JPH03117838U - - Google Patents
Info
- Publication number
- JPH03117838U JPH03117838U JP2671090U JP2671090U JPH03117838U JP H03117838 U JPH03117838 U JP H03117838U JP 2671090 U JP2671090 U JP 2671090U JP 2671090 U JP2671090 U JP 2671090U JP H03117838 U JPH03117838 U JP H03117838U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- semiconductor device
- conductive film
- stem
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2671090U JPH03117838U (cs) | 1990-03-15 | 1990-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2671090U JPH03117838U (cs) | 1990-03-15 | 1990-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117838U true JPH03117838U (cs) | 1991-12-05 |
Family
ID=31529591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2671090U Pending JPH03117838U (cs) | 1990-03-15 | 1990-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117838U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087469A (ja) * | 2008-09-08 | 2010-04-15 | Toshiba Corp | 高周波パッケージ装置およびその製造方法 |
-
1990
- 1990-03-15 JP JP2671090U patent/JPH03117838U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087469A (ja) * | 2008-09-08 | 2010-04-15 | Toshiba Corp | 高周波パッケージ装置およびその製造方法 |