JPH03120629A - Optical pickup - Google Patents

Optical pickup

Info

Publication number
JPH03120629A
JPH03120629A JP25903289A JP25903289A JPH03120629A JP H03120629 A JPH03120629 A JP H03120629A JP 25903289 A JP25903289 A JP 25903289A JP 25903289 A JP25903289 A JP 25903289A JP H03120629 A JPH03120629 A JP H03120629A
Authority
JP
Japan
Prior art keywords
holder
flexible substrate
substrate
land
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25903289A
Other languages
Japanese (ja)
Other versions
JP2712640B2 (en
Inventor
Toshiki Itoi
俊樹 糸井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1259032A priority Critical patent/JP2712640B2/en
Publication of JPH03120629A publication Critical patent/JPH03120629A/en
Application granted granted Critical
Publication of JP2712640B2 publication Critical patent/JP2712640B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Abstract

PURPOSE:To abolish one flexible substrate and to reduce cost by press-fitting the hole of the flexible substrate to the pin-shaped projecting part of a holder, temporarily fixing the holder and connecting the land of a substrate fixed to the holder and the land of the flexible substrate by means of a soldering bridge. CONSTITUTION:The hole provided for the flexible substrate 18 is press-fitted and engaged to the pin saped projecting part 17b provided for the holder 17 so as to temporarily fix the flexible substrate 18 and the land of the substrate 19 fixed to the holder 17 and the land of the flexible substrate 18 are connected by the soldering bridge 22. Thus, automatic assembly is attained, reliability can be improved, the expensive flexible substrates which are required two can be reduced to one and cost can be reduced.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、ディスクに光スポットを投影して記録再生を
行なう光ピツクアップに用いる。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is used for optical pickup in which recording and reproduction are performed by projecting a light spot onto a disk.

従来の技術 光ピツクアップと回路基板との配線は通常フレキシブル
基板が用いられる。光ピツクアップの電気部品は、大き
く受光素子、半導体レーザー、対物レンズ駆動装置等に
分けることができる。組立。
2. Description of the Related Art A flexible substrate is usually used for wiring between an optical pickup and a circuit board. The electrical components of an optical pickup can be broadly divided into a light receiving element, a semiconductor laser, an objective lens driving device, and the like. assembly.

検査工程を考慮すると、対物レンズ駆動装置を別工程で
完成し、後で光ピツクアップの光学ブロックと電気結合
する方が良い。
Considering the inspection process, it is better to complete the objective lens drive device in a separate process and electrically connect it to the optical block of the optical pickup later.

第6図に従来の光ピツクアップの電気配線の構成図であ
る。対物レンズ1はボビン2に固定されている。ボビン
2にフォーカスコイlv3が巻装されており、さらに4
個のリング状トラッキングコイ/I/4を貼り付けてい
る。ボビン2の両側に貼り付けたボビン側基板6と、ホ
ルダー7に固定したフレキシブル基板8に設けた半田付
は用ランド5a。
FIG. 6 is a block diagram of the electrical wiring of a conventional optical pickup. An objective lens 1 is fixed to a bobbin 2. Focus coil lv3 is wound on bobbin 2, and 4 more
Ring-shaped tracking carp/I/4 is attached. Soldering lands 5a are provided on the bobbin-side substrate 6 attached to both sides of the bobbin 2 and the flexible substrate 8 fixed to the holder 7.

8aに、4本の金′属バネ60両端を半田付けしており
、これによりボビン2を支持するとともに、フォーカス
コイlv3と)ラッキングコイlv4への電気結線も行
なっている。フレキシブル基板8はホルダー7に設けた
2つの爪部7aによシ仮固定されておシ、最終的にはネ
ジ10により磁気ヨーク(図示せず)に完全に固定され
る。フレキシブル基板は2枚の補強用紙フエノール基板
が貼り合わせられておシ、一端に4本端子11がかしめ
られ半田デイプにより固定されている。以上の構成によ
る対物レンズ駆動装置は別工程にて組立完成後、検査さ
れる。12は光学ブロック用フレキシブp基板であシ、
受光素子及び半導体レーザーの配線を行なう。
Both ends of four metal springs 60 are soldered to 8a, thereby supporting the bobbin 2 and also providing electrical connections to the focusing coil lv3 and racking coil lv4. The flexible substrate 8 is temporarily fixed by two claws 7a provided on the holder 7, and finally completely fixed to a magnetic yoke (not shown) by screws 10. The flexible board is made up of two reinforcing paper phenol boards pasted together, and four terminals 11 are caulked to one end and fixed with solder dip. The objective lens drive device having the above configuration is inspected after assembly is completed in a separate process. 12 is a flexible P substrate for optical block;
Wire the photodetector and semiconductor laser.

光ピツクアップ完成工程にて対物レンズ駆動装置の端子
11を光学ブロック用フレキシブル基板12に半田付は
結線される。
In the optical pickup completion process, the terminal 11 of the objective lens drive device is soldered and wired to the flexible substrate 12 for the optical block.

発明が解決しようとする課題 しかしながら上記従来の構成では、光ピツクアップの部
品として高価なフレキシブル基板を8と12の2枚も必
要となり、光ピツクアップのコストが上がるという問題
を有していた。
Problems to be Solved by the Invention However, the conventional configuration described above requires two expensive flexible substrates 8 and 12 as optical pickup components, resulting in an increase in the cost of optical pickup.

本発明は上記従来の問題点を解決するためになされたも
ので、簡単な構成によシフレキシプル基板を1枚廃止す
ることができ、低価格の光ピツクアップを提供すること
を目的とする。
The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a low-cost optical pickup that has a simple structure and can eliminate one flexible board.

課題を解決するための手段 上記問題点を解決するために本発明の光ピツクアップは
、ホルダーに設けたピン状凸部に、フレキシブル基板に
設けた穴を圧入かん合して仮固定し、ホルダーに固定さ
れた基板のランドと、フレキシブル基板のランドを半田
ブリッジにて結線するものである。
Means for Solving the Problems In order to solve the above problems, the optical pickup of the present invention temporarily fixes the flexible substrate by press-fitting the pin-shaped protrusion provided on the holder into the hole provided on the flexible substrate. Lands on a fixed board and lands on a flexible board are connected using a solder bridge.

作  用 上記構成により本発明の作用は次のようになる。For production With the above configuration, the effects of the present invention are as follows.

対物レンズ駆動装置が組立完成後、ホルダーに設けたピ
ン状凸部に、フレキシブル基板に設けた穴を圧入かん合
して仮固定し、ホルダーに固定された基板のランドと、
フレキシブル基板のランドを半田ブリッジにて結線する
ことにより、信頼性を低くすることなく、また自動組立
もでき、従来2枚必要であった高価なフレキシブル基板
を1枚廃止して、約26円の直接材料費が低減でき、光
ピツクアップのコスト力を高めることができる。
After the objective lens driving device is assembled, the pin-shaped convex part provided on the holder is press-fitted into the hole provided on the flexible substrate and temporarily fixed, and the land of the substrate fixed on the holder is fixed.
By connecting the lands of the flexible circuit board with solder bridges, automatic assembly is possible without reducing reliability, and one expensive flexible circuit board, which conventionally required two, is eliminated, resulting in a cost of approximately 26 yen. Direct material costs can be reduced and the cost effectiveness of optical pickup can be increased.

実施例 第1図は、本発明の一実施例における光ピツクアップの
電気部品の構成図、第2図はその分解斜視図−第3図、
第4図はホルダーに設けたピン状凸部とフレキシブル基
板の穴のかん合状態を説明するための図、第6図は対物
レンズ駆動装置の基板トフレキシブル基板の半田ブリッ
ジによる結線状態を示した図である。
Embodiment FIG. 1 is a configuration diagram of electrical components of an optical pickup in an embodiment of the present invention, FIG. 2 is an exploded perspective view thereof, and FIG.
Figure 4 is a diagram to explain how the pin-shaped protrusion provided on the holder and the hole in the flexible board are engaged, and Figure 6 shows the connection state between the objective lens drive device's board and the flexible board by solder bridges. It is a diagram.

第1図、第2図を用いて構成部品について説明する。第
2図において、紙フエノールの基板19は、ホルダー1
7に設けた2つの爪部17aにて仮固定された後、ネジ
1oにてホルダー17とともに磁気ヨーク2oに固定さ
れる。20aはネジ1oをねじ込むためのネジ穴である
。21a。
The components will be explained using FIG. 1 and FIG. 2. In FIG. 2, the paper phenol substrate 19 is attached to the holder 1.
After being temporarily fixed by two claws 17a provided at 7, it is fixed to the magnetic yoke 2o together with the holder 17 by screws 1o. 20a is a screw hole into which the screw 1o is screwed. 21a.

21bは磁気ヨーク20に接着したマグネットである。21b is a magnet bonded to the magnetic yoke 20.

ポビン2の両側に接着固定した基板6と、基板19に、
4本の金属バネ6の両端を半田付けすることにより、ポ
ビン2は支持される。さらにこの金属バネ6は、ポビン
2に巻装したフォーカスコイIv3とトラッキングコイ
Iv4の通電も行なう。17bはホルダー17に設けた
ピン状凸部であシ、基板19より飛び出している。この
ピン状凸部17bに、フレキシブル基板18に設けた穴
1sa、1abを圧入かん合してフレキシブル基板18
を仮固定することができる。
On the board 6 and the board 19 that are adhesively fixed to both sides of the pobbin 2,
The pobbin 2 is supported by soldering both ends of the four metal springs 6. Furthermore, this metal spring 6 also energizes the focus coil Iv3 and the tracking coil Iv4 wound around the pobbin 2. 17b is a pin-shaped protrusion provided on the holder 17, which protrudes from the substrate 19. The holes 1sa and 1ab provided in the flexible substrate 18 are press-fitted into the pin-shaped convex portions 17b to form the flexible substrate 18.
can be temporarily fixed.

第1図において、フレキシブル基板18に設けたランド
と、基板19に設けたランドを、横一列に並べた半田ブ
リッジ22にて結線する。18aはフレキシブル基板1
8に設けた位置規制用のつなぎであシ、これにより、ピ
ン状凸部17bとフレキシブル基板18の2箇所の穴1
8a、18b(第2図)を簡単に位置合せできるように
している。
In FIG. 1, the lands provided on the flexible substrate 18 and the lands provided on the substrate 19 are connected by solder bridges 22 arranged in a horizontal row. 18a is a flexible substrate 1
8 for position regulation, and thereby the two holes 1 in the pin-shaped protrusion 17b and the flexible substrate 18.
8a and 18b (FIG. 2) can be easily aligned.

第3図は、ホルダー17のピン状凸部17bと、フレキ
シブル基板18の穴18bの形状を示す平面図であり、
穴18bの2箇所が、ピン状凸部17bの径より狭めら
れておシ、圧入かん合するようになっている。
FIG. 3 is a plan view showing the shapes of the pin-shaped protrusion 17b of the holder 17 and the hole 18b of the flexible substrate 18,
Two portions of the hole 18b are narrower than the diameter of the pin-shaped convex portion 17b so that they can be press-fitted together.

第4図は、そのかん合状態を示す断面図である。FIG. 4 is a sectional view showing the mated state.

ホルダー17に設けたピン状凸部17bは、基板19の
面より飛び出しており、フレキシブル基板18は図のよ
うにかん合し、フレキシブル基板18の穴部18bのエ
ッヂにより圧入後ははずれないようになる。
The pin-shaped protrusion 17b provided on the holder 17 protrudes from the surface of the substrate 19, and the flexible substrate 18 is engaged as shown in the figure, and the edge of the hole 18b of the flexible substrate 18 prevents it from coming off after press-fitting. Become.

第6図は、基板19とフレキシブル基板18の結線状態
を示す図であり、図のように半田ブリッジ22により結
線される為、信頼性が高い。
FIG. 6 is a diagram showing the connection state between the board 19 and the flexible board 18. As shown in the figure, the connections are made by solder bridges 22, so the reliability is high.

以上のように本実施例によれば、対物レンズ駆動装置が
組立完成後、ホルダーに設けたピン状凸部に、フレキシ
ブル基板に設けた穴を圧入かん合して仮固定し、ホルダ
ーに固定された基板のランドと、フレキシブル基板のラ
ンドを半田ブリッジにて結線するものであり、自動組立
ができ信頼性も高く、かつ2枚必要であった高価なフレ
キシブル基板の1枚を廃止することができ、光ピツクア
ップをコストダウンできるのでその効果は大きい。
As described above, according to this embodiment, after the objective lens driving device is assembled, it is temporarily fixed by press-fitting the hole provided in the flexible substrate into the pin-shaped convex portion provided in the holder, and then being fixed to the holder. The land of the printed circuit board and the land of the flexible circuit board are connected using a solder bridge.It can be assembled automatically, has high reliability, and eliminates the need for two expensive flexible circuit boards. The effect is great because it can reduce the cost of optical pickup.

発明の効果 本発明は、ホルダーに設けたピン状凸部に、フレキシブ
ル基板に設けた穴を圧入かん合してフレキシブル基板を
仮固定し、ホルダーに固定された基板のランドと、フレ
キシブル基板のランドと半田ブリッジにて結線するもの
であり、自動組立ができ信頼性も高く、かつ2枚必要で
あった高価なフレキシブル基板を1枚だけにでき、コス
トダウンできるという優れた効果の得ることのできる光
ピツクアップを実現できるものである。
Effects of the Invention The present invention temporarily fixes a flexible substrate by press-fitting a hole provided in a flexible substrate into a pin-shaped convex portion provided on a holder, and connects the land of the substrate fixed to the holder with the land of the flexible substrate. The wires are connected using a solder bridge, which allows for automatic assembly and high reliability.It also has the excellent effect of reducing costs by reducing the need for two expensive flexible boards to just one. This makes it possible to realize optical pickup.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例における光ピツクアップの電
気部品の構成図、第2図はその分解斜視図、第3図、第
4図及び第5図はその細部を説明するための平面図、断
面図及び側面図、第6図は従来の光ピツクアップの電気
部品の構成図である。 1・・・・・・対物レンズ、2・・・・・・ボビン、3
・・・・・・フォーカスコイル、4・・・・・・トラッ
キングコイル、5・・・・・・ボビン側基板、6・・・
・・・金属バネ、1o・・・・・・ネジ、17・・・・
・・ホルダー1117b・・・・・・ピン状凸部、18
・・・・・・フレキシブル基板、1aa、1ab・・・
・・・穴、19・・・・・・基板、22・・・・・・半
田ブリッジ。
Fig. 1 is a configuration diagram of electrical components of an optical pickup in an embodiment of the present invention, Fig. 2 is an exploded perspective view thereof, and Figs. 3, 4, and 5 are plan views for explaining the details. , a sectional view and a side view, and FIG. 6 is a configuration diagram of electrical components of a conventional optical pickup. 1...Objective lens, 2...Bobbin, 3
...Focus coil, 4...Tracking coil, 5...Bobbin side board, 6...
...Metal spring, 1o...Screw, 17...
...Holder 1117b...Pin-shaped protrusion, 18
...Flexible board, 1aa, 1ab...
... Hole, 19 ... Board, 22 ... Solder bridge.

Claims (1)

【特許請求の範囲】[Claims] 対物レンズと、それを保持するボビンと、ボビンに巻装
したコイルと、ボビンを支持しかつ前記コイルの通電を
行なう複数の金属バネと、前記金属バネを半田付け固定
した基板と、この基板を保持するためのホルダーと、前
記コイルへの通電用リードであるフレキシブル基板とを
有し、前記ホルダーにピン状凸部を設け、このホルダー
に固定手段にて前記基板を固定し、この基板面より凸で
ある前記ピン状凸部に、フレキシブル基板に設けた穴を
圧入かん合してフレキシブル基板を仮固定し、前記基板
のランドと、フレキシブル基板のランドを半田ブリッジ
にて結線したことを特徴とする光ピックアップ。
An objective lens, a bobbin that holds the objective lens, a coil wound around the bobbin, a plurality of metal springs that support the bobbin and energize the coils, a substrate to which the metal springs are fixed by soldering, and this substrate. The holder has a holder for holding the coil, and a flexible substrate that is a lead for energizing the coil, the holder is provided with a pin-shaped protrusion, the substrate is fixed to the holder by a fixing means, and The flexible substrate is temporarily fixed by press-fitting a hole provided in the flexible substrate into the convex pin-shaped convex portion, and the land of the substrate and the land of the flexible substrate are connected by a solder bridge. optical pickup.
JP1259032A 1989-10-04 1989-10-04 Optical pickup Expired - Fee Related JP2712640B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1259032A JP2712640B2 (en) 1989-10-04 1989-10-04 Optical pickup

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1259032A JP2712640B2 (en) 1989-10-04 1989-10-04 Optical pickup

Publications (2)

Publication Number Publication Date
JPH03120629A true JPH03120629A (en) 1991-05-22
JP2712640B2 JP2712640B2 (en) 1998-02-16

Family

ID=17328391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1259032A Expired - Fee Related JP2712640B2 (en) 1989-10-04 1989-10-04 Optical pickup

Country Status (1)

Country Link
JP (1) JP2712640B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015041658A (en) * 2013-08-21 2015-03-02 スタンレー電気株式会社 Flexible substrate and its temporary fixation structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4851786B2 (en) * 2005-12-02 2012-01-11 株式会社リコー Measuring method of micro area potential of photoconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015041658A (en) * 2013-08-21 2015-03-02 スタンレー電気株式会社 Flexible substrate and its temporary fixation structure

Also Published As

Publication number Publication date
JP2712640B2 (en) 1998-02-16

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