JPH03118565U - - Google Patents
Info
- Publication number
- JPH03118565U JPH03118565U JP2731290U JP2731290U JPH03118565U JP H03118565 U JPH03118565 U JP H03118565U JP 2731290 U JP2731290 U JP 2731290U JP 2731290 U JP2731290 U JP 2731290U JP H03118565 U JPH03118565 U JP H03118565U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- attached
- connector
- jumper wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す展開斜視図、
第２図は第１図の第１及び第２プリント基板間の
接合が完了した状態を示す斜視図である。
主な図番の説明、１……第１プリント基板、２
……第２プリント基板、３……コネクタの雌型、
６……コネクタの雄型、５……ジヤンパー線、７
……ランド、８……切欠。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
FIG. 2 is a perspective view showing a state in which the bonding between the first and second printed circuit boards of FIG. 1 is completed. Explanation of main drawing numbers, 1...First printed circuit board, 2
...Second printed circuit board, 3...Female type of connector,
6...Male type of connector, 5...Jumper wire, 7
... Land, 8 ... Notch.
Claims (1)
た第１プリント基板と、前記雄型に嵌合されるコ
ネクタの雌型が取付けられた第２プリント基板と
を有し、前記コネクタの雄型及び雌型を嵌合した
状態で前記第１及び第２プリント基板を重ねて配
置する様に成したプリント基板の接合装置であつ
て、前記第１及び第２プリント基板のうちの一方
にジヤンパー線を所定のパターン上に並列に配設
するとともに、前記第１及び第２プリント基板の
うちの他方に前記ジヤンパー線が配設された位置
に応じてランドを設け、前記ジヤンパー線を切断
して該ジヤンパー線の一部を前記ランドに半田付
け可能にしたことを特徴とするプリント基板の接
合装置。 It has a first printed circuit board on which a male type of a connector for electrical connection is attached, and a second printed circuit board on which a female type of a connector to be fitted to the male type is attached, and the male type of the connector and the second printed circuit board are attached. A printed circuit board bonding device configured to place the first and second printed circuit boards overlapping each other with female molds fitted together, the device comprising a jumper wire attached to one of the first and second printed circuit boards. The jumper wires are arranged in parallel on a predetermined pattern, and lands are provided on the other of the first and second printed circuit boards according to the positions where the jumper wires are arranged, and the jumper wires are cut to form the jumper wires. A printed circuit board bonding device characterized in that a part of the wire can be soldered to the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2731290U JPH03118565U (en) | 1990-03-16 | 1990-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2731290U JPH03118565U (en) | 1990-03-16 | 1990-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03118565U true JPH03118565U (en) | 1991-12-06 |
Family
ID=31530173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2731290U Pending JPH03118565U (en) | 1990-03-16 | 1990-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03118565U (en) |
-
1990
- 1990-03-16 JP JP2731290U patent/JPH03118565U/ja active Pending