JPH03114162U - - Google Patents
Info
- Publication number
- JPH03114162U JPH03114162U JP2477590U JP2477590U JPH03114162U JP H03114162 U JPH03114162 U JP H03114162U JP 2477590 U JP2477590 U JP 2477590U JP 2477590 U JP2477590 U JP 2477590U JP H03114162 U JPH03114162 U JP H03114162U
- Authority
- JP
- Japan
- Prior art keywords
- rack
- carrier
- cover
- dishwasher
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000004851 dishwashing Methods 0.000 description 1
Landscapes
- Washing And Drying Of Tableware (AREA)
- Warehouses Or Storage Devices (AREA)
- Intermediate Stations On Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990024775U JP2541367Y2 (ja) | 1990-03-12 | 1990-03-12 | ラック受渡し装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990024775U JP2541367Y2 (ja) | 1990-03-12 | 1990-03-12 | ラック受渡し装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03114162U true JPH03114162U (US20030157376A1-20030821-M00001.png) | 1991-11-22 |
| JP2541367Y2 JP2541367Y2 (ja) | 1997-07-16 |
Family
ID=31527727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990024775U Expired - Lifetime JP2541367Y2 (ja) | 1990-03-12 | 1990-03-12 | ラック受渡し装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2541367Y2 (US20030157376A1-20030821-M00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7645514B2 (en) | 2003-01-07 | 2010-01-12 | Sekisui Chemical Co., Ltd. | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5055355U (US20030157376A1-20030821-M00001.png) * | 1973-09-14 | 1975-05-26 | ||
| JPS5515571U (US20030157376A1-20030821-M00001.png) * | 1978-07-18 | 1980-01-31 | ||
| JPS6167663U (US20030157376A1-20030821-M00001.png) * | 1984-10-12 | 1986-05-09 | ||
| JPS62126137U (US20030157376A1-20030821-M00001.png) * | 1986-12-06 | 1987-08-11 | ||
| JPH0172507U (US20030157376A1-20030821-M00001.png) * | 1987-11-02 | 1989-05-16 |
-
1990
- 1990-03-12 JP JP1990024775U patent/JP2541367Y2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5055355U (US20030157376A1-20030821-M00001.png) * | 1973-09-14 | 1975-05-26 | ||
| JPS5515571U (US20030157376A1-20030821-M00001.png) * | 1978-07-18 | 1980-01-31 | ||
| JPS6167663U (US20030157376A1-20030821-M00001.png) * | 1984-10-12 | 1986-05-09 | ||
| JPS62126137U (US20030157376A1-20030821-M00001.png) * | 1986-12-06 | 1987-08-11 | ||
| JPH0172507U (US20030157376A1-20030821-M00001.png) * | 1987-11-02 | 1989-05-16 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7645514B2 (en) | 2003-01-07 | 2010-01-12 | Sekisui Chemical Co., Ltd. | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2541367Y2 (ja) | 1997-07-16 |
