JPH03118963A - Injection flow type soldering vessel - Google Patents
Injection flow type soldering vesselInfo
- Publication number
- JPH03118963A JPH03118963A JP25543289A JP25543289A JPH03118963A JP H03118963 A JPH03118963 A JP H03118963A JP 25543289 A JP25543289 A JP 25543289A JP 25543289 A JP25543289 A JP 25543289A JP H03118963 A JPH03118963 A JP H03118963A
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- solder
- molten
- chamber
- impeller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 22
- 239000007924 injection Substances 0.000 title claims abstract description 22
- 238000005476 soldering Methods 0.000 title abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 187
- 238000005086 pumping Methods 0.000 claims description 26
- 238000005192 partition Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000003068 static effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 2
- 230000003670 easy-to-clean Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、噴流式半田槽に係り、特に溶融半田を上側の
溶融半田貯溜室がら下側の溶融半田圧送室に下向きに圧
送することにより溶融半田圧送室内における溶融半田の
流速を極めて遅くして静圧状態に近くし、噴射ノズルか
ら噴射される溶融半田の波頭が基板の幅方向に対して水
平となるようにし、かつ必要な半田の量も少なくて済み
、消費電力の節減を図ることができると共に半田槽の整
備性の向上を図ることができるようにした噴流式半田槽
に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a jet-flow type solder bath, and in particular, the molten solder is pumped downward from the upper molten solder storage chamber to the lower molten solder pressure feeding chamber. The flow rate of the molten solder in the pressure feeding chamber is extremely slow to bring it close to a static pressure state, so that the wave crest of the molten solder sprayed from the injection nozzle is horizontal to the width direction of the board, and the amount of solder required is also reduced. The present invention relates to a jet-flow type soldering tank that can reduce power consumption and improve maintainability of the soldering tank.
従来の技術
従来例について第２図及び第３図により説明する。まず
第２図に示す従来の噴流式半田槽１においては、半田槽
３の中に噴射ノズル４に連通ずる溶融半田圧送室５を底
部３ａがら浮き上がらせて独立して設け、インペラ６は
、溶融半田流入穴４ｂの上側がっ溶融半田圧送室５内に
配設し、溶融半田８を矢印Ａの如く下から上に吸い上げ
て溶融半田圧送室５内に圧送していた。BACKGROUND ART A conventional example will be explained with reference to FIGS. 2 and 3. First, in the conventional jet type solder bath 1 shown in FIG. The upper side of the solder inflow hole 4b is disposed in the molten solder pumping chamber 5, and the molten solder 8 is sucked up from the bottom to the top as shown by arrow A and pumped into the molten solder pumping chamber 5.
この場合、溶融半田圧送室５は、その通路の容積が小さ
くなるのが不可避であるため、溶融半田８は矢印Ｂで示
す如く、相当速い流速で流れることとなり、複数の整流
板４Ｃに当たって矢印Ｃの如（方向を変え、噴射ノズル
４から矢印りの如く噴射されると、図中右側の方が圧力
が高くなるため、基板９の幅方向に対して溶融半田８の
波頭８ａが水平とならず、必ず右側が高くなる傾向があ
り、このため、溶融半田８が基板９の下面９ａに均一に
接触しないという欠点があった。また溶融半田は重量が
大きいから下から上に向けて圧送するのは効率が悪いと
いう欠点があった。更には溶融半田圧送室５内の流速を
遅くするためには、溶融半田圧送室５の容積を大きくし
なければならないが、そうするためには、該溶融半田圧
送室が半田槽３の底部３ａから浮き上がっているため、
半田槽全体の容積を大きくしなければならず、結果とし
て、必要な溶融半田の量が増大し、消費電力が大きくな
るという欠点があった。更には噴射ノズル４の内部を清
掃することは容易でなく、整備性が悪いという欠点があ
った。In this case, since it is inevitable that the volume of the passage in the molten solder pumping chamber 5 becomes small, the molten solder 8 flows at a considerably high flow rate as shown by the arrow B, and hits the plurality of rectifying plates 4C and hits the arrow C. (If the direction is changed and the jet is ejected from the jet nozzle 4 as shown by the arrow, the pressure will be higher on the right side in the figure, so if the wave crest 8a of the molten solder 8 is horizontal to the width direction of the board 9) However, the right side always tends to be higher, which has the disadvantage that the molten solder 8 does not come into uniform contact with the bottom surface 9a of the substrate 9.Furthermore, since the molten solder is heavy, it must be pumped from the bottom to the top. Furthermore, in order to slow down the flow rate in the molten solder pumping chamber 5, the volume of the molten solder pumping chamber 5 must be increased, but in order to do so, the Since the molten solder pressure feeding chamber is raised from the bottom 3a of the solder tank 3,
This has the disadvantage that the volume of the entire solder tank must be increased, resulting in an increase in the amount of molten solder required and an increase in power consumption. Furthermore, it is not easy to clean the inside of the injection nozzle 4, resulting in poor maintainability.
また第３図に示す従来の噴流式半田槽１においては、噴
射ノズル４を上方が開いたラッパ形とし、その他は第２
図のものと同様にしたものであるが、この場合にも噴射
ノズル４は半田槽３内において該半田槽の底部３ａから
浮き上がっているためインペラ６により吸い上げられた
溶融半田８は矢印Ｃの如く溶融半田流入穴４ｂを通って
下から上に吸い上げられ、溶融半田圧送室５内を矢印り
の如く相当速い流速で流れて噴射ノズル４から矢印Ｅの
如く向きを変えたのち、矢印Ｆの如く噴射されるため、
やはり溶融半田８の波頭８ａは水平とはならず、右側が
高くなって、溶融半田８が基板９の下面９ａに均一に接
触しないという欠点及びその他上記と同様の欠点があっ
た。Furthermore, in the conventional jet type soldering tank 1 shown in FIG.
This is similar to the one shown in the figure, but in this case as well, the injection nozzle 4 is floating above the bottom 3a of the solder tank 3, so the molten solder 8 sucked up by the impeller 6 flows as shown by arrow C. The molten solder is sucked up from bottom to top through the molten solder inflow hole 4b, flows through the molten solder pressure feeding chamber 5 at a fairly high flow rate as shown by the arrow, changes direction from the injection nozzle 4 as shown by the arrow E, and then flows as shown by the arrow F. Because it is injected,
Again, the wave crests 8a of the molten solder 8 are not horizontal and are higher on the right side, resulting in the disadvantage that the molten solder 8 does not come into uniform contact with the lower surface 9a of the substrate 9, and other disadvantages similar to those mentioned above.
目 的
本発明は、上記した従来技術の欠点を除くためになされ
たものであって、その目的とするところは、溶融半田を
収容する半田槽と、該溶融半田を噴射する噴射ノズルと
、該溶融半田を該噴射ノズルに圧送するインペラとを備
えた噴流式半田槽において、噴射ノズルから噴射された
溶融半田を一旦貯溜する溶融半田貯溜室と、半田槽の底
部から噴射ノズルに連通ずるようにかつ溶融半田貯溜室
よりも相当大きな容積を有して形成された溶融半田圧送
室と、該溶融半田圧送室と溶融半田貯溜室とを水平方向
に仕切りかつ溶融半田が流入し得る溶融半田流入穴が形
成された仕切板とを備え、インペラは、該仕切板の溶融
半田流入穴の下側かつ溶融半田圧送室内に配設されて溶
融半田を溶融半田貯溜室から溶融半田圧送室に下向きに
圧送するように構成することにより、溶融半田圧送室内
の溶融半田の流速を極めて遅くし、静圧状態に近い状態
で溶融半田を噴射ノズルに圧送し、噴射される溶融半田
の波頭が基板の幅方向に対して水平となるようにするこ
とであり、またこれによって溶融半田が基板の下面に均
一に接触するようにし、半田付は性能の向上を図ること
である。また他の目的は、上記構成によって必要な半田
槽の容積を小さくて済むようにし、必要な溶融半田の量
を減らし、半田の節約と、消費電力の節減を図ることで
ある。また他の目的は、溶融半田を上から下に圧送する
ことにより溶融半田の自重をインペラの動力軽減に役立
たせ、小さな動力で溶融半田を圧送できるようにするこ
とである。更に他の目的は、半田槽の構造を簡略化して
、その掃除をし易くし、整備性の向上を図ることである
。Purpose The present invention has been made in order to eliminate the drawbacks of the prior art described above, and its purpose is to provide a solder tank containing molten solder, a spray nozzle that sprays the molten solder, and a solder tank that contains molten solder. In a jet-flow type soldering tank equipped with an impeller that pumps molten solder to the injection nozzle, a molten solder storage chamber that temporarily stores the molten solder injected from the injection nozzle, and a molten solder storage chamber that communicates with the injection nozzle from the bottom of the solder tank. and a molten solder pumping chamber formed to have a considerably larger volume than the molten solder storage chamber, and a molten solder inflow hole that horizontally partitions the molten solder pumping chamber and the molten solder storage chamber and into which molten solder can flow. The impeller is disposed below the molten solder inflow hole of the partition plate and within the molten solder pumping chamber to force the molten solder downward from the molten solder storage chamber to the molten solder pumping chamber. By configuring this to This is to ensure that the molten solder is in uniform contact with the bottom surface of the board, thereby improving soldering performance. Another object of the present invention is to reduce the volume of the solder tank required by the above configuration, reduce the amount of molten solder required, and save solder and power consumption. Another object is to use the weight of the molten solder to reduce the power of the impeller by force-feeding the molten solder from top to bottom, thereby making it possible to force-feed the molten solder with a small amount of power. Still another object is to simplify the structure of the solder tank, make it easier to clean, and improve maintainability.
構成
要するに本発明は、溶融半田を収容する半田槽と、該溶
融半田を噴射する噴射ノズルと、該溶融半田を該噴射ノ
ズルに圧送するインペラとを備えた噴流式半田槽におい
て、前記噴射ノズルから噴射された前記溶融半田を一旦
貯溜する溶融半田貯溜室と、前記半田槽の底部から該噴
射ノズルに連通ずるようにかつ前記溶融半田貯溜室より
も相当大きな容積を有して形成された溶融半田圧送室と
、該溶融半田圧送室と前記溶融半田貯溜室とを水平方向
に仕切りかつ前記溶融半田が流入し得る溶融半田流入穴
が形成された仕切板とを備え、前記インペラは、該仕切
板の前記溶融半田流入穴の下側かつ前記溶融半田圧送室
内に配設されて前記溶融半田を前記溶融半田貯溜室から
前記溶融半田圧送室に下向きに圧送するように構成した
ことを特徴とするものである。In short, the present invention provides a jet-flow solder tank that includes a solder tank that stores molten solder, a jet nozzle that jets the molten solder, and an impeller that pumps the molten solder to the jet nozzle. a molten solder reservoir for temporarily storing the injected molten solder; and a molten solder formed to communicate with the injection nozzle from the bottom of the solder tank and to have a considerably larger volume than the molten solder reservoir. The impeller includes a pressure-feeding chamber and a partition plate that horizontally partitions the molten solder pressure-feeding chamber and the molten solder storage chamber and is formed with a molten solder inflow hole into which the molten solder can flow. The device is arranged below the molten solder inflow hole and within the molten solder pumping chamber, and configured to force the molten solder downward from the molten solder storage chamber to the molten solder pumping chamber. It is.
以下本発明を図面に示す実施例に基いて説明する。第１
図において、本発明に係る噴流式半田槽１１は、溶融半
田８を収容する半田槽１３と、該溶融半田を噴射する噴
射ノズル１４と、溶融半田８を噴射ノズルＩ４に圧送す
るインペラ１６とを備えた噴流式半田槽であって、噴射
ノズル１４から噴射された溶融半田８を一旦貯溜する溶
融半田貯溜室１７と、半田槽１３の底部１３ａから噴射
ノズル１４に連通ずるようにかつ溶融半田貯溜室１７よ
りも相当大きな容積を有して形成された溶融半田圧送室
１５と、該溶融半田圧送室と溶融半田貯溜室１７とを水
平方向に仕切りかつ溶融半田８が流入し得る溶融半田流
入穴２０ｂが形成された仕切板２０とを備え、インペラ
１６は、該仕切板の溶融半田流入穴２０ｂの下側かつ溶
融半田圧送室１５内に配設されて溶融半田８を溶融半田
貯溜室１７から溶融半田圧送室１５に下向きに圧送する
ように構成されている。The present invention will be explained below based on embodiments shown in the drawings. 1st
In the figure, a jet type solder tank 11 according to the present invention includes a solder tank 13 that stores molten solder 8, a jet nozzle 14 that jets the molten solder, and an impeller 16 that pumps the molten solder 8 to the jet nozzle I4. A jet-flow type solder tank comprising: a molten solder storage chamber 17 for temporarily storing molten solder 8 injected from the injection nozzle 14; A molten solder pumping chamber 15 formed with a considerably larger volume than the chamber 17, and a molten solder inflow hole that horizontally partitions the molten solder pumping chamber and the molten solder storage chamber 17 and into which the molten solder 8 can flow. The impeller 16 is disposed below the molten solder inflow hole 20b of the partition plate and within the molten solder pumping chamber 15 to direct the molten solder 8 from the molten solder storage chamber 17. The molten solder is configured to be force-fed downward into the molten solder pressure-feeding chamber 15.
この場合、溶融半田圧送室１５は、半田槽１３の底部１
３ａから上をその全部の容積として確保できるから、該
容積は従来の溶融半田圧送室に比べて非常に大きくなっ
ている。そして溶融半田貯溜室１７に貯溜される溶融半
田８のヘッドをＨ＋溶融半田圧送室１５内の溶融半田８
のへ・ンドをＨ２とすると、Ｈ，＞Ｈ，の関係となるよ
うに設定されている。In this case, the molten solder pressure feeding chamber 15 is located at the bottom 1 of the solder tank 13.
Since the entire volume above 3a can be secured, the volume is much larger than that of a conventional molten solder pumping chamber. Then, the head of the molten solder 8 stored in the molten solder storage chamber 17 is
Assuming that the current is H2, the relationship is set such that H,>H.
作用
本発明は、上記のように構成されており、以下その作用
について説明する。第１図において、インペラ１６が回
転すると、溶融半田貯溜室１７内に貯溜されていた溶融
半田８は矢印Ｇの如（溶融半田流入穴２０ｂから下向き
に流入し、溶融半田圧送室１５内で四方に拡散し、イン
ペラ１６により与えられた速度のエネルギは圧力のエネ
ルギに変わり、矢印Ｈ方向の流速は非常に小さくなって
噴射ノズル１４に送られる。これは溶融半田圧送室１５
が紙面左右方向のみならず紙面直角方向にも広がってい
るためと、溶融半田圧送室１５の容積が非常に大きいこ
とによるもので、溶融半田８はインペラ１６により与え
られた速度のエネルギを失って圧力のエネルギを噴射ノ
ズル１４に対して供給することになる。この結果、噴射
ノズル１４内においては、あたかも静圧が作用している
かのように、溶融半田８は、ふあ−と浮き上がるように
噴出され、その波頭８ａは基板９の幅方向に対して水平
となり、該基板の下面９ａに均一に接触し、良好な半田
付は性能を得ることができる。Function The present invention is constructed as described above, and its function will be explained below. In FIG. 1, when the impeller 16 rotates, the molten solder 8 stored in the molten solder storage chamber 17 flows downward from the molten solder inflow hole 20b as shown by arrow G, and flows in all directions within the molten solder pumping chamber 15. The velocity energy given by the impeller 16 changes to pressure energy, and the flow velocity in the direction of arrow H becomes very small and is sent to the injection nozzle 14.
This is because the molten solder 8 spreads not only in the horizontal direction but also in the perpendicular direction to the paper, and the volume of the molten solder pumping chamber 15 is extremely large.The molten solder 8 loses the energy of the velocity given by the impeller 16. Pressure energy is supplied to the injection nozzle 14. As a result, inside the injection nozzle 14, the molten solder 8 is ejected in a floating manner as if static pressure is acting on it, and the wave crest 8a is horizontal to the width direction of the substrate 9. Therefore, it is possible to uniformly contact the lower surface 9a of the substrate and obtain good soldering performance.
また溶融半田８は上から下に圧送されるので、インペラ
１６が必要とする動力は下から上に圧送する場合に比べ
て非常に小さくて済み、インペラ駆動用のモータ（図示
せず）はより小型のもので足り、電力の節減を図ること
ができる。In addition, since the molten solder 8 is pumped from the top to the bottom, the power required by the impeller 16 is much smaller than when the molten solder 8 is pumped from the bottom to the top, and the impeller drive motor (not shown) is much smaller. A small one is sufficient, and it is possible to save power.
また半田槽１３は、２つに仕切られているのみであり、
特に溶融半田圧送室１５の容積が非常に大きいので、仕
切板２０を取り外すことにより、半田槽１３の掃除はし
易く、整備性が良好である。Furthermore, the solder tank 13 is only partitioned into two parts.
In particular, since the volume of the molten solder pumping chamber 15 is very large, the solder tank 13 can be easily cleaned by removing the partition plate 20, resulting in good maintainability.
効果
本考案は、上記のように溶融半田を収容する半田槽と、
該溶融半田を噴射する噴射ノズルと、該溶融半田を該噴
射ノズルに圧送するインペラとを備えた噴流式半田槽に
おいて、噴射ノズルから噴射された溶融半田を一旦貯溜
する溶融半田貯溜室と、半田槽の底部から噴射ノズルに
連通ずるようにかつ溶融半田貯溜室よりも相当大きな容
積を有して形成された溶融半田圧送室と、該溶融半田圧
送室と溶融半田貯溜室とを水平方向に仕切りかつ溶融半
田が流入し得る溶融半田流入穴が形成された仕切板とを
備え、インペラは、該仕切板の溶融半田流入穴の下側か
つ溶融半田圧送室内に配設されて溶融半田を溶融半田貯
溜室から溶融半田圧送室に下向きに圧送するように構成
したので、溶融半田圧送室内の溶融半田の流速を極めて
遅くし、静圧状態に近い状態で溶融半田を噴射ノズルに
圧送することができるから、噴射される溶融半田の波頭
が基板の幅方向に対して水平となる効果が得４
られ、またこの結果溶融半田が基板の下面に均一に接触
するようになり、半田付は性能の向上を図ることができ
る効果がある。また上記のように構成した結果必要な半
田槽の容積は小さくて済むようになり、必要な溶融半田
の量を減らし、半田の節約と、消費電力の節減を図るこ
とができる効果がある。また溶融半田を上から下に圧送
するようにしたので、溶融半田の自重をインペラの動力
軽減に役立たせることができ、小さな動力で溶融半田を
圧送できる効果が得られる。更には半田槽の構造を簡略
化することができ、その掃除をし易くして整備性の向上
を図ることができる効果がある。Effects The present invention includes a solder tank containing molten solder as described above,
A jet-flow type solder bath including a jet nozzle for jetting the molten solder and an impeller for pumping the molten solder to the jet nozzle, a molten solder storage chamber for temporarily storing the molten solder jetted from the jet nozzle; A molten solder pumping chamber is formed to communicate with the injection nozzle from the bottom of the tank and has a considerably larger volume than the molten solder storage chamber, and the molten solder pumping chamber and the molten solder storage chamber are horizontally partitioned. and a partition plate in which a molten solder inflow hole into which molten solder can flow is formed, and the impeller is disposed below the molten solder inflow hole of the partition plate and inside the molten solder pressure feeding chamber to transfer the molten solder to the molten solder. Since the molten solder is configured to be pumped downward from the storage chamber to the molten solder pumping chamber, the flow rate of the molten solder in the molten solder pumping chamber can be made extremely slow, and the molten solder can be pumped to the injection nozzle in a state close to static pressure. As a result, the crest of the sprayed molten solder is horizontal to the width direction of the board4, and as a result, the molten solder comes into uniform contact with the bottom surface of the board, improving soldering performance. This has the effect of making it possible to achieve this goal. Further, as a result of the above configuration, the volume of the required solder tank can be reduced, which has the effect of reducing the amount of molten solder required, thereby saving solder and power consumption. Furthermore, since the molten solder is forced to be fed from the top to the bottom, the weight of the molten solder can be used to reduce the power of the impeller, and the effect of being able to pump the molten solder with a small amount of power can be obtained. Furthermore, the structure of the solder tank can be simplified, making it easier to clean and improving maintainability.
第１図は本発明の実施例に係る噴流式半田槽の縦断面図
、第２図及び第３図は従来例に係る噴流式半田槽の縦断
面図である。
８は溶融半田、１１は噴流式半田槽、１３は半田槽、１
３ａは底部、１４は噴射ノズル、１５は溶融半田圧送室
、１６はインペラ、１７は溶融半田貯溜室、
半田流入穴である。
２０は仕切板、
２、FIG. 1 is a vertical cross-sectional view of a jet-flow type solder tank according to an embodiment of the present invention, and FIGS. 2 and 3 are vertical cross-sectional views of a jet-flow type solder tank according to a conventional example. 8 is molten solder, 11 is a jet solder tank, 13 is a solder tank, 1
3a is a bottom, 14 is an injection nozzle, 15 is a molten solder pressure feeding chamber, 16 is an impeller, 17 is a molten solder storage chamber, and a solder inflow hole. 20 is a partition plate, 2,
Claims (1)
噴射ノズルと、該溶融半田を該噴射ノズルに圧送するイ
ンペラとを備えた噴流式半田槽において、前記噴射ノズ
ルから噴射された前記溶融半田を一旦貯溜する溶融半田
貯溜室と、前記半田槽の底部から該噴射ノズルに連通す
るようにかつ前記溶融半田貯溜室よりも相当大きな容積
を有して形成された溶融半田圧送室と、該溶融半田圧送
室と前記溶融半田貯溜室とを水平方向に仕切りかつ前記
溶融半田が流入し得る溶融半田流入穴が形成された仕切
板とを備え、前記インペラは、該仕切板の前記溶融半田
流入穴の下側かつ前記溶融半田圧送室内に配設されて前
記溶融半田を前記溶融半田貯溜室から前記溶融半田圧送
室に下向きに圧送するように構成したことを特徴とする
噴流式半田槽。The molten solder injected from the injection nozzle in a jet-flow solder tank comprising a solder tank that accommodates molten solder, an injection nozzle that injects the molten solder, and an impeller that pumps the molten solder to the injection nozzle. a molten solder storage chamber for temporarily storing the molten solder; a molten solder pressure-feeding chamber that is formed to communicate with the injection nozzle from the bottom of the solder tank and has a considerably larger volume than the molten solder storage chamber; A partition plate horizontally partitions the solder pumping chamber and the molten solder storage chamber and has a molten solder inflow hole through which the molten solder can flow, and the impeller is configured to separate the molten solder inflow hole of the partition plate. A jet-flow type solder tank, characterized in that it is disposed below the molten solder and in the molten solder pumping chamber, and is configured to force-feed the molten solder downward from the molten solder storage chamber to the molten solder pumping chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25543289A JPH03118963A (en) | 1989-09-30 | 1989-09-30 | Injection flow type soldering vessel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25543289A JPH03118963A (en) | 1989-09-30 | 1989-09-30 | Injection flow type soldering vessel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03118963A true JPH03118963A (en) | 1991-05-21 |
Family
ID=17278688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25543289A Pending JPH03118963A (en) | 1989-09-30 | 1989-09-30 | Injection flow type soldering vessel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03118963A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6510978B1 (en) * | 1999-11-01 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Solder jet machine and soldering method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59312A (en) * | 1982-06-23 | 1984-01-05 | Mitsubishi Heavy Ind Ltd | Operation of magnetic filter |
-
1989
- 1989-09-30 JP JP25543289A patent/JPH03118963A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59312A (en) * | 1982-06-23 | 1984-01-05 | Mitsubishi Heavy Ind Ltd | Operation of magnetic filter |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6510978B1 (en) * | 1999-11-01 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Solder jet machine and soldering method |
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