JPH03116043U - - Google Patents
Info
- Publication number
- JPH03116043U JPH03116043U JP1990024780U JP2478090U JPH03116043U JP H03116043 U JPH03116043 U JP H03116043U JP 1990024780 U JP1990024780 U JP 1990024780U JP 2478090 U JP2478090 U JP 2478090U JP H03116043 U JPH03116043 U JP H03116043U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- circuit package
- window
- expose
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990024780U JPH03116043U (enExample) | 1990-03-12 | 1990-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990024780U JPH03116043U (enExample) | 1990-03-12 | 1990-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116043U true JPH03116043U (enExample) | 1991-12-02 |
Family
ID=31527731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990024780U Pending JPH03116043U (enExample) | 1990-03-12 | 1990-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116043U (enExample) |
-
1990
- 1990-03-12 JP JP1990024780U patent/JPH03116043U/ja active Pending