JPH03116049U - - Google Patents
Info
- Publication number
- JPH03116049U JPH03116049U JP2639090U JP2639090U JPH03116049U JP H03116049 U JPH03116049 U JP H03116049U JP 2639090 U JP2639090 U JP 2639090U JP 2639090 U JP2639090 U JP 2639090U JP H03116049 U JPH03116049 U JP H03116049U
- Authority
- JP
- Japan
- Prior art keywords
- cathode portion
- ceramic package
- dimensional shape
- electroplating jig
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990026390U JPH085560Y2 (ja) | 1990-03-14 | 1990-03-14 | セラミックパッケージ用電気めっき治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990026390U JPH085560Y2 (ja) | 1990-03-14 | 1990-03-14 | セラミックパッケージ用電気めっき治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03116049U true JPH03116049U (US07709020-20100504-C00041.png) | 1991-12-02 |
| JPH085560Y2 JPH085560Y2 (ja) | 1996-02-14 |
Family
ID=31529286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990026390U Expired - Lifetime JPH085560Y2 (ja) | 1990-03-14 | 1990-03-14 | セラミックパッケージ用電気めっき治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085560Y2 (US07709020-20100504-C00041.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001342599A (ja) * | 2000-03-29 | 2001-12-14 | Sanyo Electric Co Ltd | メッキ装置、メッキ方法および半導体装置の製造方法 |
| JP2019214765A (ja) * | 2018-06-12 | 2019-12-19 | 日本特殊陶業株式会社 | 配線基板の製造方法およびこれに用いるメッキ用治具 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101374793B1 (ko) * | 2011-12-16 | 2014-03-17 | 지금강 주식회사 | 플라스틱 전기도금의 버닝 방지용 전극 보조물 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5690545A (en) * | 1979-12-25 | 1981-07-22 | Fujitsu Ltd | Plating method of lead terminal for semiconductor device |
| JPS6097775U (ja) * | 1983-12-07 | 1985-07-03 | 日本特殊陶業株式会社 | メツキ用電気導通ラツク治具 |
-
1990
- 1990-03-14 JP JP1990026390U patent/JPH085560Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5690545A (en) * | 1979-12-25 | 1981-07-22 | Fujitsu Ltd | Plating method of lead terminal for semiconductor device |
| JPS6097775U (ja) * | 1983-12-07 | 1985-07-03 | 日本特殊陶業株式会社 | メツキ用電気導通ラツク治具 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001342599A (ja) * | 2000-03-29 | 2001-12-14 | Sanyo Electric Co Ltd | メッキ装置、メッキ方法および半導体装置の製造方法 |
| JP2019214765A (ja) * | 2018-06-12 | 2019-12-19 | 日本特殊陶業株式会社 | 配線基板の製造方法およびこれに用いるメッキ用治具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085560Y2 (ja) | 1996-02-14 |
