JPH0311893Y2 - - Google Patents

Info

Publication number
JPH0311893Y2
JPH0311893Y2 JP15752784U JP15752784U JPH0311893Y2 JP H0311893 Y2 JPH0311893 Y2 JP H0311893Y2 JP 15752784 U JP15752784 U JP 15752784U JP 15752784 U JP15752784 U JP 15752784U JP H0311893 Y2 JPH0311893 Y2 JP H0311893Y2
Authority
JP
Japan
Prior art keywords
main body
lid
sealed
refrigerant
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15752784U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6172860U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15752784U priority Critical patent/JPH0311893Y2/ja
Publication of JPS6172860U publication Critical patent/JPS6172860U/ja
Application granted granted Critical
Publication of JPH0311893Y2 publication Critical patent/JPH0311893Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP15752784U 1984-10-18 1984-10-18 Expired JPH0311893Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15752784U JPH0311893Y2 (enrdf_load_stackoverflow) 1984-10-18 1984-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15752784U JPH0311893Y2 (enrdf_load_stackoverflow) 1984-10-18 1984-10-18

Publications (2)

Publication Number Publication Date
JPS6172860U JPS6172860U (enrdf_load_stackoverflow) 1986-05-17
JPH0311893Y2 true JPH0311893Y2 (enrdf_load_stackoverflow) 1991-03-20

Family

ID=30715519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15752784U Expired JPH0311893Y2 (enrdf_load_stackoverflow) 1984-10-18 1984-10-18

Country Status (1)

Country Link
JP (1) JPH0311893Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6172860U (enrdf_load_stackoverflow) 1986-05-17

Similar Documents

Publication Publication Date Title
US12080614B2 (en) Lidded semiconductor package
US20070274045A1 (en) Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Thereof Employing A Thermally Conductive Return Manifold Structure Sealed To The Periphery Of A Surface To Be Cooled
CA1249063A (en) Evaporation cooling module for semiconductor devices
US7832096B2 (en) Method for producing an organic substrate with integral thermal dissipation channels
US4670771A (en) Rectifier module
US5828125A (en) Ultra-high density warp-resistant memory module
US7079393B2 (en) Fluidic cooling systems and methods for electronic components
US5923086A (en) Apparatus for cooling a semiconductor die
KR100662218B1 (ko) 방열기 연결방법
US5578874A (en) Hermetically self-sealing flip chip
US6998706B2 (en) Relaxed tolerance flip chip assembly
US20210159141A1 (en) Laminated circuitry cooling for inter-chip bridges
KR20240137605A (ko) 하나 이상의 집적 회로 구성요소에 냉각 솔루션을 적용하고 집적 회로 냉각을 위해 조립하는 방법
US6737754B2 (en) COF packaged semiconductor
JPH0311893Y2 (enrdf_load_stackoverflow)
CN115206895A (zh) 半导体装置及其制造方法
US3912001A (en) Water cooled heat sink assembly
JP2804640B2 (ja) 半導体装置の冷却装置及び冷却方法
Ciccio et al. Ultra-high density VLSI modules
JPS61131553A (ja) 浸漬液冷装置
JP2003258153A (ja) 半導体パッケージの実装構造
US20240363478A1 (en) Electrically isolated discrete package with high performance ceramic substrate
JP3095383B2 (ja) 集積回路素子実装構造体
JPS61251159A (ja) 半導体素子液冷モジユ−ル
JPH0445250Y2 (enrdf_load_stackoverflow)