JPH0311892Y2 - - Google Patents
Info
- Publication number
- JPH0311892Y2 JPH0311892Y2 JP1984179102U JP17910284U JPH0311892Y2 JP H0311892 Y2 JPH0311892 Y2 JP H0311892Y2 JP 1984179102 U JP1984179102 U JP 1984179102U JP 17910284 U JP17910284 U JP 17910284U JP H0311892 Y2 JPH0311892 Y2 JP H0311892Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal member
- resin
- case
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984179102U JPH0311892Y2 (enEXAMPLES) | 1984-11-26 | 1984-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984179102U JPH0311892Y2 (enEXAMPLES) | 1984-11-26 | 1984-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6194357U JPS6194357U (enEXAMPLES) | 1986-06-18 |
| JPH0311892Y2 true JPH0311892Y2 (enEXAMPLES) | 1991-03-20 |
Family
ID=30736665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984179102U Expired JPH0311892Y2 (enEXAMPLES) | 1984-11-26 | 1984-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311892Y2 (enEXAMPLES) |
-
1984
- 1984-11-26 JP JP1984179102U patent/JPH0311892Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6194357U (enEXAMPLES) | 1986-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59132155A (ja) | 半導体装置用容器 | |
| JPH0311892Y2 (enEXAMPLES) | ||
| US5157587A (en) | Sealing arrangement | |
| JP2578530Y2 (ja) | 端子接続構造 | |
| JP2528053Y2 (ja) | 混成集積回路 | |
| JPH01181450A (ja) | 樹脂封止型半導体装置 | |
| JPH0412676Y2 (enEXAMPLES) | ||
| JPH0353779B2 (enEXAMPLES) | ||
| JP2504167B2 (ja) | Ｉｃ用キャップ | |
| JP2616193B2 (ja) | 混成集積回路装置用ケース | |
| JPH0431745Y2 (enEXAMPLES) | ||
| JPS6260245A (ja) | 半導体装置 | |
| JPH0530377Y2 (enEXAMPLES) | ||
| JP2000133911A (ja) | 電子部品搭載装置 | |
| JPS6079064U (ja) | 配線クランプ | |
| JPS5942097U (ja) | 放熱板取り付け構造 | |
| JPH0224265Y2 (enEXAMPLES) | ||
| JPS6063943U (ja) | 半導体ウエハ用マウントフレ−ム | |
| JPH0143872Y2 (enEXAMPLES) | ||
| JPS62152145A (ja) | 封止構造 | |
| JPH02205056A (ja) | 集積回路パッケージ | |
| JPH0546702B2 (enEXAMPLES) | ||
| JPS61234058A (ja) | 半導体装置 | |
| JPS6096810U (ja) | 電子部品 | |
| JPS5942095U (ja) | 放熱板取り付け構造 |