JPH0311620A - Boat loader of heat treatment furnace for semiconductor wafer - Google Patents
Boat loader of heat treatment furnace for semiconductor waferInfo
- Publication number
- JPH0311620A JPH0311620A JP14635989A JP14635989A JPH0311620A JP H0311620 A JPH0311620 A JP H0311620A JP 14635989 A JP14635989 A JP 14635989A JP 14635989 A JP14635989 A JP 14635989A JP H0311620 A JPH0311620 A JP H0311620A
- Authority
- JP
- Japan
- Prior art keywords
- boat
- semiconductor wafers
- heat treatment
- semiconductor wafer
- suspension jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000010438 heat treatment Methods 0.000 title claims description 12
- 235000012431 wafers Nutrition 0.000 claims abstract description 21
- 239000000725 suspension Substances 0.000 claims abstract description 10
- 238000010276 construction Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体ウェハ製造工程に使用される縦型熱処理
炉内にボートを出し入れする半導体ウェハ熱処理炉用ボ
ートローダに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a boat loader for a semiconductor wafer heat treatment furnace that loads and takes out a boat into a vertical heat treatment furnace used in a semiconductor wafer manufacturing process.
従来、この種のボートローダは第2図の斜視図に示すよ
うに構成されていた。被熱処理品の半導体ウェハ]はホ
ー1へ2に刻まれたスリット上に水平かつ平行に置かれ
保持され、このホード2はバッフル板8を介してキャッ
プ4上に置かれ、上部には熱処理炉である反応管6及び
ヒーター7が設ζフられていた。又、キャップ4が上下
動機構部5により上下し、被熱処理品である半導体ウェ
ハ1は、熱処理炉内の処理位置に出し入れされるように
なっていた。Conventionally, this type of boat loader has been constructed as shown in the perspective view of FIG. Semiconductor wafers to be heat-treated are placed and held horizontally and parallelly on slits cut into holes 1 and 2, and this hood 2 is placed on a cap 4 via a baffle plate 8, and a heat treatment furnace is installed in the upper part. A reaction tube 6 and a heater 7 were installed. Further, the cap 4 is moved up and down by the vertical movement mechanism 5, and the semiconductor wafer 1, which is the product to be heat-treated, is taken in and out of the processing position in the heat-treating furnace.
一般的に熱処理炉に使用されるホード3.バッフル板8
.キャブ14フ反応管6等は、耐熱性で且つ純度を要求
されるため高純度石英製のものが用いられている。上述
した従来のボートローダのボート2.バッフル板8.キ
ャップ6は積み重ねの構造となっており、転倒しないよ
うホード2の垂直度を維持するためには、ボート2.バ
ッフル板8.キャップ4のそれぞれの垂直度平行度に高
い精度が必要であっ/ご3゜
また、一般的に熱処理温度は、石英の安全使用温度のう
ちの最高温度付近にて使用するため、長期間の使用にて
変形し、かつボート2.バッフル板8.キャップ4は積
み重ね構造のため、半導体ウェハ1.ボート2の重さが
バッフル板8にかかっており、バッフル板8のわずかな
変形により、ボート2の先端部の位置が極端に変わり、
ひいては半導体ウェハ1が水平でなくなる、また、ボー
ト2が倒れ易くなる等の欠点があった。Horde commonly used in heat treatment furnaces3. Baffle plate 8
.. The cab 14, reaction tube 6, etc. are required to be heat resistant and pure, and are therefore made of high-purity quartz. Boat of the above-mentioned conventional boat loader 2. Baffle plate 8. The caps 6 have a stacking structure, and in order to maintain the verticality of the hoard 2 to prevent it from tipping over, the caps 6 have to be stacked to prevent the boat 2. Baffle plate 8. High precision is required for the perpendicularity and parallelism of each of the caps 4. In addition, since the heat treatment temperature is generally around the highest safe operating temperature for quartz, it is difficult to use it for a long time. , and the boat 2. Baffle plate 8. Since the cap 4 has a stacked structure, the semiconductor wafer 1. The weight of the boat 2 is placed on the baffle plate 8, and due to the slight deformation of the baffle plate 8, the position of the tip of the boat 2 changes drastically.
As a result, the semiconductor wafers 1 are no longer horizontal, and the boat 2 tends to fall over.
本発明は、半導体ウェハを水平かつ平行に保持したボー
トを上下動fi構により縦型熱処理炉内に出し入れする
半導体ウェハ熱処理炉用ボートローダにおいて、前記ボ
ートを懸垂させる懸垂治具を前記上下動機構に取り付け
た半導体ウェハ熱処理用ボートローダである。The present invention provides a boat loader for a semiconductor wafer heat treatment furnace in which a boat holding semiconductor wafers horizontally and in parallel is loaded into and taken out of a vertical heat treatment furnace by a vertical movement mechanism, in which a suspension jig for suspending the boat is connected to the vertical movement mechanism. This is a boat loader for semiconductor wafer heat treatment installed on the
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の斜視図である。半導体ウェ
ハ1はボート2に刻まれたスリット上に水平かつ平行に
置かれ保持されている。ボート2は逆V字型の懸垂治具
3に上端にて引掛かかる構造を有しており、懸垂されて
いる。従って従来のバッフル板は不要となる。懸垂治具
3はキャップ4に溶接され、真っ直ぐに立っている。キ
ャップ4は上下動機構部5により上下動し、被熱処理品
である半導体ウェハ1はヒーター7により加熱された反
応管6中に挿入され、また反応管6より弓き出される。FIG. 1 is a perspective view of an embodiment of the present invention. A semiconductor wafer 1 is placed and held horizontally and parallelly on a slit cut in a boat 2. The boat 2 has a structure in which its upper end is hooked onto an inverted V-shaped suspension jig 3, and is suspended. Therefore, the conventional baffle plate is unnecessary. The suspension jig 3 is welded to the cap 4 and stands straight. The cap 4 is moved up and down by a vertical movement mechanism 5, and the semiconductor wafer 1, which is a product to be heat-treated, is inserted into a reaction tube 6 heated by a heater 7, and is ejected from the reaction tube 6.
以上説明したように本発明のボートローダは、半導体ウ
ェハを保持したボートを懸垂治具に懸垂させることによ
り、ボートの自重により常に垂直方向の姿勢を維持する
ことができ、従来のボートローダにおけるボート、バッ
フル板、キャップに要求される高精度を必要とせず、ま
た、熱変形に対して垂直方向に姿勢変形力が働くため、
半導体ウェハの平行度は維持される。ひいては、懸垂治
具、ボート、キャップの使用寿命を充分長くする効果を
有する。As explained above, the boat loader of the present invention suspends the boat holding the semiconductor wafers from the suspension jig, so that it can always maintain a vertical posture due to the boat's own weight. , does not require the high precision required for baffle plates and caps, and since the posture deformation force acts perpendicular to thermal deformation,
The parallelism of the semiconductor wafer is maintained. In turn, this has the effect of sufficiently extending the service life of the suspension jig, boat, and cap.
第1図は本発明の一実施例の斜視図、第2図は従来のボ
ートローダの斜視図である。
1・・・半導体ウェハ、2・・・ボート、3・・・懸垂
治具、4・・・キャップ、5・・・上下動機構部、6・
・・反応管、7・・・ヒーターFIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a perspective view of a conventional boat loader. DESCRIPTION OF SYMBOLS 1... Semiconductor wafer, 2... Boat, 3... Suspension jig, 4... Cap, 5... Vertical movement mechanism part, 6...
...Reaction tube, 7...Heater
Claims (1)
機構により縦型熱処理炉内に出し入れする半導体ウェハ
熱処理炉用ボートローダにおいて、前記ボートを懸垂さ
せる懸垂治具を前記上下動機構に取り付けたことを特徴
とする半導体ウェハ熱処理炉用ボートローダ。In a boat loader for a semiconductor wafer heat treatment furnace, in which a boat holding semiconductor wafers horizontally and in parallel is taken in and out of a vertical heat treatment furnace by a vertical movement mechanism, a suspension jig for suspending the boat is attached to the vertical movement mechanism. Boat loader for semiconductor wafer heat treatment furnaces.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14635989A JPH0311620A (en) | 1989-06-07 | 1989-06-07 | Boat loader of heat treatment furnace for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14635989A JPH0311620A (en) | 1989-06-07 | 1989-06-07 | Boat loader of heat treatment furnace for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0311620A true JPH0311620A (en) | 1991-01-18 |
Family
ID=15405936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14635989A Pending JPH0311620A (en) | 1989-06-07 | 1989-06-07 | Boat loader of heat treatment furnace for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0311620A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030016564A (en) * | 2001-08-21 | 2003-03-03 | 현대자동차주식회사 | Main resonator for vehicles |
JP4769185B2 (en) * | 2004-03-26 | 2011-09-07 | 天馬株式会社 | Assembled container sheet |
-
1989
- 1989-06-07 JP JP14635989A patent/JPH0311620A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030016564A (en) * | 2001-08-21 | 2003-03-03 | 현대자동차주식회사 | Main resonator for vehicles |
JP4769185B2 (en) * | 2004-03-26 | 2011-09-07 | 天馬株式会社 | Assembled container sheet |
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