JPH03120036U - - Google Patents
Info
- Publication number
- JPH03120036U JPH03120036U JP2872690U JP2872690U JPH03120036U JP H03120036 U JPH03120036 U JP H03120036U JP 2872690 U JP2872690 U JP 2872690U JP 2872690 U JP2872690 U JP 2872690U JP H03120036 U JPH03120036 U JP H03120036U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wafer ring
- pellets
- semiconductor
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011295 pitch Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2872690U JPH03120036U (enExample) | 1990-03-20 | 1990-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2872690U JPH03120036U (enExample) | 1990-03-20 | 1990-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120036U true JPH03120036U (enExample) | 1991-12-10 |
Family
ID=31531515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2872690U Pending JPH03120036U (enExample) | 1990-03-20 | 1990-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120036U (enExample) |
-
1990
- 1990-03-20 JP JP2872690U patent/JPH03120036U/ja active Pending