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Priority to JP1984157527UpriorityCriticalpatent/JPH0311893Y2/ja
Publication of JPS6172860UpublicationCriticalpatent/JPS6172860U/ja
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Publication of JPH0311893Y2publicationCriticalpatent/JPH0311893Y2/ja
Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled