction or in the case of a counterflow nozzle arrangement, the effect is smaller than that of the jet nozzle method. This is because the plating liquid injected from the nozzle forms a laminar flow that is almost parallel to the wire surface, so the agitation of the plating liquid is poor, activation of the wire surface and ion diffusion of the plating liquid are small, and it is not as effective as the jet nozzle method. Although it is difficult to obtain sufficient effects,
It is much superior to the conventional immersion plating method. In the case of the above-mentioned nozzle-centered wire traveling method, a pair of pipe-shaped nozzles 10' are arranged symmetrically opposite each other as shown in FIG. 6 in relation to the jetting direction of the plating liquid and the number of nozzles. A deformation direction is possible in which the wire 1 is run and the plating liquid 8 is injected in intersecting directions. In this case, the plating liquid is injected at high speed from each nozzle, and a completely turbulent flow (turbulent region 16) occurs at the part where the laminar region 15 of the opposing flow (downstream nozzle) and forward flow (upstream nozzle) collide, and the wire Instant exchange of the plating liquid over the entire circumference of the surface is achieved. As the ejected flows in both directions collide in this manner, the impact force activates the wire surface, and the generated turbulence increases the ion diffusion of the plating solution, resulting in high-speed and efficient plating. However, in the case of the nozzle-centered wire running system, it is necessary to provide a gap in the nozzle for the wire to pass through smoothly. is likely to intervene, so the replacement efficiency is poorer than in the jet nozzle method, or the plating efficiency tends to decrease due to oxidation of the wire base and deterioration of the plating solution. Since the wire runs in a narrow gap, the precipitated metal copper may grow on the nozzle end and cause flaws in the wire, so this point must be kept in mind. Furthermore, depending on the state of the nozzle arrangement, the injected plating liquid may reach a long distance and turn into mist, which may worsen the environment. Next, other points to be noted in each injection mode of the present invention will be explained. First, regarding the impact pressure of the plating liquid on the wire, the higher the impact pressure, the better in order to achieve each of the effects of the above-mentioned spraying, and a value of 0.05 Kg/cm ² or more is desirable. The higher the impact pressure, the better the adhesion. Depending on this impact pressure, the supply pressure, flow rate, etc. of the plating liquid by the pump are determined. In addition, as for the aspect of the spray width by the nozzle, as shown in Fig. 9, when spraying onto one wire 1 with one nozzle 10, the spray width (range) is narrowed as shown in (a). It is possible to hit the spray in a concentrated manner, and when spraying onto multiple wires 1 with one nozzle 10, the spray width (range) can be widened to hit the spray as shown in (b). ,
In this case, the spray width can be adjusted to 10 mm as required.
It can be changed depending on the shape of the air outlet. Further, the wire speed is not particularly limited, but even if it is selected within a wide range of 50 to 500 m/min, good plating can be achieved as long as the plating bath composition is within the range of the present plating bath composition, and the plating equipment can be downsized. The amount of plating Cu can be adjusted by the wire speed by appropriately selecting the total length of the wire and the effective length of contact with the plating liquid. (Example) Next, an example of the present invention will be shown. Example 1 Using the apparatus shown in Figure 7a and b, and using plating solutions with various compositions shown in Table 1, displacement copper plating was applied to mild steel wire (wire diameter 2.3 mm) under the following conditions. We carried out a performance confirmation test. Note that pretreatment was performed by HCl pickling. Plating conditions Plating bath temperature: 30°C Injection pressure: 1 Kg/cm ² Plating liquid injection flow rate: 450/min Total wire length: 8 m (Wire length inside the device in Figure 7) Effective plating liquid contact length: 1 m (spray length of department
Total of l ₁ , l ₂ . . . (see Figure 10) Wire running speed: 85 m/min After plating, the amount of plating Cu was measured and the adhesion was examined. The results are also listed in Table 1. For evaluation of adhesion, the sample wires were co-wound as shown in Figure 11, and the state of plating peeling on the surface of the wound wire was visually observed under 30x magnification.If there was no peeling at all, ◎ The evaluation was made by marking ◯ if there were traces of peeling, △ if there was some peeling, and × if there was a lot of peeling. Regarding the evaluation of the amount of copper plating, the minimum required amount of copper plating is 0.07% as a welding wire in terms of rust resistance and conductivity between wire chips, and if the measured amount of copper plating is 0.07% or more, it is considered to be good. , if it was less than 0.07%, it was evaluated as poor. In Table 1, the examples of the present invention marked with a mark ○ for the overall evaluation ensured the minimum required amount of plating Cu and at the same time had excellent adhesion. On the other hand, when the plating bath composition falls within the range of the present invention, the overall judgment is poor (marked with an x), and the minimum required amount of Cu cannot be secured, or even if it can be secured, the adhesion is poor. Example 2 Displacement copper plating was carried out under the same conditions as in Example 1, except that the total wire length was 20 m and the effective length of plating liquid contact was 2 m, and a performance confirmation test was conducted. The results are shown in Table 2. Table 2 shows that although the equipment becomes larger, thick plating with a plating Cu amount of about 0.4% is possible by increasing the total wire length and the effective length of plating liquid contact.

【table】

[Table] Example 3 Chlorine (Cl ^- ) when the bath temperature is increased
In order to confirm the effect of addition of , a performance test was conducted by varying the plating bath temperature and Cl ^- concentration as shown in Table 3, and keeping the other conditions the same as in Example 1. Performance test results are also listed in Table 3. Note that the performance evaluation criteria are the same as in the first embodiment. Generally, as the plating bath temperature increases, the amount of plating Cu increases, but on the contrary, the adhesion deteriorates. However, if Cl ^- is added at this time, the amount of plated Cu increases, efficiency can be increased, and deterioration of adhesion can be prevented. As is clear from Table 3, the amount of Cl ^- added is 0.007
When the plating bath temperature is low (No. 1 to No. 6), the plating Cu amount increases as the plating bath temperature becomes higher, but on the contrary, the adhesion deteriorates. However, the amount of ^Cl- added is 0.05-90
When controlled to an appropriate range with g/ (No.
7 to No. 19), although the plating Cu amount increases as the plating bath temperature becomes higher, the adhesion is excellent without decreasing. In this case, when the plating bath temperature is 80°C, the adhesion is relatively inferior to that at other plating bath temperatures (No. 9, No. 11, No. 13, No. 15, No. 17, No.19)
The reason for this is that the amount of metsuki Cu is as high as 0.51 to 0.6%.
This is thought to be because the iron substituted with copper was trapped in the metal as iron sulfate. However, the adhesion did not deteriorate as in the case of No. 6. On the other hand, Cl ^- is 110
If the ratio is too high (No. 20), the plating Cu precipitation rate becomes extremely slow, the effect of increasing efficiency cannot be obtained, and the amount of plating Cu decreases.

【table】

[Table] As is clear from the above examples, in the present invention, the necessary plating can be completed instantly and it is possible to obtain a wire with excellent plating adhesion. In order to prevent this, it is preferable to drain or clean the metal copper as soon as possible after plating, especially when it comes to welding wire. Plating with the required good adhesion can be obtained. To give an example of this, in the case of the jet nozzle method shown in FIG.
By arranging more than one wire and washing with jet water at a pressure, flow rate, etc. that suits the properties of the wire, it is possible to prevent unnecessary growth of metal copper by washing the wire immediately after plating is completed. In addition, it has been confirmed in experiments that a predetermined plating adhesion can be obtained by washing with water within 3 seconds after spraying the final plating solution. In addition, when experiments were conducted under the following additional conditions, it was confirmed that similar effects could be obtained within such ranges. That is, the plating solution may contain various impurities from chemicals, wires, industrial water, equipment materials, etc., but it is desirable that the amount of these impurities be 5 g/or less. Impurities from chemicals (CuSO ₄ , FeSO ₄ , H ₂ SO ₄ ) include Ni, Pb, Zn, As, Mn,
These include Ti, Se, Hg, and various phosphates, nitrates, ammonium compounds, sulfates, and nitrogen compounds. Impurities from the wire include wire chemical components Mn, Si, Al, Ti, Cr, Ni, and surface deposits such as oils and fats. Impurities from industrial water include silicates, sulfates, chlorides, carbonates, bicarbonates, and nitrates of Ca, Mg, K, Fe, and Mn, and silicates, sulfates, chlorides, and nitrates of Al. There are inorganic compounds such as O ₂ , CO ₂ , N ₂ and other gases. Impurities from equipment materials include those dissolved from equipment materials such as stainless steel, resin, and rubber. Further, the Fe ³⁺ content in the plating solution is preferably 50 g/or less. If this value is exceeded, the adhesion of plating tends to deteriorate, and it may be controlled to the above value by, for example, flowing an atmosphere for preventing oxidation. The analysis method for Fe ³⁺ is based on JIS M88530-phenanthroline absorption spectrophotometry. The specific gravity of the plating liquid is 1.05 to 1.35 (20℃), and the viscosity is
1.30-3.50cp (20℃), PH is preferably 1.5 or less (20℃). Furthermore, as a wire, the tensile strength (TS)
Similar effects can be obtained even when applied to wires with a decarburization depth of 30 to 300 Kgf/mm ² or wires before plating where both the depth of decarburization and the depth of grain boundary oxidation are 0.50 mm or less. In addition, the length of the spray part L (the length of the wire that is directly hit by the spray liquid) and the length of the non-spray part L (the length of the wire that is not directly hit by the spray but is attached or immersed in the liquid) is calculated by the following formula: 0.005≦l/L+l It is desirable that the relationship satisfies ≦1. Note that L+l can be made as long as desired depending on the relationship between the amount of plating and the linear speed, but the same effect can be obtained as long as L+l≦200 m. The above explanation mainly takes the case of displacement copper plating for welding wire as an example, but it is not limited to displacement copper plating, but also substitution tin plating and deposits of two or more metals containing both copper sulfate and tin sulfate. A similar effect can be obtained if Furthermore, it goes without saying that welding wires may be not only solid wires but also flux-cored wires.Furthermore, welding wires are not limited to welding wires, but also furniture springs and cardboard fasteners that use bead wires or cutper coated wires. Needless to say, it can be applied to wire materials for various purposes such as gold, etc., and therefore, it can be applied to various shapes (circular, band-shaped, square, etc., as well as wire, hoop, pipe, etc.) and dimensions (0.2~ 6.4mm
φ), it can also be applied to wire material. Examples of materials include JIS Z3312 (solid wire for mag welding of mild steel and high-strength steel), 3351 (wire for submerged arc welding of carbon steel and low alloy steel), and 3316.
(steel rods and wire for Teig welding of mild steel and low alloy steel), 3317 (MAG welding solid wire for molybdenum steel and chromium molybdenum steel), JIS G3502 (piano wire rod), 3505 (mild steel wire rod), 3506 (hard steel wire rod), etc. (Effects of the Invention) As explained above, according to the present invention, a plating liquid of a specific composition is sprayed onto a running wire material, and the entire surface is covered by a high-speed jet of the plating liquid or the pressure of a jet. Since displacement plating is performed instantly, it is possible to obtain plating with excellent adhesion and uniform thickness in a short time, eliminating the need for extensive equipment like in conventional immersion plating, and eliminating the need for using more plating solution than necessary. It is economical because it can speed up the process.Especially when the film thickness is
The effect is remarkable not only when plating is as thin as 0.2 μm or less, but also when plating with a relatively thick film thickness of about 0.2 to 3 μm, which was difficult with conventional dip plating. In particular, according to the method of spraying a jet jet of plating liquid in a direction that intersects with the direction in which the wire runs, the wire is run in a space where there is no plating liquid, which dramatically improves work efficiency, and the work environment is also good, so it is easy to maintain. Easy to manage. The present invention is particularly suitable for displacement copper plating of wire materials such as welding wires and bead wires.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an example of a plating device for implementing the jet nozzle method which is one aspect of the present invention, FIG. 2 is an explanatory diagram showing the angle θ between the jetting direction from the nozzle and the wire running direction, Figures 3 and 4
The figure is an explanatory diagram showing the angle δ formed by the injection direction when there are two or three nozzles, and Figures 5 and 6 are nozzles and their arrangement for the nozzle center wire running system, which is an embodiment of the present invention. An explanatory diagram showing FIG. 7a,
b is a diagram showing an example of nozzle arrangement when the wire is run using turn rollers, a is a plan view, b is a side view, and FIG. 8 is a diagram showing an example of nozzle arrangement when the wire is run in a spiral shape. Explanatory diagrams, Figure 9 are diagrams showing the spray range from the nozzle, a shows the narrow width case, b shows the wide width case, Figure 10 is a diagram explaining the length of the spray part, and Figure 11 is a diagram showing the spray range. Explanatory diagram showing the wire winding state used for plating adhesion determination, No. 12
1 to 14 are diagrams for explaining conventional plating methods. FIG. 12 shows the case of electroplating, FIG. 13 shows the case of immersion plating, and FIG. 14 shows the liquid state around the wire. 1... Line material (wire), 5... Plating tank, 6
... Washing tank, 8 ... Plating liquid, 10' ... Pipe-shaped nozzle, 10 ... Pipe-shaped nozzle, 11, 13
...Pump, 11'...Pipe, 12...Washing jet nozzle, 14...Turn roller, 15...
...Laminar region, 16...Turbulent region.

Claims (1)

[Scope of Claims] 1. When performing surface treatment on a moving wire material by spraying a predetermined displacement plating liquid from a nozzle, the displacement plating liquid includes CuSO ₄ .5H ₂ O≧5g/ A method for surface treatment of a wire material, characterized in that a method containing H ₂ SO ₄ : 5 to 400 g/FeSO ₄ .7H ₂ O: 5 to 400 g/ is used. 2 When performing surface treatment on the running wire material by spraying a specified displacement plating liquid from a nozzle, the displacement plating liquid should be CuSO ₄ 5 H ₂ O ≧ 5 g / H ₂ SO ₄ :5 400g/ _FeSO4.7H2O : 5-400g/ ^Cl- : 0.01-100g/ _A method for surface treatment of a wire material, characterized by using a material containing each of the following.