JPH03116917A - Cylindrical ceramic capacitor - Google Patents
Cylindrical ceramic capacitorInfo
- Publication number
- JPH03116917A JPH03116917A JP25669289A JP25669289A JPH03116917A JP H03116917 A JPH03116917 A JP H03116917A JP 25669289 A JP25669289 A JP 25669289A JP 25669289 A JP25669289 A JP 25669289A JP H03116917 A JPH03116917 A JP H03116917A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cylindrical ceramic
- metal cap
- ceramic capacitor
- circumferential surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 35
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 claims abstract description 45
- 239000000203 mixture Substances 0.000 claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 4
- 230000006866 deterioration Effects 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 26
- 239000003990 capacitor Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、筒型セラミックコンデンサ素子の内部電極
と外部電極とに、それぞれ端子機能を有するコツプ状金
属キャップを嵌着させることにより構成される筒型セラ
ミックコンデンサに関し、特に、回路基板に、電気的特
性の経時劣化を生じることなく良好かつ直接装着するこ
とができるように構成された筒型セラミックコンデンサ
に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention is constructed by fitting a socket-shaped metal cap having a terminal function to the internal electrode and external electrode of a cylindrical ceramic capacitor element, respectively. The present invention relates to a cylindrical ceramic capacitor, and particularly to a cylindrical ceramic capacitor that is configured to be easily and directly mounted on a circuit board without causing deterioration of electrical characteristics over time.
（従来の技術）
従来の筒型セラミックコンデンサにおいては、−膜面に
第３図に示すように構成されている。(Prior Art) A conventional cylindrical ceramic capacitor is constructed as shown in FIG. 3 on the -film surface.
即ち、セラミック粉末とバインダとの混合物を乾式又は
湿式成形し焼成することにより作られコンデンサの誘電
体として機能するセラミックコンデンサ素体ｌと、該セ
ラミンクコンデンサ素体ｌの内周面１ａから一端面を経
て外周面１ｂの一部まで連続的に設けられた内部電極２
と、前記内周面ｌａ上の内部電極２に対向させてセラミ
ンクコンデンサ素体ｌの外周面１ｂに設けられた外部電
極３と、から構成され、該内部電極２と外部電極３の対
向面により静電容量を得ることにより筒型セラミックコ
ンデンサ８が完成されていた。That is, a ceramic capacitor body l which is made by dry or wet molding and firing a mixture of ceramic powder and a binder and functions as a dielectric of the capacitor, and one end surface from the inner circumferential surface 1a of the ceramic capacitor body l. The internal electrode 2 is continuously provided to a part of the outer peripheral surface 1b through the
and an external electrode 3 provided on the outer circumferential surface 1b of the ceramic capacitor body l to face the internal electrode 2 on the inner circumferential surface la, and an opposing surface of the internal electrode 2 and the external electrode 3. A cylindrical ceramic capacitor 8 was completed by obtaining capacitance.
また、前記筒型セラミックコンデンサ８における内部電
極２のコンデンサ素体ｌ外周面１ｂへの導出部２ａには
端子機能を有するとともに全面半田メッキ４処理が施さ
れた略コツプ状金属キャップ５ａが、また、前記外部電
極３の端部にも同様な金属キャップ５ｂが各々嵌着され
ている。Further, in the lead-out portion 2a of the internal electrode 2 of the cylindrical ceramic capacitor 8 to the outer circumferential surface 1b of the capacitor element body 1, there is also a substantially chip-shaped metal cap 5a having a terminal function and subjected to solder plating 4 on the entire surface. Similar metal caps 5b are also fitted to the ends of the external electrodes 3, respectively.
金属キャップ５全面に処理が施されている半田４は、錫
８８〜９２％：鉛８〜１２％の組成とされており、通炉
加熱により該半田４を溶融させることにより、前記一対
の金属キャップ５ａ、５ｂを内部電極２と外部電極３と
にそれぞれ半田結合させるように構成されている。The solder 4, which has been treated on the entire surface of the metal cap 5, has a composition of 88 to 92% tin and 8 to 12% lead. The caps 5a and 5b are configured to be soldered to the internal electrode 2 and the external electrode 3, respectively.
尚、前記金属キャップ５における内部電極２と外部電極
３との嵌着内側面には、セラミンクコンデンサ素体１を
円滑に挿入させるとともに弾性的に保持を行うための突
起６が形成されている。Incidentally, a protrusion 6 is formed on the inner surface of the metal cap 5 where the internal electrode 2 and the external electrode 3 fit together to allow the ceramic capacitor body 1 to be inserted smoothly and to be held elastically. .
図の符号７は、防湿および電気的絶縁等のためのエポキ
シ樹脂等から成る保護膜である。Reference numeral 7 in the figure is a protective film made of epoxy resin or the like for moisture proofing and electrical insulation.
（発明が解決しようとする問題点）
上記した従来の筒型セラミックコンデンサ８は、一般に
例えばプリント基板に装着され、該プリント基板を半田
浸漬することにより回路に半田結合される。(Problems to be Solved by the Invention) The conventional cylindrical ceramic capacitor 8 described above is generally mounted on, for example, a printed circuit board, and solder-bonded to a circuit by dipping the printed circuit board with solder.
このような半田接着時には、約２４０６Ｃ〜２６０°Ｃ
の温度に約１０ｓｅｃ、間さらされるため、セラミック
コンデンサ素体ｌおよび金属キャップ５は、はぼ前記温
度まで上昇することになる。When soldering like this, the temperature is approximately 2406°C to 260°C.
Since the ceramic capacitor body 1 and the metal cap 5 are exposed to a temperature of about 100 sec for about 10 seconds, the ceramic capacitor body 1 and the metal cap 5 rise to almost the above temperature.
この場合、金属キャップ５の表面に処理が施されている
半田４は、錫８８〜９２％：鉛８〜１２％の組成である
ため融点が約２２０°Ｃであり、容易に溶融されること
になる。In this case, the solder 4 treated on the surface of the metal cap 5 has a composition of 88 to 92% tin and 8 to 12% lead, and therefore has a melting point of about 220°C and is easily melted. become.
このように、内部電極２外部電極３と金属キャップ５と
を結合させている半田４が溶融し半田４が移動すること
により完成品、初期状態の密封度が失われ、内部電極２
と外部電極３との間の特性劣化によるコンデンサの短絡
等の使用状態での電気的特性の経時−劣化を起こす恐れ
があるという問題点があった。In this way, the solder 4 that connects the internal electrode 2, external electrode 3, and metal cap 5 melts and moves, causing the completed product to lose its initial sealing quality, and the internal electrode 2
There is a problem in that the electrical characteristics may deteriorate over time during use, such as short circuiting of the capacitor due to deterioration of the characteristics between the capacitor and the external electrode 3.
また、半田溶融により、金属キャップ５と保護膜７との
間（第３図において符号Ｘで示す部分）に空隙が発生し
た場合には、湿度等による特性劣化を起こす恐れがある
という問題点があった。Furthermore, if a void is generated between the metal cap 5 and the protective film 7 (the part indicated by the symbol X in FIG. 3) due to solder melting, there is a problem that the characteristics may deteriorate due to humidity, etc. there were.
本発明は、かかる従来の問題点に鑑み、プリント基板を
半田浸漬した場合においても、回路基板上において電気
的特性の経時劣化を生じることなく良好かつ直接装着す
ることができる筒型セラミックコンデンサを提供するこ
とを目的とする。In view of such conventional problems, the present invention provides a cylindrical ceramic capacitor that can be mounted satisfactorily and directly on a circuit board without deterioration of electrical characteristics over time even when the printed circuit board is dipped in solder. The purpose is to
（問題点を解決するための手段）
この発明は、筒型セラミック素体、筒型セラミンク素体
の内周面から一端面を経て外周面の一部まで連続的に設
けられた内部電極と、前記内周面上の内部電極に対向さ
せてセラミック素体の外周面に設けられた外部電極とか
ら成る筒型セラミックコンデンサ素子に、端子機能を有
する一対の略コツプ状金属キャップを嵌着し、さらに、
前記一対の金属キャップを前記内部電極と外部電極とに
それぞれ半田で結合させる構造の筒型セラミックコンデ
ンサにおいて、前記一対の金属キャップの内外周面に錫
８〜３０％：鉛７０〜９２％の組成となるように形成さ
れた第一の半田メッキ層を施し、しかる後、金属キャッ
プ外周表面部分に施した第一の半田メッキ層を剥離させ
、さらに、該金属キャップ外周表面部分に、錫８８〜９
２％：鉛８〜１２％の組成となるように形成された第二
の半田メッキ層を施したことを特徴とする筒型セラミッ
クコンデンサの構造となしたものである。(Means for Solving the Problems) The present invention provides a cylindrical ceramic element body, an internal electrode that is continuously provided from the inner peripheral surface of the cylindrical ceramic element body to a part of the outer peripheral surface via one end surface, A pair of substantially pot-shaped metal caps having a terminal function are fitted onto a cylindrical ceramic capacitor element comprising an internal electrode on the inner peripheral surface and an external electrode provided on the outer peripheral surface of the ceramic body in opposition to the internal electrode on the inner peripheral surface, moreover,
In the cylindrical ceramic capacitor having a structure in which the pair of metal caps are connected to the inner electrode and the outer electrode by solder, respectively, a composition of 8 to 30% tin: 70 to 92% lead is provided on the inner and outer peripheral surfaces of the pair of metal caps. After that, the first solder plating layer formed on the outer circumferential surface of the metal cap is peeled off, and further, tin 88~ is applied on the outer circumferential surface of the metal cap. 9
This is a cylindrical ceramic capacitor characterized by having a second solder plating layer formed to have a composition of 8 to 12% lead.
（作用）
この発明においては、略コツプ状金属キャップの内周面
に施される第一の半田メッキ層が錫８〜３０％：鉛７０
〜９２％の組成とされているため該第一の半田メッキ層
の融点は約２８０°Ｃである。(Function) In the present invention, the first solder plating layer applied to the inner circumferential surface of the substantially pot-shaped metal cap is made of 8 to 30% tin: 70% lead.
Since the composition is 92%, the melting point of the first solder plating layer is about 280°C.
このため、本筒型セラミックコンデンサをプリント基板
に装着させ約２４０°Ｃ〜２６０°Ｃの温度で半田浸漬
を行った場合においても、セラミックコンデンサ素体と
金属キャンプとを結合させている第一の半田メッキ層が
溶融することはなく、完成品、初期状態の密封度が保た
れ使用状態における電気的特性の経時劣化を防止するこ
とができる。Therefore, even when a cylindrical ceramic capacitor is mounted on a printed circuit board and soldered at a temperature of about 240°C to 260°C, the first The solder plating layer does not melt, and the sealing degree of the finished product and initial state is maintained, and deterioration of electrical characteristics over time during use can be prevented.
尚、第一の半田メッキ層を施した後に、金属キャ；ンプ
外周表面部分に施した第一の半田メッキ層を剥離させ、
さらに、該金属キャップ外周表面部分に、錫８８〜９２
％：鉛８〜１２％の組成となるように形成された第二の
半田をアフターメッキしているため、該第二の半田メッ
キ層の融点は約２２０°Ｃとなり、容易に溶融されるた
め半田濡れ性は確保される。In addition, after applying the first solder plating layer, the first solder plating layer applied to the outer peripheral surface of the metal cap is peeled off,
Furthermore, tin 88 to 92 is added to the outer peripheral surface of the metal cap.
%: Because the second solder formed to have a composition of 8 to 12% lead is after-plated, the melting point of the second solder plating layer is approximately 220°C, and it is easily melted. Solder wettability is ensured.
（実施例） 以下本発明の実施例を図面を参照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図、第２図は本発明に係る筒型セラミックコンデン
サ及びその製造方法を説明するためのものであって、第
１図は完成した筒型セラミックコンデンサ１０を示し、
第２図は電極が設けられたコンデンサ素子１２を示すも
のである。1 and 2 are for explaining the cylindrical ceramic capacitor and the manufacturing method thereof according to the present invention, and FIG. 1 shows a completed cylindrical ceramic capacitor 10,
FIG. 2 shows a capacitor element 12 provided with electrodes.
コンデンサ素子１２は、第２図に示すように、筒型セラ
ミック素体１４の内周面１６から一端面１８を経て外周
面２０の一部まで連続的に内部電極２２を設け、且つ、
前記内周面１６上の内部電極２２に対向させてセラミッ
ク素体１４の外周面１６に外部電極２４を設けたもので
ある。As shown in FIG. 2, the capacitor element 12 has an internal electrode 22 continuously provided from the inner circumferential surface 16 of the cylindrical ceramic body 14 to a part of the outer circumferential surface 20 via one end surface 18, and
An external electrode 24 is provided on the outer circumferential surface 16 of the ceramic body 14 to face the internal electrode 22 on the inner circumferential surface 16 .
この実施例においては、筒型セラミック素体１４の両端
部１４ａ、１４ｂが丸みを有するように研磨されており
、これにより、内部電極２２の導出部２２ａに至る金属
層の厚みが均一になるとともに金属キャップ２６の嵌着
を容易に行うことができる。In this embodiment, both end portions 14a and 14b of the cylindrical ceramic body 14 are polished to have roundness, thereby making the thickness of the metal layer reaching the lead-out portion 22a of the internal electrode 22 uniform, and The metal cap 26 can be easily fitted.
内部電極２２と外部電極２４は、各々ミ銀、銅、ニッケ
ル等により形成されており、内部電極２２と外部電極２
４の対向面で静電容量を得ている。The internal electrode 22 and the external electrode 24 are each made of silver, copper, nickel, etc.
Capacitance is obtained on the opposing surfaces of 4.
金属キャップ２６は、セラミツク素体１４両端部に嵌着
されることにより端子機能を有するように構成されてい
る。The metal cap 26 is configured to have a terminal function by being fitted onto both ends of the ceramic body 14.
金属キャップ２６は、鉄板又は真鍮等をプレス加工する
ことにより筒部２８と閉塞部３０とを有する略コツプ状
に形成されており、さらに、該閉塞部３０内周面には、
セラミック素体１４に形成された内部電極２２と外部電
極２４との嵌着強度を向上させるための突出部３２が形
成されている。The metal cap 26 is formed into a substantially cup-shaped shape having a cylindrical portion 28 and a closing portion 30 by pressing an iron plate, brass, etc., and further includes a hole on the inner peripheral surface of the closing portion 30.
A protrusion 32 is formed to improve the strength of the fit between the internal electrode 22 and the external electrode 24 formed on the ceramic body 14.
金属キャップ２６の内周面２６ａには、錫が少なくとも
半田メッキ層３４全体の８〜３０％の組成で鉛が少なく
とも半田メッキ層全体の７０〜９２％の組成となるよう
に形成された第一の半田メッキ層３４が３〜１０μｍ施
されている。On the inner circumferential surface 26a of the metal cap 26, a first layer is formed so that the composition of tin is at least 8 to 30% of the entire solder plating layer 34, and the composition of lead is at least 70 to 92% of the entire solder plating layer. A solder plating layer 34 having a thickness of 3 to 10 μm is applied.
本実施例に係る筒型セラミックコンデンサＩＯの製造は
、まず、前記のように構成された筒型セラミックコンデ
ンサ素子１２に一対の略コツプ状金属キャップ２６を嵌
着させる。To manufacture the cylindrical ceramic capacitor IO according to the present embodiment, first, a pair of substantially pot-shaped metal caps 26 are fitted onto the cylindrical ceramic capacitor element 12 configured as described above.
嵌着が終了したら、つぎに約２６０°Ｃ〜２９００Ｃで
約２分間の加熱処理を行うことにより第一の半田メッキ
層３４が内外周面に施された金属キャップ２６と、内部
電極２２と外部電極２４とをそれぞれ半田結合させる。After the fitting is completed, heat treatment is performed at approximately 260° C. to 2900° C. for approximately 2 minutes to bond the metal cap 26 with the first solder plating layer 34 applied to the inner and outer peripheral surfaces, the internal electrode 22, and the external surface. The electrodes 24 are respectively soldered together.
半田付終了後、これを半田融点以下の約１５０００で約
２分間加熱し、加熱した状態でエボーキシ等の熱硬化性
樹脂の粉末に接触させ、該樹脂の粉末を金属キャップ２
６を除いた外周面に被着させ、しかる後、約１５０℃、
約２０分の加熱処理で樹脂被覆膜３６を形成する。After soldering, this is heated at about 15,000 ℃ below the solder melting point for about 2 minutes, and in the heated state is brought into contact with a thermosetting resin powder such as eboxy, and the resin powder is attached to the metal cap 2.
Coat it on the outer peripheral surface except for 6, and then heat it at about 150°C.
A resin coating film 36 is formed by heat treatment for about 20 minutes.
つぎに、脱脂作業を行った後、前記金属キャップ２６外
周表面部分２６ｂに施されている第一の半田メッキ層３
４を半田剥離液を用いて剥離させる。Next, after degreasing, the first solder plating layer 3 applied to the outer peripheral surface portion 26b of the metal cap 26 is removed.
4 is removed using a solder remover.
尚、この半田剥離液を用いた剥離作業は約１０分間行う
。Note that the stripping operation using this solder stripping liquid is performed for about 10 minutes.
しかる後、洗浄を行い、３％の塩酸溶液による処理後、
第一の半田メッキ層３４が剥離された金属キャップ２６
外周表面部分２６ｂに、錫が少なくとも半田メッキ層３
８全体の８８〜９２％の組成で鉛が少なくとも半田メッ
キ層全体の８〜１２％の組成となるように形成された第
二の半田メッキ層３８を施す。After that, it was washed and treated with a 3% hydrochloric acid solution.
Metal cap 26 from which first solder plating layer 34 has been peeled off
At least a solder plating layer 3 of tin is formed on the outer peripheral surface portion 26b.
A second solder plating layer 38 is formed such that lead is at least 88 to 92% of the total composition of the solder plating layer.
つぎに、洗浄を行い、５０℃５％の第３リン酸ソーダを
用いて約３分間後処理を行うことにより本筒型セラミッ
クコンデンサ１０の製造が終了する。Next, the manufacturing of the cylindrical ceramic capacitor 10 is completed by cleaning and post-treatment for about 3 minutes using 5% tertiary sodium phosphate at 50°C.
尚、従来の筒型セラミックコンデンサと本実施例に係る
筒型セラミックコンデンサとの基板装着半田７０−後に
おける特殊試験結果は、従来の筒型セラミックコンデン
サの場合、絶縁抵抗不具合率２００ｐｐｍであったが、
本実施例においては絶縁抵抗不具合は皆無であった。Note that the results of a special test after 70 days of board mounting soldering between a conventional cylindrical ceramic capacitor and a cylindrical ceramic capacitor according to this example showed that the insulation resistance failure rate was 200 ppm in the case of the conventional cylindrical ceramic capacitor. ,
In this example, there were no insulation resistance problems.
また、本実施例は、キャップリード付き筒型セラミック
コンデンサにおいても同様に適用することが可能である
。Further, this embodiment can be similarly applied to a cylindrical ceramic capacitor with a cap lead.
（発明の効果）
本発明は上記のように構成されているため以下に記載す
るような効果を有する。(Effects of the Invention) Since the present invention is configured as described above, it has the following effects.
■この発明においては、略コツプ状金属キャップ２６の
内周面２６ａに施される第一の半田メンキ層３４が錫８
〜３０％：鉛７０〜９２％の組成とされているため該第
−の半田メッキ層の融点が約２８０°Ｃとなり、完成し
た筒型セラミックコンデンサ１０をプリント基板に装着
させて半田浸漬を行う場合の温度より高くなるため、コ
ンデンサ素子１２と金属キャップ２６とを結合させてい
る第一の半田メッキ層３４が溶融することはなく、完成
品初期状態の密封度が保たれ使用状態における電気的特
性の経時劣化を防止することができるという優れた効果
を有する。(2) In this invention, the first solder coating layer 34 applied to the inner circumferential surface 26a of the substantially pot-shaped metal cap 26 is made of tin 8
~30%: Since the composition is 70 to 92% lead, the melting point of the second solder plating layer is approximately 280°C, and the completed cylindrical ceramic capacitor 10 is mounted on a printed circuit board and dipped in solder. Since the temperature is higher than the temperature at which the capacitor element 12 and the metal cap 26 are connected, the first solder plating layer 34 that connects the capacitor element 12 and the metal cap 26 does not melt, and the initial sealing level of the finished product is maintained and electrical resistance is maintained during use. It has an excellent effect of being able to prevent deterioration of characteristics over time.
■また、この発明においては、金属キャップ２６に施さ
れている第一の革田メンキ層３４が溶融されないため、
完成品の密封度が失われず金属キャップ２６と樹脂被覆
膜３６との間に空隙が発生することはなく湿度等による
特性劣化を起こすことがないという優れた効果を有する
。■Also, in this invention, since the first leather coating layer 34 applied to the metal cap 26 is not melted,
This has an excellent effect in that the sealing degree of the finished product is not lost, no voids are generated between the metal cap 26 and the resin coating film 36, and the characteristics do not deteriorate due to humidity or the like.
■また、この発明においては、第一の半田メンキ層を施
した後に、金属キャップ外周表面部分に施した第一の半
田メッキ層を剥離させ、さらに、該金属ギヤング外周表
面部分に、錫８８〜９２％：鉛８〜１２％の組成となる
ように形成された第二の半田をアフターメンキしている
ため、半田濡れ性については該第二の半田メッキ層３８
により確保可能である。(2) In addition, in this invention, after applying the first solder plating layer, the first solder plating layer applied to the outer peripheral surface of the metal cap is peeled off, and further, tin 88~ 92%: Since the second solder formed to have a composition of 8 to 12% lead is after-plated, the solder wettability is lower than that of the second solder plating layer 38.
This can be ensured by
第１図は本発明に係る完成した筒型セラミックコンデン
サの断面図、第２図は電極が設けられたコンデンサ素子
の断面図、第３図は従来の筒型セラミックコンデンサの
断面図である。
ｌＯ・・・筒型セラミックコンデンサ、１２・・・コン
デンサ素子、１４・・・筒型セラミック素体、２２・・
・内部電極、２４・・・外部電極、３４・・・第一の半
田メンキ層、３８・・・第二の半田メッキ層。FIG. 1 is a sectional view of a completed cylindrical ceramic capacitor according to the present invention, FIG. 2 is a sectional view of a capacitor element provided with electrodes, and FIG. 3 is a sectional view of a conventional cylindrical ceramic capacitor. lO... Cylindrical ceramic capacitor, 12... Capacitor element, 14... Cylindrical ceramic element body, 22...
- Internal electrode, 24... External electrode, 34... First solder plating layer, 38... Second solder plating layer.
Claims (1)
面から一端面を経て外周面の一部まで連続的に設けられ
た内部電極と、前記内周面上の内部電極に対向させてセ
ラミック素体の外周面に設けられた外部電極とから成る
筒型セラミックコンデンサ素子に、端子機能を有する一
対の略コップ状金属キャップを嵌着し、さらに、前記一
対の金属キャップを前記内部電極と外部電極とにそれぞ
れ半田で結合させる構造の筒型セラミックコンデンサに
おいて、前記一対の金属キャップの内外周面に錫８〜３
０％：鉛７０〜９２％の組成となるように形成された第
一の半田メッキ層を施し、しかる後、金属キャップ外周
表面部分に施した第一の半田メッキ層を剥離させ、さら
に、該金属キャップ外周表面部分に、錫８８〜９２％：
鉛８〜１２％の組成となるように形成された第二の半田
メッキ層を施したことを特徴とする筒型セラミックコン
デンサ。(1) A cylindrical ceramic body, an internal electrode provided continuously from the inner circumferential surface of the cylindrical ceramic body through one end surface to a part of the outer circumferential surface, and facing the internal electrode on the inner circumferential surface. A pair of approximately cup-shaped metal caps having a terminal function are fitted onto a cylindrical ceramic capacitor element consisting of an external electrode provided on the outer circumferential surface of a ceramic body, and the pair of metal caps are further connected to the internal electrode. In a cylindrical ceramic capacitor having a structure in which the metal caps are connected to an external electrode by soldering, 8 to 3 tin is added to the inner and outer circumferential surfaces of the pair of metal caps.
0%: A first solder plating layer formed to have a composition of 70 to 92% lead is applied, and then the first solder plating layer applied to the outer peripheral surface of the metal cap is peeled off. 88-92% tin on the outer surface of the metal cap:
A cylindrical ceramic capacitor characterized by having a second solder plating layer formed to have a composition of 8 to 12% lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25669289A JPH03116917A (en) | 1989-09-29 | 1989-09-29 | Cylindrical ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25669289A JPH03116917A (en) | 1989-09-29 | 1989-09-29 | Cylindrical ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03116917A true JPH03116917A (en) | 1991-05-17 |
| JPH0529298B2 JPH0529298B2 (en) | 1993-04-30 |
Family
ID=17296153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25669289A Granted JPH03116917A (en) | 1989-09-29 | 1989-09-29 | Cylindrical ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116917A (en) |
-
1989
- 1989-09-29 JP JP25669289A patent/JPH03116917A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529298B2 (en) | 1993-04-30 |
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