JPH031139A - Production of mask film for three-dimensional printed wiring board - Google Patents
Production of mask film for three-dimensional printed wiring boardInfo
- Publication number
- JPH031139A JPH031139A JP1137041A JP13704189A JPH031139A JP H031139 A JPH031139 A JP H031139A JP 1137041 A JP1137041 A JP 1137041A JP 13704189 A JP13704189 A JP 13704189A JP H031139 A JPH031139 A JP H031139A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- thin film
- resin
- dimensional printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000010408 film Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000010409 thin film Substances 0.000 claims abstract description 18
- 238000007639 printing Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 238000007666 vacuum forming Methods 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、三次元プリント配線板の製造に用いる露光用
マスクフィルムの製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing an exposure mask film used for manufacturing three-dimensional printed wiring boards.
従来の技術及びその問題点
一般に、プリント配線板の製造法としては、銅又は他の
金属を張り合わせた積層板上に、レジストで精密なパタ
ーンを印刷し、レジストで保護されていない金属部分を
化学的にエツチングして、金属パターンを形成する方法
、或いは基板上に、回路部分を除いてレジスト層を形成
した後、回路部分をめっき等の方法で析出させる方法な
どが採用されている。これらのいずれの方法においても
、精密なレジスト層を形成することが必要であり、この
ために、通常レジスト用樹脂として、感光性樹脂を使用
し、この上に精密なマスクパターンを有する露光用のマ
スクフィルムを密着させて、光線（紫外線）によりレジ
スト層を硬化させてレジストパターンを形成する方法が
採用されている。Conventional technology and its problems In general, printed wiring boards are manufactured by printing a precise pattern with a resist on a laminate made of copper or other metals, and then chemically removing the metal parts not protected by the resist. A method of forming a metal pattern by selective etching, or a method of forming a resist layer on the substrate excluding the circuit portion and then depositing the circuit portion by a method such as plating, etc., have been adopted. In any of these methods, it is necessary to form a precise resist layer, and for this purpose, a photosensitive resin is usually used as the resist resin, and a photosensitive resin with a precise mask pattern is used for exposure. A method has been adopted in which a resist pattern is formed by bringing a mask film into close contact with the resist layer and curing the resist layer with light (ultraviolet rays).
そして、通常用いられる平面状のプリント配線板では、
シート状のマスクフィルムを用いることによって、上記
目的が達成されている。In the normally used flat printed wiring board,
The above object has been achieved by using a sheet-like mask film.
近年、電子機器の小型化、軽量化等にともなって、凸面
、凹面、曲面等を有する三次元形状の成形体の凸面、凹
面、曲面等の立体形状を有する部分に、直接配線回路を
形成することが必要とされる場合がある。このような場
合には、回路形成面に適合する露光用マスクフィルムが
必要となるが、従来のシート状マスクフィルムでは、複
雑な形状の成型品に密着させることが困難であり、精密
なレジストパターンを形成することができないという問
題点がある。In recent years, with the miniaturization and weight reduction of electronic devices, wiring circuits have been formed directly on the parts of three-dimensional molded bodies having convex, concave, curved, etc., convex, concave, and curved surfaces. There are times when this is required. In such cases, an exposure mask film that is compatible with the circuit formation surface is required, but with conventional sheet-shaped mask films, it is difficult to adhere to molded products with complex shapes, and it is difficult to make precise resist patterns. The problem is that it cannot be formed.
問題点を解決するための手段
本発明者は、上記した如き問題点に鑑みて、三次元の形
状を有するプリント配線板の製造に適する露光用マスク
フィルムを得るべく鋭意研究を重ねてきた。その結果、
紫外線透過性に優れ、かつ適度の強度及び保形性を有す
る樹脂薄膜上に、印刷法によってマスクパターンを形成
した後、該樹脂薄膜を三次元プリント配線板の回路形成
面に密着し得る形状に成形して成形体とすることによっ
て、従来用いられていない三次元の形状を有する露光用
マスクフィルムを得ることができ、該露ソ１１用三次元
マスクフィルムの使用によって、複雑な形状の成型品に
も、簡単な方法で正確に露光用マスクフィルムを密着さ
せることができ、その結果三次元配線板上に容易に精密
なレジストパターンを形成することが可能となることを
見出した。Means for Solving the Problems In view of the above-mentioned problems, the present inventor has conducted intensive research in order to obtain an exposure mask film suitable for manufacturing a printed wiring board having a three-dimensional shape. the result,
A mask pattern is formed by a printing method on a resin thin film that has excellent ultraviolet transmittance and has appropriate strength and shape retention, and then the resin thin film is shaped so that it can be closely attached to the circuit formation surface of a three-dimensional printed wiring board. By molding into a molded product, it is possible to obtain an exposure mask film having a three-dimensional shape that has not been used conventionally, and by using the three-dimensional mask film for exposure 11, molded products with complex shapes can be obtained. We have also discovered that it is possible to accurately bring the exposure mask film into close contact with a simple method, and as a result, it is possible to easily form a precise resist pattern on a three-dimensional wiring board.
即ち、本発明は、紫外線透過性樹脂薄膜に、印刷法によ
りマスクパターンを形成した後、該樹脂薄膜を三次元プ
リント配線板の回路形成面に密着し得る形状に成形する
ことを特徴とする三次元プリント配線板用マスクフィル
ムの製造法に係る。That is, the present invention provides a three-dimensional 3D printed circuit board characterized in that a mask pattern is formed on an ultraviolet-transparent resin thin film by a printing method, and then the resin thin film is molded into a shape that can be closely attached to the circuit formation surface of a three-dimensional printed wiring board. This relates to a method of manufacturing a mask film for original printed wiring boards.
本発明では、マスクフィルム基体の材料としては、紫外
線透過性に優れた樹脂を用いる。また、該樹脂は、紫外
線の分散が少ないことが好ましく、更に、三次元配線板
の配線面に密着し得る形状を保持するために適度な保形
性を有することも必要である。In the present invention, a resin having excellent ultraviolet transmittance is used as the material for the mask film base. Further, it is preferable that the resin has little dispersion of ultraviolet rays, and furthermore, it is necessary to have appropriate shape retention in order to maintain a shape that can be closely attached to the wiring surface of the three-dimensional wiring board.
本発明での使用に適する樹脂としては、アクリロニトリ
ル−ブタジェン−スチレン樹脂（ＡＢＳ樹脂）、ポリエ
チレンテレフタレート樹脂（ＰＥＴ樹脂）、ポリカーボ
ネート樹脂（ＰＣ樹脂）、アクリル樹脂、不飽和ポリエ
ステル樹脂等を例示できる。Examples of resins suitable for use in the present invention include acrylonitrile-butadiene-styrene resin (ABS resin), polyethylene terephthalate resin (PET resin), polycarbonate resin (PC resin), acrylic resin, and unsaturated polyester resin.
マスクフィルム基体としての樹脂薄膜の厚さは、０．１
〜１．０１程度、好ましくは０．１〜０．６ｍｍ程度が
適当である。樹脂薄膜の膜厚が薄すぎる場合には、強度
が不足して、印刷法によりマスクパターンを形成するこ
とが困難となり、−方膜厚が厚すぎる場合には、樹脂薄
膜の剛性が強くなりすぎて、配線板の配線回路面に密着
させることが困難となり、また材料も無駄となるので好
ましくない。The thickness of the resin thin film as the mask film base is 0.1
Approximately 1.01 to 1.01 mm, preferably 0.1 to 0.6 mm. If the resin thin film is too thin, the strength will be insufficient and it will be difficult to form a mask pattern using the printing method, and if the resin film is too thick, the resin thin film will become too rigid. This is not preferable, since it becomes difficult to adhere closely to the wiring circuit surface of the wiring board, and material is also wasted.
本発明方法では、まず、紫外線透過性樹脂薄膜上に、印
刷法によりマスクパターンを形成する。In the method of the present invention, first, a mask pattern is formed on an ultraviolet-transparent resin thin film by a printing method.
印刷法としては、特に限定はなく、各種の公知の方法を
採用できるが、特に、スクリーン印刷法によれば、緻密
なマスクパターンを正確に形成することが可能である。The printing method is not particularly limited and various known methods can be employed, but screen printing in particular makes it possible to accurately form a dense mask pattern.
マスクパターン形成に用いるインクとしては特に限定は
なく、通常のプリント配線基板製造時に用いられるエツ
チングレジストインク、めっきレジストインクのうち、
紫外線遮蔽効果の高いインクで、樹脂薄膜に充分密着す
るものであればどれでもよい。−例として、山栄化学■
製しノジストインク５ＥＲ４２０Ｃ−０２が例示される
。更に、これら以外に、銀、銅等を含んだ金属ペースト
、カーボンペースト、一般塗料等のうちで、紫外線遮蔽
効果が高く、更に、印刷可能であり、かつ基体樹脂との
密着性に優れたものであれば、いずれもマスクパタニン
形成用インクとして使用できる。There are no particular limitations on the ink used for mask pattern formation, and among the etching resist ink and plating resist ink used in normal printed wiring board manufacturing,
Any ink that has a high ultraviolet shielding effect and that adheres sufficiently to the resin thin film may be used. -For example, Sanei Chemical ■
An example is Nosist Ink 5ER420C-02. Furthermore, in addition to these, among metal pastes containing silver, copper, etc., carbon pastes, general paints, etc., those that have a high ultraviolet shielding effect, are printable, and have excellent adhesion to the base resin. If so, any of them can be used as an ink for forming a mask pattern.
マスクパターンを印刷した後、用いたインクの種類に応
じた硬化法、例えば常温乾燥、加熱硬化、紫外線硬化な
どの各種の方法によって、インクを硬化させてマスクパ
ターンを形成する。尚、マスクパターン印刷後の成形工
程における加熱等によって、硬化されるインクについて
は、成形前の硬化工程は特に必要ではない。After printing the mask pattern, the ink is cured to form a mask pattern using various curing methods depending on the type of ink used, such as room temperature drying, heat curing, and ultraviolet curing. Note that for ink that is cured by heating or the like in the molding process after printing the mask pattern, a curing process before molding is not particularly necessary.
マスクパターンの厚さは、通常、５〜２０ Ｉｔ ｍ程
度とすればよい。The thickness of the mask pattern may normally be about 5 to 20 m.
紫外線透過性樹脂薄膜上にマスクパターンを形成した後
、該樹脂薄膜を三次元プリント配線板の回路形成面に正
確に密着できるように、回路形成面の形状に一致した形
状に成形する。即ち、三次元成形体の凹面に配線回路を
形成する場合には、この凹面に密着し得る凸条のマスク
フィルム基体を作製する。成形法は特に限定はな（、使
用する樹脂の種類に応じて、各種の公知の方法を採用で
きるが、特に真空成形法が好ましく、三次元配線板自体
の成形用に用いる金型を利用することによって、配線板
の回路形成面に密着し得る形状のマスクフィルム基体を
容易に作製することができる。After a mask pattern is formed on the ultraviolet-transparent resin thin film, the resin thin film is molded into a shape that matches the shape of the circuit-forming surface of the three-dimensional printed wiring board so that it can be accurately adhered to the circuit-forming surface of the three-dimensional printed wiring board. That is, when forming a wiring circuit on a concave surface of a three-dimensional molded body, a mask film base with convex stripes that can be closely attached to this concave surface is prepared. The molding method is not particularly limited (various known methods can be used depending on the type of resin used, but a vacuum molding method is particularly preferred, and a mold used for molding the three-dimensional wiring board itself is used. By doing so, it is possible to easily produce a mask film base having a shape that can be brought into close contact with the circuit forming surface of the wiring board.
また、真空成形法によれば、成形時に、マスクパターン
のパターン切れが生じ難いという利点もある。更に、加
熱硬化性のインクを用いる場合には、真空成形と同時に
マスクパターンを硬化させることも可能である。Further, the vacuum forming method has the advantage that pattern breakage of the mask pattern is less likely to occur during forming. Furthermore, when using heat-curable ink, it is also possible to cure the mask pattern simultaneously with vacuum forming.
本発明方法によって得られる露光用マスクフィルムは、
三次元プリント配線板の回路形成面に簡単に密着させる
ことができ、該三次元プリント配線板の回路形成面にレ
ジスト層を設ける際に、露光用マスクフィルムとして有
効に使用することができる。The exposure mask film obtained by the method of the present invention is
It can be easily brought into close contact with the circuit-forming surface of a three-dimensional printed wiring board, and can be effectively used as a mask film for exposure when providing a resist layer on the circuit-forming surface of the three-dimensional printed wiring board.
発明の効果
本発明方法により三次元プリント配線板の回路形成面に
密着し得る形状に成形して得られる露光用マスクフィル
ムは、従来全く用いられていない三次元の形状を有する
ものであり、複雑な形状の成型品に対しても、極めて簡
単かつ正確に密着させることができ、しかも印刷法によ
り形成される精密なマスクパターンを有するものである
。該マスクフィルムは、繰り返し使用可能であり、三次
元プリント配線板上にレジストパターンを形成する際に
、露光用マスクフィルムとして有効に利用できる。Effects of the Invention The exposure mask film obtained by forming the film into a shape that can be closely attached to the circuit forming surface of a three-dimensional printed wiring board by the method of the present invention has a three-dimensional shape, which has not been used in the past, and is complex. It can be extremely easily and precisely attached to molded products of various shapes, and has a precise mask pattern formed by a printing method. The mask film can be used repeatedly and can be effectively used as a mask film for exposure when forming a resist pattern on a three-dimensional printed wiring board.
実施例 以下、実施例を示して本発明を更に詳細に説明する。Example Hereinafter, the present invention will be explained in more detail by showing examples.
実施例１
ポリエチレンテレフタレート樹脂（ＰＥＴ）製の箱状の
成形体の内面に配線パターンを形成するために用いる露
光用三次元マスクフィルムを以下の方法によって作製し
た。Example 1 A three-dimensional mask film for exposure used to form a wiring pattern on the inner surface of a box-shaped molded body made of polyethylene terephthalate resin (PET) was produced by the following method.
まず、厚さ０．１ａｍのポリカーボネート樹脂フィルム
に、レジストインク（山栄化学■製、５ＥＲ４２０Ｃ−
０２）を用いて、スクリーン印刷法により、膜厚１０〜
１５μｍのマスクパターンを形成した。次いで、これを
常温乾燥した後、真空成形法によって、１９０℃の加熱
下で上記ＰＥＴ成形体の内面に密着し得る形状に成形し
た。First, resist ink (manufactured by Sanei Chemical Co., Ltd., 5ER420C-
02), a film thickness of 10~
A 15 μm mask pattern was formed. Next, after drying this at room temperature, it was molded by a vacuum forming method under heating at 190° C. into a shape that could be closely attached to the inner surface of the above-mentioned PET molded product.
得られたマスクフィルムは、ＰＥＴ樹脂製成形体の配線
回路形成面に容易に密着し得る形状を有し、かつ精密な
マスクパターンを有するものであった。The obtained mask film had a shape that could be easily adhered to the wiring circuit forming surface of the PET resin molded body and had a precise mask pattern.
（以 上）(that's all)
Claims (2)
ターンを形成した後、該樹脂薄膜を三次元プリント配線
板の回路形成面に密着し得る形状に成形することを特徴
とする三次元プリント配線板用マスクフィルムの製造法
。(1) Three-dimensional printed wiring characterized by forming a mask pattern on an ultraviolet-transparent resin thin film by a printing method, and then molding the resin thin film into a shape that can be closely attached to the circuit forming surface of a three-dimensional printed wiring board. Manufacturing method for mask film for plates.
によって成形する請求項１に記載の三次元プリント配線
板用マスクフィルムの製造法。(2) The method for producing a mask film for a three-dimensional printed wiring board according to claim 1, wherein the thin resin film on which the mask pattern is formed is formed by vacuum forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1137041A JPH031139A (en) | 1989-05-29 | 1989-05-29 | Production of mask film for three-dimensional printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1137041A JPH031139A (en) | 1989-05-29 | 1989-05-29 | Production of mask film for three-dimensional printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031139A true JPH031139A (en) | 1991-01-07 |
Family
ID=15189482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1137041A Pending JPH031139A (en) | 1989-05-29 | 1989-05-29 | Production of mask film for three-dimensional printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031139A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6325954B1 (en) | 1998-06-05 | 2001-12-04 | Toshiba Kikai Kabushiki Kaisha | Method of controlling electric injection unit of injection molding machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427368A (en) * | 1977-08-03 | 1979-03-01 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of microwave circuit pattern |
| JPS62128591A (en) * | 1985-11-29 | 1987-06-10 | 凸版印刷株式会社 | Solid molded product which has printed wiring on the surface |
| JPH02287354A (en) * | 1989-04-27 | 1990-11-27 | Koa Corp | Conductor pattern forming method |
-
1989
- 1989-05-29 JP JP1137041A patent/JPH031139A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427368A (en) * | 1977-08-03 | 1979-03-01 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of microwave circuit pattern |
| JPS62128591A (en) * | 1985-11-29 | 1987-06-10 | 凸版印刷株式会社 | Solid molded product which has printed wiring on the surface |
| JPH02287354A (en) * | 1989-04-27 | 1990-11-27 | Koa Corp | Conductor pattern forming method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6325954B1 (en) | 1998-06-05 | 2001-12-04 | Toshiba Kikai Kabushiki Kaisha | Method of controlling electric injection unit of injection molding machine |
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