JPH03117901A - Adjusting pattern for high frequency amplifier - Google Patents

Abstract

PURPOSE:To realize various kinds of amplifier which have a good reproducibility and have the reliability improved and can select frequencies by cutting connection lands of an adjusting pattern in narrow positions. CONSTITUTION:An adjusting pattern 3 consists of a main line 3a as the signal line in an about center of a dielectric substrate, linear connection lands 3c which are branched from the main line 3a and are connected, and adjusting lands 3b which have a face form and are connected to connection lands 3c and form inductance components and capacitance components, and connection lands 3c are cut away in desired position to adjust the impedance. This adjusting pattern is provided with the main line 3a as one signal line in the center, and plural coupling and branched connection lands 3c are connected to the main line 3a, and plural adjusting lands 3b are connected to connection lands 3c. Thus, designated connection lands 3c are merely cut and adjusting lands 3b are cut away to adjust the adjusting pattern 3, and adjustment of good reproducibility is possible.

Description

[Detailed Description of the Invention] [Summary] Regarding the impedance adjustment of the input/output matching circuit of a high frequency amplifier, the purpose of the present invention is to provide an adjustment pattern that allows reproducible impedance adjustment, and to adjust the impedance at the input terminal and output terminal of a field effect transistor. In a device that connects adjustment patterns provided on a dielectric substrate and adjusts the adjustment patterns to achieve impedance matching of a high frequency amplifier, the adjustment pattern is located approximately in the center of the dielectric substrate and is connected to a signal path. A main line, a linear connection land connected to a plurality of branches branching from the main line, and an adjustment land having a surface shape and connected to the connection land and forming an inductance component and a capacitance component. The impedance is adjusted by separating the connection land at a desired position.

[Industrial application field]

The present invention relates to impedance adjustment of an input/output matching circuit of a high frequency amplifier.

[Conventional technology]

High-frequency amplifiers are required to have high reliability and a wide variety of types, and accordingly, it is desired to provide an adjustment pattern for an input/output matching circuit that allows frequency band adjustment to be performed easily and reproducibly.

FIG. 3(A) is a diagram showing an input/output matching circuit using a conventional adjustment pattern, and FIG. 3(B) is a diagram showing an input/output matching circuit using a conventional adjustment pattern.
) is a diagram showing an equivalent circuit of. Figure 3 (A), 1
1 is a first insulating substrate made of a dielectric material, 12 is a second insulating substrate having the same structure as the first insulating substrate, and 13 is a first insulating substrate 11
14 is a second adjustment pattern of gold foil conductors provided on the second insulating substrate 12; 15 is a part of the first adjustment pattern 11 and the second adjustment pattern 12; A diamond scriber 16 performs cutting to adjust impedance, and 16 is a field effect transistor that operates as an amplifier.

The first insulating substrate 11 and the second insulating substrate 12 have conductor patterns of a first adjustment pattern 13 and a second adjustment pattern 14 on one surface (for example, the upper surface side), and have conductor patterns of a first adjustment pattern 13 and a second adjustment pattern 14 on the other surface (for example, A conductive plate (not shown) is attached to the lower surface side. Therefore, the first adjustment pattern 13 and the second adjustment pattern 14 form a distributed constant type high frequency impedance line with a conductive plate (not shown). In other words, the first adjustment pattern 13 and the second adjustment pattern 14 in FIG. .The distributed constant circuit in Fig. 3(A) is
As shown in Figure 3 (B), and cl and Lt and C
Represented as a two lumped constant circuit. From this, Ll and C
8 forms an input matching circuit of the field effect transistor 16, and L2 and 02 form an output matching circuit of the field effect transistor 16.

The input matching circuit (L,) formed in this way.

Adjustment of C+) and output matching circuit (Lz+Cz) is as follows:
By cutting the first adjustment pattern 13 and the second adjustment pattern 14 using a diamond scriber 15, or by adding gold foil as necessary, the impedance is changed and the input matching circuit and output matching circuit are adjusted. Make adjustments. Adjustment by cutting this adjustment pattern widely with a diamond scriber or adding gold foil may damage the insulating substrate over a wide area or cause the scratches to become irregular, making it difficult to perform impedance adjustment for the desired frequency with good reproducibility. I have no choice but to.

[Problem to be solved by the invention]

Therefore, the adjustment using the conventional adjustment pattern has the problem that the insulating substrate is wide (damaged) or the scratches are irregular, resulting in poor reproducibility, and therefore, it is difficult to change and adjust the frequency.

An object of the present invention is to provide an adjustment pattern that allows reproducible impedance adjustment.

[Means to solve the problem]

In the present invention, an adjustment pattern 3 provided on a dielectric substrate is connected to an input terminal and an output terminal of a field effect transistor 6, and impedance matching of a high frequency amplifier is achieved by adjusting the adjustment pattern 3. The adjustment pattern 3 has a surface shape including a main line 3a that is located approximately in the center of the dielectric substrate and serves as a signal path, and a linear connection land 3c that is connected to a plurality of branches branching from the main line 3a. An adjustment land 3 that is connected to the connection land 3c and forms an inductance component and a capacitance component.
b, and the connection land 3c is separated at a desired position to adjust the impedance.

[For production]

As shown in FIG. 1, the adjustment pattern of the present invention is to provide a main line 3a as a single signal line in the center, and connect a plurality of connecting lands 3c branched and connected from the main line 3a.
Further, a plurality of adjustment lands 3b are connected to each connection land 3c.

Therefore, the adjustment of this adjustment pattern 3 can be made by simply cutting the specified connection land 3c and separating the adjustment land 3b, which allows adjustment with good reproducibility.

〔Example〕

FIG. 1 is a diagram showing an adjustment pattern of the present invention.

In the figure, 3 indicates an adjustment pattern, 3a is a main line as a signal path, 3b is an adjustment land for impedance adjustment, and 3c is a connection land, which is branched and connected from the main line 3a.

FIG. 2 is a diagram showing an input/output matching circuit using the adjustment pattern of the present invention, in which the adjustment pattern of FIG. 1 is provided for impedance adjustment. In Fig. 2, 1 is a first insulating substrate made of a dielectric material, 2 is a second insulating substrate having the same structure as the second insulating substrate, and 3 is provided on the first insulating substrate l and the second insulating substrate 2. Adjustment pattern 5 of the gold foil conductor is obtained by cutting the connection land 3c provided on the adjustment pattern 3.
A diamond scriber 6 separates the adjustment land 3b connected to C to adjust the impedance, and 6 is a field effect transistor as an amplifier.

Further, reference numeral 7 denotes a power source, which applies a voltage to the electrode rod 8 to melt down a desired connection land 3C, disconnect the adjustment land 3b connected to the connection land 3C, and adjust the impedance.

The first insulating substrate 1 and the second insulating substrate 2 are provided with an adjustment pattern 3 consisting of four pieces of gold foil on the negative side (for example, the top side), and on the other side (for example, the bottom side). A conductive plate (not shown) is bonded and provided between the adjustment pattern 3 and the conductive plate (not shown), for example, as shown in FIG.
The distributed constant impedance equivalent circuit shown in B) is formed as in the conventional example. The configuration of the adjustment pattern 3 shown in FIGS. 1 and 2 is that a main line 3a as a signal transmission conductor is provided in the center, and a plurality of approximately 0.05 mm width branches are connected from the main line 3a. Connect the connection land 3c of , and connect the multiple adjustment lands 3b of width 0.1 length x uo to each connection land 3c, width Q, 1m x length 0.05mm to the multiple adjustment lands 3c of os. are doing.

Adjustment of the branched and connected adjustment pattern 3 thus formed can be made by cutting the specified connection land 3c using a diamond scriber 5 and separating the adjustment land 3b to change the impedance to a desired value, or A voltage is applied from the power source 7 to the electrode rod 8 to connect the connecting land 3c.
Adjustment is made in the same way by burning out the fuse. In this case, the adjustment is simply cutting or fusing the connecting land 3c with a width of about 0.05 m, so that the cut end of the connecting land 3c can be made uniform, and therefore adjustment can be made with good reproducibility.

[Effects of the Invention] As is clear from the above description, according to the present invention, since the connection land of the adjustment pattern is cut at a narrow point, reproducibility and reliability are improved, and a wide variety of products with selectable frequencies can be produced. amplifier can be realized.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the configuration of the adjustment pattern of the present invention, FIG. 2 is a diagram showing an input/output matching circuit using the adjustment pattern of the present invention, and FIGS. 3(A) and 3(B) are FIG. 3 is a diagram showing an input/output matching circuit using the adjustment pattern of the invention. In the figure, 1 is a first insulating substrate, 2 is a second insulating substrate, 3 is an adjustment pattern, 3a is a main line, 3b is an adjustment land, 3c is a connection land, 5 is a diamond scriber, and 6 is a field effect transistor. . 1st ■?

Claims (1)

[Claims] By connecting the adjustment pattern (3) provided on the dielectric substrate to the input terminal and output terminal of the field effect transistor (6), and adjusting the adjustment pattern (3), the high frequency amplifier can be controlled. In the device for impedance matching, the adjustment pattern (3) is connected to a main line (3a) which is located approximately in the center of the dielectric substrate and serves as a signal path;
A linear connection land (3c) which is connected to a plurality of branches from a), and a connection land (3c) having a surface shape.
and an adjustment land (3b) that is connected to and forms an inductance component and a capacitance component, and the connection land (3c) is separated at a desired position to adjust impedance. adjustment pattern.