JPH03120020A - Resin-discharging apparatus - Google Patents

Abstract

PURPOSE:To enable supplying a good quality resin containing no bubbles by cooling a part held between the rotator of a tube and a guide body and by heating a part extending from the discharge side of a pump. CONSTITUTION:Resin 2 includes a solvent having a low boiling point such as isopropyl alcohol, butanol and methyl ethyl ketone. In the pressurizing process of a pump 5, accordingly, the resin 2 is maintained at a low temperature by cooling means 6 to hinder vaporization of the solvent. Thus, the generation of bubbles can be suppressed and the resin 2 containing no bubbles can be supplied stably and surely. On the other hand, the resin 2 pressurized by the pump 5 is heated by heating means 7 immediately af ter the end of the pressurizing process so that the temperature of the resin is returned to the original temperature. Therefore, no dew is deposited on the surface of a tubular piping to the place, where the resin is discharged, and in the resin 2 discharged from a nozzle 8, and it is possible to stably supply a sealing resin containing no bubbles.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a resin discharging device, and more particularly to a resin discharging device used in an electronic component manufacturing process.

[Conventional technology]

In the manufacturing process of electronic components such as hybrid ICs, when the wire bonding process that connects each band on the semiconductor chip fixed on the board to each lead part of the board is completed, the wire connection part on the surface of the chip or the lead part is finished. Keep it!
In order to do this, an insulating resin such as epoxy resin may be applied around the connection portion of the wire. Also, LED
When manufacturing a display device, after a light emitting element is fixed on a substrate and a wire bonding process is completed, the periphery of the light emitting element is often sealed with a photo-i3-transparent epoxy resin. The above resin increases the mechanical strength of the wire connection part, and
By preventing dust and moisture from adhering to conductive parts, it plays an important role in improving the reliability of the electronic components. Usually, the resin used for the above-mentioned sealing is a relatively viscous fluid such as epoxy resin or silicone resin, and contains a volatile solvent such as xylene, alcohol, or butanol as a component. Therefore, in order to supply the liquid resin to the resin sealing process in the electronic component manufacturing process, the resin is transferred under pressure while being completely isolated from the outside to prevent the solvent from volatilizing. It is necessary to guide it to the discharge port of the device. For this reason, a dispenser equipped with a so-called roller pump is usually used as the resin discharging device. A roller pump includes a plurality of press rollers that are rotatably supported, a rotating body that rotates around a support shaft, and a guide body that has an inner wall that faces a part of the outer periphery of the rotating body at a certain distance. and an elastically deformable tube disposed such that an intermediate portion thereof is sandwiched between an outer peripheral portion of the rotary body and an inner wall of the guide body, and as the rotary body rotates, the pressure roller The liquid resin in the tube can be transferred by continuously squeezing the tube in the discharge direction in cooperation with the inner wall of the guide body. The liquid resin pressurized by the roller pump is guided to the discharge port of each manufacturing process without coming into contact with the external environment, and is discharged in a predetermined amount from the discharge port to a predetermined location of each electronic device or the like.

[Problem to be solved by the invention]

However, while the pump has the advantage of being able to transport the resin containing the solvent while completely shielding it from the outside world,
The resin is transferred by moving the pressure roller to partially crush the elastically deformable tube and continuously squeezing the tube, so in the process of pressing the elastic tube with the pressure roller, Complex flows occur in the liquid resin within the tube. That is, the inner wall of the tube does not necessarily come into perfect contact with the pressed portion of each pressure roller, and a small gap may occur, causing a portion of the resin to flow backward. Because of this, the flow of resin inside the tube? j
[The tube may become rough, and there may be a portion where the static pressure rapidly decreases, and the solvent may vaporize at that portion, resulting in the formation of fine bubbles. It is also conceivable that repeated elastic deformation of the tube generates heat, which promotes the generation of bubbles. Once generated, bubbles do not disappear even after passing through the pressurized part of the pump because the resin is viscous, and are often discharged from the discharge port of the discharge device along with the resin.For this reason, the discharged resin If this occurs, fine air bubbles will remain in the seals of the wire connections of electronic components and solidify, resulting in insufficient sealing performance in those areas, allowing moisture, etc. to enter the electronic devices and cause malfunctions. This poses a problem in that the electronic device's lifespan is shortened and the reliability of the product is significantly reduced. In addition, the bubbles cause variations in the amount of resin discharged, which not only causes problems in product quality control, but also accumulates in the upper part of the piping, which may impede the operation of the discharge device. The present invention solves the above-mentioned conventional problems, supplies high-quality resin that does not contain bubbles to each manufacturing process, and improves the reliability of electronic parts.
The object of the present invention is to provide a resin discharging device that can improve performance.

[Means for Solving the Problems] To solve the above problems, the present invention takes the following technical measures. That is, the present invention includes a plurality of rotatably supported pressing rollers on the outer periphery, and faces a rotating body that rotates around a spindle and a certain distance from a part of the outer periphery of the rotating body. A guide body having an inner wall, and an elastically deformable tube disposed such that an intermediate portion is held between an outer peripheral portion of the rotary body and an inner wall of the guide body, and the tube is elastically deformable as the rotary body rotates. In the resin discharging apparatus, the resin discharging apparatus includes a pump that transfers the liquid resin in the tube by continuously squeezing the tube in the discharging direction while the pressure roller cooperates with the inner wall of the guide body. A cooling means is provided for cooling a portion held between the rotating body and the guide body, and a heating means is provided for heating a portion of the tube extending from the discharge side of the pump. . ! Effects and Effects of the Invention The present invention provides a cooling means for cooling the tube in the pump of the resin discharging device in the process in which the pressure roller continuously squeezes the tube and pressurizes the liquid resin. The tube is squeezed by the pressure roller between the rotating body and the guide body, applying discharge pressure to the resin. In the above process, the static pressure of the resin may partially decrease or the temperature of the resin may rise, causing bubbles.Normally, the resin supplied by the dispensing device of the present invention is made of isopropyl alcohol, butanol, methyl ethyl ketone, etc. Contains solvents with low boiling points such as In general, the lower the temperature, the less likely the solvents mentioned above to vaporize; therefore,
By keeping the temperature of the resin at a temperature at which the solvent does not vaporize during this pressurization process, it is possible to prevent bubbles from forming in the resin. By using the cooling means, resin without bubbles can be supplied to the electronic component manufacturing process, and the reliability of electronic components and the like can be dramatically improved. However, with only the above-mentioned configuration in which the cooling means is provided, the cooled resin may be discharged as is from the discharge device. When resin having a temperature lower than that of the surrounding environment is discharged in this manner, water vapor in the air condenses on the surface of the resin, and water droplets adhere to the surface of the resin. Therefore, there is an inconvenience that the reliability of electronic components is degraded by the water droplets. Furthermore, if the cooling temperature is low, dew condensation will occur on the outer circumferential surface of the tube in the resin discharging device, and water droplets will drip and damage the resin discharging device itself. The present invention provides the above-mentioned cooling means, and also provides a heating means for heating a portion of the tube extending from the discharge side of the pump in order to eliminate the above-mentioned disadvantages of providing a cooling device. Bubbles are likely to occur only in the pressurized part of the tube, and if bubbles do not occur in that part, bubbles will not occur in subsequent parts.For this reason, in the present invention, the cooled resin Heating means for heating the tube to ambient temperature are provided in the portion of the tube extending from the discharge side of the pump. The above heating means can continuously heat the resin that has passed through the pressurization process of the pump, where air bubbles are likely to occur, at a low temperature to the ambient temperature, preventing dew condensation on the resin surface after discharge, and preventing 4M fat dispensing equipment. can prevent condensation on pipes. The above configuration of the present invention makes it possible to prevent the generation of air bubbles during resin transfer in the resin discharging device, supply high quality sealing resin to the electronic component manufacturing process, and dramatically improve the reliability of electronic components. can be increased to

[Explanation of Examples]

Embodiments of the present invention will be specifically described below with reference to FIGS. 1 and 2. FIG. 1 is a diagram schematically showing the overall configuration of a resin discharging device to which the present invention is applied. As shown in this figure, the resin dispensing device 1 of the present invention includes an elastic tube 4 that guides the resin 2 to the dispensing port 3 without contacting the external environment, and the elastic tube 4 that is continuously squeezed to form the liquid resin. a pump 5 that applies pressure to the tube 2 and causes the tube 4 to flow;
a cooling means 6 for cooling the tube 4 during the pressurization process of the pump 5; and a pump 5 in the tube 4;
It is generally composed of a heating means 7 for heating a portion extending from the discharge side of the tube 4, and a discharge nozzle 8 provided at the tip of the tube 4. The elastic tube 4 is made of an elastic material such as rubber or soft resin, and one end is inserted into a tank 9 that stores the liquid resin 2, and the other end is installed in the electronic device manufacturing process. The resin discharge nozzle 8 is connected to the resin discharge nozzle 8. The pump 5 is equipped with a plurality of rotatably supported pressure rollers 10 on its outer periphery, and a rotating body 12 that rotates around a support shaft 11 and a part of the outer periphery of the rotating body 12 that is spaced apart from each other by a certain distance. a guide body 14 having an inner wall 13 facing each other;
The elastic tube 4 is disposed between the elastic tube 3 and the elastic tube 3 so that the intermediate portion thereof is held. In this embodiment, the rotating body 12 rotatably holds eight cylindrical pressing rollers 10 at equal intervals on its outer periphery. Further, the guide body 14 has a half-cylindrical cross section, and the rotating body 12
An inner wall 13 is formed to face approximately half of the outer periphery of the inner wall 13 . FIG. 2 is a partially enlarged sectional view linearly showing the process of pressurizing the tube 4 in the pump 5. As the rotary body 12 rotates in the discharge direction, the pressure roller 10 is pressed and moved in the direction of transporting the liquid resin 2 over the tube backed up by the inner wall 13 of the guide body 14. The tube 4 is continuously squeezed in the discharge direction in cooperation with the inner wall 13 of the tube 4. Then, the inner wall of the tube approaches the constricted portion of the tube 4 that is pressed by the pressing roller 1O, while a space filled with resin is created between the adjacent constricted portions of the tube 4, and the space is moved in the direction of transfer of the resin 2. By being moved, the resin 2 is transferred. As shown in FIG. 2, the inner wall of the tube 4 pressed by the pressure roller 10 may not be in complete contact with each other, and a small gap 15 is created between the opposing inner walls 4a and 4b of the pressed area. . By creating the gap 15, a flow occurs in the gap 15 in the opposite direction to the transfer direction (direction of arrow P) of the resin 2, which partially reduces the pressure of the resin 2 and generates bubbles of solvent, etc. It is. In this embodiment, the cooling means 6 uses air pressure, and includes an air nozzle 16 that blows high-pressure air toward the outer periphery of the guide body 14 of the pump 5. The cooling means 6 utilizes the fact that the high-pressure air ejected from the air nozzle 16 rapidly expands adiabatically on the outer circumferential surface of the guide body 14 to lower its temperature. By cooling the tube 4 held between the rotating body 12 and the guide body 14, the guide body 14 of this embodiment is made of a metal that is a good thermal conductor. For this reason, the air nozzle 16 allows the guide body 1 to
Even if air is blown onto one point of the guide body 14, the entire guide body 14 can be cooled, and the tube 4 in contact with the inner wall 13 of the guide body 14 can be cooled evenly. In this embodiment, the heating means 7 includes a heating wire 17 provided so as to surround the tube 4 extending from the discharge side of the pump 5, and a power supply device 18 that supplies current to the heating wire 17. . By energizing the heating wire 17, the heating wire 17 generates heat and the tube 4 is heated. The discharge nozzle 8 is incorporated into an electronic component manufacturing apparatus, and is configured to discharge a predetermined amount of resin at a predetermined position. In the above configuration of this embodiment, the cooling means 6 can suppress the generation of bubbles by keeping the resin 2 at a low temperature and preventing vaporization of the solvent during the pressurization process of the pump 5. It is possible to stably and reliably supply the resin 2 containing no resin. On the other hand, the heating means 7 can heat the resin 5 pressurized by the pump 5 to return it to the original temperature immediately after the end of the pressurization process, so that the resin 5 can be heated to the original temperature immediately after the end of the pressurization process. Dew condensation does not occur on the surface, nor does dew condensation occur on the resin 2 discharged from the discharge nozzle 8 in the manufacturing process of electronic components. Therefore, it is possible to stably supply sealing resin that does not contain bubbles, improve product yield, and
The reliability of products such as electronic components can be significantly improved. The present invention is not limited to the above-mentioned embodiment. In this embodiment, a cooling device that injects compressed air is provided as the cooling means 6, but a cooling device that uses a gas cycle such as a refrigeration cycle is also provided. You can also do that. Further, as the heating means 7, it is also possible to provide a heating device using a heating element other than the heating wire 17, for example, a ceramic heater or the like.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall configuration diagram schematically showing an embodiment of a resin discharging device of the present invention. FIG. 2 is a diagram schematically showing a cross section of the main part. l...Resin discharge device, pump, 6...cooling means, roller, 11...support shaft, 14...guide body. 4... Elastic tube, 5... Bore... Heating means, 10... Pressing 12... Rotating body, 13... Inner wall,

Claims (1)

[Claims] (1) It has a plurality of rotatably supported press rollers on the outer periphery, a rotating body that rotates around a support shaft, and an inner wall that faces a part of the outer periphery of the rotating body at a certain distance. a guide body; and an elastically deformable tube disposed such that an intermediate portion thereof is held between an outer peripheral portion of the rotary body and an inner wall of the guide body; A resin dispensing device comprising a pump that transfers liquid resin in the tube by continuously squeezing the tube in the discharging direction while a pressure roller cooperates with the inner wall of the guide body, wherein the rotary body in the tube and A resin discharger characterized in that a cooling means is provided for cooling a portion held between the guide body and a heating means is provided for heating a portion of the tube extending from the discharge side of the pump. Device.